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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL01GS12TFIV10

Name: S29GL01GS12TFIV10
Brand: Infineon Technologies
SKU: S29GL01GS12TFIV10
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL01GS12TFIV10

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 56-TFSOP (0.724", 18.40mm Width)

Datasheet:: S29GL01GS12TFIV10.pdf

Description:: IC FLASH 1GBIT PARALLEL 56TSOP

Quantity:: RFQ Add To RFQ list

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Product details

Overview

S29GL01GS12TFIV10 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC with 16-bit data bus, 3.0 V core supply (2.7–3.6 V), 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. It operates across industrial temperature range (–40°C to +85°C) and supports sector erase of uniform 128-kbyte sectors in embedded boot code storage applications.

For engineers reviewing the S29GL01GS12TFIV10 datasheet, S29GL01GS12TFIV10 pinout, S29GL01GS12TFIV10 application, or S29GL01GS12TFIV10 equivalent, key selection criteria include asynchronous read timing, Versatile I/O voltage range (1.65 V to VCC), 512-byte programming buffer throughput, OTP array configuration, and AEC-Q100 grade compatibility for automotive control modules.

Technical Context

This device implements MIRRORBIT™ Eclipse architecture on 65 nm process, enabling simultaneous storage of two bits per cell while maintaining NOR-like random access. Its embedded algorithm controller (EAC) executes autonomous program/erase operations with suspend/resume capability and status reporting via status register, data polling, or RY/BY# pin.

The flash supports both full-VCC and Versatile I/O modes: in full-VCC mode, VIO = VCC (2.7–3.6 V); in Versatile I/O mode, VIO ranges independently from 1.65 V to VCC, allowing interfacing with mixed-voltage SoCs. Page-mode reads deliver 15 ns access within 32-byte aligned pages, reducing effective latency for sequential instruction fetch.

Key Specifications

Parameter	Value and Actual Design Meaning
Density	1 Gb (128 MB) - supports full boot image storage for high-end microcontrollers and application processors
Random Access Time	90 ns - enables direct XIP execution without external cache penalty in real-time systems
Page Access Time	15 ns - accelerates burst reads of adjacent instructions or constants within same 32-byte page
Programming Buffer	512 bytes - reduces average programming time by batching up to 256 words per command
ECC Support	Hardware single-bit correction - eliminates need for external ECC logic in safety-critical firmware storage
Endurance & Retention	100,000 program/erase cycles / 20 years data retention - meets long-life requirements for industrial gateways and automotive ECUs
Operating Voltage	VCC = 2.7–3.6 V, VIO = 1.65–VCC - allows flexible integration with 1.8 V or 3.3 V host interfaces
Temperature Grade	Industrial (–40°C to +85°C) - qualified for deployment in factory automation controllers and telecom baseband units

Pinout & Package

Package: 56-pin TSOP (Type I, standard thin small outline package, 18.4 mm × 10.16 mm, 0.5 mm pitch).

Pin/Terminal	Circuit Role	Design Meaning
A0–A25	Address inputs	26-bit address bus supporting full 1 Gb addressing (AMAX = A25); word-aligned only
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports 1.65–3.6 V I/O voltage via VIO pin
CE#	Chip enable	Active-low chip select; controls device power state and interface activation
OE#	Output enable	Active-low read strobe; gates output drivers during asynchronous read cycles
WE#	Write enable	Active-low write strobe; initiates internal program/erase commands when CE# and OE# are inactive
RY/BY#	Ready/Busy indicator	Open-drain output signaling active embedded operation (low = busy, high = ready)
RESET#	Hardware reset	Active-low asynchronous reset that halts ongoing operations and returns device to read mode
VCC	Core supply	3.0 V nominal core voltage (2.7–3.6 V); powers logic, charge pumps, and memory array
VIO	I/O supply	Independent I/O voltage rail (1.65–VCC); decouples interface voltage from core supply
WP#	Write protect	Active-low hardware sector protection enable; disables program/erase when asserted

Key Features

Feature	Design Value
Asynchronous page-mode read	15 ns intra-page access enables efficient XIP execution of contiguous code blocks without wait states
512-byte programming buffer	Reduces effective programming time by >3× vs. single-word writes, critical for field firmware updates
Hardware ECC engine	Single-bit error correction performed transparently during read; no CPU overhead or external logic required
Uniform 128-kB sector architecture	Simplifies BOM management and firmware partitioning across multiple product variants with identical sector map
Separate 1024-byte OTP array	Provides secure storage for calibration data, MAC addresses, or cryptographic keys with dual lockable regions
CFI-compliant interface	Enables automatic detection and configuration by bootloader or flash utility software without hard-coded parameters

Applications

Automotive Engine Control Unit (ECU)

Industrial PLC Firmware Storage

Use Scenario: Storing calibrated engine maps, diagnostic routines, and boot firmware in AEC-Q100 grade 3 ECU modules.

IC Role / Device Role / Timing Role: Primary non-volatile boot memory with XIP capability and hardware ECC for ASIL-B functional safety compliance.

Use Value: 90 ns random access ensures deterministic boot timing; 100,000-cycle endurance supports lifetime reprogramming during vehicle service.

Use Scenario: Holding ladder logic runtime images and configuration data in DIN-rail mounted programmable logic controllers.

IC Role / Device Role / Timing Role: Standalone parallel NOR flash providing reliable firmware persistence under wide-temperature industrial conditions.

Use Value: Versatile I/O (1.65–3.6 V) interfaces directly with 3.3 V FPGA or ARM-based control SoCs without level shifters.

Telecom Base Station Boot Memory

Medical Imaging System BIOS Storage

Use Scenario: Hosting boot loader and FPGA configuration bitstreams in LTE/5G remote radio units operating at –40°C to +85°C.

IC Role / Device Role / Timing Role: High-reliability parallel flash with suspend/resume for safe firmware updates during live traffic.

Use Value: Sector erase (128 kB) enables atomic firmware patching; 20-year data retention guarantees long-term field deployment integrity.

Use Scenario: Securing UEFI BIOS and regulatory-critical initialization code in FDA-cleared MRI and CT scanner mainboards.

IC Role / Device Role / Timing Role: Trusted boot memory with OTP region for storing cryptographic root-of-trust keys.

Use Value: Dual-lock OTP prevents unauthorized modification of security credentials; hardware ECC mitigates soft errors in radiation-prone environments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL01GS11TFIV10	Same density and package, but 110 ns random access time (vs. 90 ns) and no AEC-Q100 qualification	Targeted at cost-sensitive industrial applications where tighter timing margins are not required	Select when system clock budget permits longer read latency and automotive qualification is unnecessary
MX29GL128FDTI-90G	Micron 128 Mb part; lacks hardware ECC, OTP array, and Versatile I/O; 90 ns access but smaller capacity	Used in legacy designs requiring pin-compatible drop-in replacement without ECC or OTP features	Choose only if existing design uses MX29GL128F and upgrade path excludes ECC dependency

Compared with S29GL01GS12TFIV10, the S29GL01GS11TFIV10 trades speed and qualification for lower cost, while MX29GL128FDTI-90G offers legacy compatibility at reduced density and feature set-neither provides the combined 1 Gb capacity, hardware ECC, and AEC-Q100 support essential for next-gen automotive and industrial platforms.

Availability

S29GL01GS12TFIV10 is available at Aetrix Electronics and suitable for automotive ECU development, industrial PLC firmware updates, and telecom base station boot memory requiring stable component supply over extended production lifecycles.

Supply support for S29GL01GS12TFIV10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions for mission-critical systems.

The GL-S family targets embedded boot code storage where deterministic XIP performance, long-term data integrity, and automotive-grade reliability converge-designed specifically for ECU, gateway, and industrial controller applications demanding 1 Gb density and hardware ECC.

FAQ

What is the purpose of the Versatile I/O (VIO) pin?

The VIO pin supplies independent voltage to the device's input/output buffers, enabling operation across 1.65 V to VCC. This allows direct interfacing with mixed-voltage SoCs-e.g., a 1.8 V FPGA controlling a 3.3 V core flash-without external level shifters, reducing BOM count and signal integrity risk in compact PCB layouts.

Does S29GL01GS12TFIV10 support execute-in-place (XIP)?

Yes-it supports true XIP via fast random access (90 ns) and page-mode reads (15 ns), allowing microprocessors to fetch and execute code directly from flash without copying to RAM. The 32-byte page alignment and asynchronous interface ensure deterministic timing for real-time interrupt response in safety-critical applications.

How does the hardware ECC function during read operations?

Hardware ECC operates transparently during every read: single-bit errors in a 512-bit word are automatically detected and corrected before data reaches the bus. No software intervention or additional latency is incurred-the correction occurs within the device's read pipeline, preserving timing integrity required for boot ROM and firmware validation sequences.

Can the OTP array be used for secure key storage in cryptographic applications?

Yes-the 1024-byte OTP array includes two independently lockable regions, each programmable once and permanently secured against overwrite. This enables storage of asymmetric key pairs or HMAC secrets used in secure boot chains, with physical one-time locking preventing post-deployment tampering or cloning in medical and automotive systems.

S29GL01GS12TFIV10 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 56-TFSOP (0.724", 18.40mm Width)

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 1Gbit

Memory Organization:: 64M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 120 ns

Voltage - Supply:: 1.65V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 56-TSOP

S29GL01GS12TFIV10 FAQ

1.How can I place an order for S29GL01GS12TFIV10 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL01GS12TFIV10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL01GS12TFIV10 reliable?

The price and inventory of S29GL01GS12TFIV10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GS12TFIV10 is usually 5 days.

3.What payment methods are accepted for S29GL01GS12TFIV10?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GS12TFIV10 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL01GS12TFIV10?

S29GL01GS12TFIV10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL01GS12TFIV10 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL01GS12TFIV10?

For technical support, including S29GL01GS12TFIV10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GS12TFIV10 requirements.

6.How does Aetrix verify that S29GL01GS12TFIV10 is sourced from the original manufacturer or authorized distributors?

All S29GL01GS12TFIV10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GS12TFIV10 meets industry standards.

7.What is the process for return or replacement of S29GL01GS12TFIV10?

All S29GL01GS12TFIV10 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GS12TFIV10, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL01GS12TFIV10 part is unused and in its original packaging.

Return procedure for S29GL01GS12TFIV10:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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