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Infineon Technologies S29GL01GS12TFIV20
- Part No.:
- S29GL01GS12TFIV20
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL01GS12TFIV20.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:4,930
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Product details
Overview
S29GL01GS12TFIV20 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 90 ns random access time and 15 ns page access time, and integrates hardware ECC for single-bit error correction. It is used in boot code storage for industrial microcontrollers requiring fast XIP execution and reliable non-volatile program retention.
For engineers reviewing the S29GL01GS12TFIV20 datasheet, S29GL01GS12TFIV20 pinout, S29GL01GS12TFIV20 application, or S29GL01GS12TFIV20 equivalent, this device supports asynchronous read, sector erase, buffer programming up to 512 bytes, OTP array, CFI compliance, and AEC-Q100 Grade 2 automotive qualification - critical for embedded firmware storage selection.
Technical Context
The S29GL01GS12TFIV20 implements an asynchronous parallel interface with word-aligned addressing (A0–A25), 128 kB uniform sectors, and embedded algorithm controller (EAC) for autonomous program/erase operations. Its Versatile I/O supports VIO from 1.65 V to VCC, enabling interoperability with mixed-voltage SoCs.
It features dual status monitoring via status register, data polling, and RY/BY# pin, plus suspend/resume capability for both program and erase cycles. The integrated ECC engine operates transparently during read, correcting single-bit errors without software intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 1 Gb (128 MB) - supports full firmware images for mid-range MCUs and bootloaders |
| Interface | Parallel ×16 asynchronous - enables direct XIP execution without external translation logic |
| Access Time | 90 ns random / 15 ns page - meets real-time boot latency requirements under worst-case voltage/temperature |
| Programming Buffer | 512-byte write buffer - reduces effective programming time by >4× vs. single-word writes |
| ECC | On-die single-bit correction - eliminates need for external ECC logic or software overhead |
| Endurance & Retention | 100,000 program/erase cycles / 20-year data retention - qualified for long-lifecycle industrial deployments |
| Temperature Grade | AEC-Q100 Grade 2 (–40°C to +105°C) - validated for under-hood automotive control units |
Pinout & Package
Package: 64-ball LAE Fortified BGA (9 mm × 9 mm, 0.8 mm pitch). RoHS-compliant, lead-free, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A25 | Address inputs | 26-bit address bus supporting full 128 MB linear space; A25 is MSB for 1 Gb density |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports byte/word writes per JEDEC standard |
| CE# | Chip enable | Active-low chip select; controls device power state and command latching |
| OE# | Output enable | Active-low gate for data output drivers; enables read data sampling timing control |
| WE# | Write enable | Active-low strobe for write cycles; initiates command sequences and data latching |
| RY/BY# | Ready/Busy output | Open-drain status indicator; low during embedded operations, high when ready |
| RESET# | Hardware reset | Active-low asynchronous reset; forces device into reading state and clears internal state |
| VCC | Core supply | 2.7–3.6 V single supply for all operations - eliminates need for separate I/O rail |
| VIO | I/O supply | 1.65–VCC range - allows interfacing with 1.8 V, 2.5 V, or 3.3 V host processors |
Key Features
| Feature | Design Value |
|---|---|
| Page mode read (32-byte aligned) | 15 ns access within same page - accelerates sequential instruction fetch in XIP applications |
| Uniform 128-kB sector architecture | 1024 individually erasable sectors - enables fine-grained firmware update partitioning |
| 1024-byte OTP array with dual lock regions | Immutable storage for keys, calibration data, or secure boot configuration - prevents field tampering |
| Common Flash Interface (CFI) | Standardized parameter table at known address - enables OS-agnostic flash driver auto-detection |
| Advanced Sector Protection (ASP) | Volatile/non-volatile lock bits per sector - supports dynamic protection during field updates |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot firmware and safety-critical application code in programmable logic controllers operating continuously in factory environments. IC Role / Device Role / Timing Role: Primary non-volatile boot memory providing XIP-capable instruction fetch with deterministic 90 ns latency. Use Value: 20-year data retention and 100K-cycle endurance ensure firmware integrity over 15+ year equipment lifespans without refresh. | Use Scenario: Holding boot loader and sensor fusion firmware in radar ECU modules subjected to thermal cycling and vibration. IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 qualified parallel NOR flash serving as trusted boot source for ASIL-B systems. Use Value: Hardware ECC and sector-level ASP prevent corruption from radiation-induced bit flips and unauthorized reprogramming. |
| Medical Imaging System BIOS | Telecom Base Station Configuration |
Use Scenario: Hosting BIOS and FPGA configuration bitstreams in portable ultrasound devices requiring rapid cold boot and regulatory traceability. IC Role / Device Role / Timing Role: Secure silicon region (OTP) stores cryptographic keys and device-specific calibration parameters. Use Value: Dual-lock OTP regions allow independent provisioning of keys and calibration data - meeting IEC 62304 traceability requirements. | Use Scenario: Storing field-upgradable configuration tables and protocol stacks in 5G remote radio units deployed outdoors. IC Role / Device Role / Timing Role: High-density (1 Gb), low-power standby (100 µA) flash supporting remote firmware patching via backhaul link. Use Value: 512-byte programming buffer enables sub-second patch application, minimizing service interruption windows. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GS12DHIV20 | Same die, 56-pin TSOP package - no BGA mounting, higher profile, less thermal performance | Preferred for legacy PCBs with through-hole or wide-pitch layout; unsuitable for space-constrained modules | Select when board rework cost exceeds redesign; verify mechanical clearance and signal integrity for 56-pin routing |
| MX29GL128FPTI-90G | 128 Mb density (1/8 capacity), 90 ns access, no integrated ECC, no OTP array | Lower-cost option for non-safety firmware where ECC and secure storage are handled externally | Choose only if firmware size ≤16 MB and system-level ECC is already implemented in host processor |
Compared with S29GL01GS12DHIV20, this LAE BGA variant offers superior thermal dissipation and board area efficiency; versus MX29GL128F, it delivers 8× density, on-die ECC, and OTP security - essential for modern automotive and industrial firmware integrity.
Availability
S29GL01GS12TFIV20 is available at Aetrix Electronics and suitable for industrial control systems, automotive ECUs, medical imaging platforms, and telecom infrastructure requiring stable component supply across extended product lifecycles.
Supply support for S29GL01GS12TFIV20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global manufacturing and R&D centers.
The GL-S family targets high-reliability embedded firmware storage, combining XIP performance with data storage density - designed specifically for automotive, industrial, and medical systems demanding AEC-Q100 or extended temperature operation.
FAQ
What is the function of the RY/BY# pin on S29GL01GS12TFIV20?
The RY/BY# pin is an open-drain ready/busy status indicator. It asserts low during internal program, erase, or suspend operations and returns high when the device completes the operation and is ready for the next command. It can be polled alongside status register bits or used as an interrupt source in hardware-driven systems.
Does S29GL01GS12TFIV20 require separate VCC and VIO supplies?
No - it operates from a single VCC supply (2.7–3.6 V) for core logic, while VIO may be independently set from 1.65 V to VCC to match host I/O voltage. This allows direct interfacing with 1.8 V, 2.5 V, or 3.3 V processors without level shifters, reducing BOM count and signal integrity complexity.
How is the 1024-byte OTP array structured and accessed?
The OTP array occupies a dedicated address space (0x0000_0000–0x0000_03FF) and contains two independently lockable 512-byte regions. Locking is permanent and performed via specific unlock-bypass-write command sequences. Once locked, contents are read-only and immune to accidental erase or overwrite - used for keys, serial numbers, or calibration data.
Can S29GL01GS12TFIV20 be used in place of older S29GL01GP devices?
No - S29GL01GS is not pin-compatible with S29GL01GP due to different BGA ballouts (LAE vs. LAA), distinct command set extensions (e.g., enhanced suspend/resume), and updated CFI parameter tables. Migration requires PCB redesign and firmware driver updates to support new status register bits and timing modes.
S29GL01GS12TFIV20 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 64M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 120 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL01GS12TFIV20 FAQ
1.How can I place an order for S29GL01GS12TFIV20 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GS12TFIV20 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GS12TFIV20 reliable?
The price and inventory of S29GL01GS12TFIV20 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GS12TFIV20 is usually 5 days.
3.What payment methods are accepted for S29GL01GS12TFIV20?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GS12TFIV20 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GS12TFIV20?
S29GL01GS12TFIV20 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GS12TFIV20 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GS12TFIV20?
For technical support, including S29GL01GS12TFIV20 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GS12TFIV20 requirements.
6.How does Aetrix verify that S29GL01GS12TFIV20 is sourced from the original manufacturer or authorized distributors?
All S29GL01GS12TFIV20 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GS12TFIV20 meets industry standards.
7.What is the process for return or replacement of S29GL01GS12TFIV20?
All S29GL01GS12TFIV20 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GS12TFIV20, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GS12TFIV20 part is unused and in its original packaging.
Return procedure for S29GL01GS12TFIV20:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL01GS12TFIV20 Tags
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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology
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AT21CS01-STUM10-T
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AT24C02C-SSHM-T
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24LC01BT-I/OT
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M24C02-FMC6TG
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AT24CS02-SSHM-T
Microchip Technology
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93LC46BT-I/OT
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AT24C04C-SSHM-T
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AT24C08C-STUM-T
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