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Infineon Technologies S29GL01GT10DHA020
- Part No.:
- S29GL01GT10DHA020
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL01GT10DHA020.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,304
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Product details
Overview
S29GL01GT10DHA020 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, hardware ECC for single-bit correction, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C). It is used in boot code storage for embedded microcontrollers in industrial control systems.
For engineers reviewing the S29GL01GT10DHA020 datasheet, S29GL01GT10DHA020 pinout, S29GL01GT10DHA020 application, or S29GL01GT10DHA020 equivalent, key selection criteria include parallel ×16 bus interface, 100,000 program/erase cycles, OTP array with four lockable regions, CFI compliance, and support for suspend/resume during programming and erase.
Technical Context
This device implements an asynchronous parallel interface with byte/word boundary addressing and supports both 8-bit and 16-bit data bus configurations. Its embedded algorithm controller (EAC) manages all program and erase operations, including automatic ECC generation and verification during write cycles.
The versatile I/O feature enables independent VIO supply (1.65 V to VCC), allowing interoperability with mixed-voltage host systems. Sector protection is implemented via volatile and non-volatile methods, and the 2048-byte OTP array includes factory-locked SSR0 and password-protected SSR3 for secure configuration storage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 1 Gb (128 MB) - sufficient for full firmware images and bootloader + application code in resource-constrained embedded hosts |
| Access time (tACC) | 100 ns at –40°C to +85°C - enables direct XIP execution without external cache in real-time control applications |
| Page access time (tPACC) | 15 ns - accelerates sequential instruction fetch during boot or firmware update |
| Write buffer size | 512 bytes - reduces effective programming time by batching up to 256 words per command |
| ECC capability | Single-bit error correction in hardware - ensures data integrity without software overhead during critical boot sequences |
| Endurance | 100,000 program/erase cycles - supports field firmware updates over 10+ years in industrial deployments |
| Data retention | 20 years at +85°C - guarantees long-term reliability in unattended equipment like remote sensors and PLCs |
Pinout & Package
Package: 56-pin TSOP (Type I, standard thickness), JEDEC MO-142AC compliant, lead-free and RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A20 | Address inputs | 21-bit address bus supporting full 128 MB linear space; A0 selects byte/word mode when x16 configured |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; operates in x8 or x16 mode per configuration pins |
| CE# | Chip enable | Active-low chip select; controls device power state and enables read/write access timing |
| OE# | Output enable | Active-low control for data output drivers; decouples read data timing from address setup |
| WE# | Write enable | Active-low signal initiating internal program/erase algorithms upon command sequence |
| RY/BY# | Ready/Busy indicator | Open-drain output signaling active embedded operation; used for polling or interrupt-driven status monitoring |
| VCC | Core supply | 2.7–3.6 V main power; powers logic, memory array, and EAC - no separate VPP required |
| VIO | I/O supply | 1.65–VCC voltage domain; isolates I/O signaling from core logic for mixed-voltage system interfacing |
Key Features
| Feature | Design Value |
|---|---|
| Asynchronous page read | 32-byte burst capability improves sequential instruction throughput without clock synchronization overhead |
| Hardware ECC | On-the-fly single-bit correction eliminates need for external error-handling logic in safety-critical boot paths |
| Suspend/Resume | Allows interruption of erase or program operations to service high-priority reads - essential for real-time OS environments |
| CFI parameter table | Standardized JEDEC-compliant descriptor enables automatic driver detection and configuration in generic flash loaders |
| OTP array with SSR locking | Four 512-byte lockable sectors (SSR0–SSR3) provide immutable storage for keys, calibration data, or secure boot parameters |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing firmware and configuration data for programmable logic controllers deployed in factory automation lines. IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable instruction storage with deterministic 100 ns access latency. Use Value: Enables deterministic startup within <500 ms and supports field firmware updates via 100,000-cycle endurance without requiring backup power. | Use Scenario: Holding boot code and sensor calibration tables for radar processing units in Level 2+ ADAS systems. IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 qualified parallel NOR flash serving as primary boot source for SoC initialization at –40°C to +105°C. Use Value: Hardware ECC ensures boot integrity under EMI-rich vehicle environments; OTP SSR3 stores encrypted calibration keys with password protection. |
| Medical Imaging System BIOS | Telecom Base Station Configuration |
Use Scenario: Hosting BIOS and FPGA configuration bitstreams in portable ultrasound and MRI subsystems requiring regulatory traceability. IC Role / Device Role / Timing Role: Secure, long-retention (20-year) storage for certified firmware images with CFI-based auto-detection in diagnostic platform bootloaders. Use Value: Factory-locked SSR0 prevents unauthorized modification; sector protection prevents accidental overwrite during service-mode updates. | Use Scenario: Storing FPGA configuration, DSP firmware, and network protocol stacks in 5G remote radio units operating in outdoor enclosures. IC Role / Device Role / Timing Role: High-reliability parallel flash interfaced to ARM-based management processors via 16-bit bus with suspend/resume for concurrent diagnostics. Use Value: 128-KB uniform sectors simplify partitioning for dual-image redundancy; standby current ≤100 μA extends uptime during low-power sleep modes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GT11DHA020 | Same die, identical specs, but rated for Industrial Plus (–40°C to +105°C) temperature range | Required where ambient exceeds +85°C, e.g., under-hood automotive or enclosed industrial drives | Select when thermal margin requires extended temperature qualification without changing layout or firmware |
| MX29GL128FDTI-90G | 128 MB (1 Gb), 90 ns tACC, no built-in ECC, 55 nm process, 100K cycles, same TSOP-56 package | Lacks hardware ECC and OTP security features; requires external error handling and software-based protection | Choose only if cost sensitivity outweighs reliability and security requirements in non-safety-critical consumer applications |
Compared with S29GL01GT10DHA020, the S29GL01GT11DHA020 offers identical functionality with higher thermal rating, while MX29GL128FDTI-90G sacrifices ECC and OTP for lower unit cost - making the original optimal for safety-aware industrial and automotive boot memory.
Availability
S29GL01GT10DHA020 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, medical imaging BIOS, telecom base station configuration, and automotive ADAS boot memory requiring stable component supply across multi-year production cycles.
Supply support for S29GL01GT10DHA020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global R&D and manufacturing infrastructure.
The GL-T family targets high-reliability embedded systems needing fast XIP-capable flash with integrated data integrity and security features - designed specifically for industrial, automotive, and medical applications demanding long-term availability and AEC-Q100 compliance.
FAQ
Is S29GL01GT10DHA020 pin-compatible with earlier S29GL series devices?
Yes, it maintains identical pinout and electrical interface with S29GL01GP and S29GL01GS in TSOP-56 package. Address and data bus assignments, control signal polarity, and timing parameters align across the GL-P/G/S/T generations, enabling drop-in replacement where temperature and endurance requirements match.
Does this device require external VPP for programming or erase?
No. S29GL01GT10DHA020 uses single-supply operation: VCC (2.7–3.6 V) powers all functions including program and erase. There is no VPP pin or external high-voltage requirement - all voltage boosting is handled internally by charge pumps controlled by the embedded algorithm controller.
How is the OTP array protected against accidental writes?
The 2048-byte OTP array is divided into four 512-byte sectors (SSR0–SSR3), each independently lockable. SSR0 is factory-permanently locked; SSR1 and SSR2 can be locked via command sequence; SSR3 supports password-based read protection. Once locked, no unlock command exists - protection is irreversible.
Can S29GL01GT10DHA020 operate in x8 mode on a 16-bit bus?
Yes. When BYTE# = HIGH, the device operates in x8 mode: DQ0–DQ7 carry data, and A0 is ignored for addressing. This allows backward compatibility with legacy 8-bit host interfaces while retaining physical x16 package routing. The mode is selected at power-on and cannot be changed dynamically.
S29GL01GT10DHA020 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL01GT10DHA020 FAQ
1.How can I place an order for S29GL01GT10DHA020 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GT10DHA020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GT10DHA020 reliable?
The price and inventory of S29GL01GT10DHA020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GT10DHA020 is usually 5 days.
3.What payment methods are accepted for S29GL01GT10DHA020?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GT10DHA020 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GT10DHA020?
S29GL01GT10DHA020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GT10DHA020 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GT10DHA020?
For technical support, including S29GL01GT10DHA020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GT10DHA020 requirements.
6.How does Aetrix verify that S29GL01GT10DHA020 is sourced from the original manufacturer or authorized distributors?
All S29GL01GT10DHA020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GT10DHA020 meets industry standards.
7.What is the process for return or replacement of S29GL01GT10DHA020?
All S29GL01GT10DHA020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GT10DHA020, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GT10DHA020 part is unused and in its original packaging.
Return procedure for S29GL01GT10DHA020:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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