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Infineon Technologies S29GL01GT10DHA023
- Part No.:
- S29GL01GT10DHA023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL01GT10DHA023.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,898
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Product details
Overview
S29GL01GT10DHA023 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC with MIRRORBIT™ technology, designed for embedded code storage and execution-in-place (XIP) applications. It operates from a single 2.7–3.6 V supply, delivers 100 ns random access time and 15 ns page access time, and integrates hardware ECC for single-bit error correction. Used in industrial control firmware storage where deterministic read latency and long-term data retention are critical.
For engineers reviewing the S29GL01GT10DHA023 datasheet, S29GL01GT10DHA023 pinout, S29GL01GT10DHA023 application, or S29GL01GT10DHA023 equivalent, key selection criteria include uniform 128-KB sector erase granularity, 512-byte programming buffer throughput, OTP array security features, and AEC-Q100 Grade 2 qualification for extended-temperature automotive use.
Technical Context
This device implements an asynchronous parallel interface with ×8/×16 configurable data bus, supporting byte/word boundary addressing only. Its embedded algorithm controller (EAC) manages program, erase, suspend/resume, and automatic ECC correction without host intervention.
The flash array uses 45-nm MIRRORBIT™ process with uniform 128-KB sectors and a dedicated 2048-byte one-time programmable (OTP) array segmented into four lockable SSR regions-SSR0 factory-locked, SSR3 password-protected-enabling secure boot code and configuration storage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 1 Gb (128 MB) - supports full firmware images for mid-tier microcontrollers and DSPs |
| Random access time (tACC) | 100 ns at –40°C to +85°C - enables real-time XIP execution with sub-100 ns instruction fetch latency |
| Page access time (tPACC) | 15 ns - accelerates sequential read of boot code or lookup tables |
| Programming buffer size | 512 bytes - reduces effective programming time by batching up to 256 words per command |
| ECC capability | Internal hardware single-bit error correction - maintains data integrity without software overhead |
| Endurance & retention | 100,000 program/erase cycles / 20-year data retention - suitable for field-upgradable systems with infrequent reprogramming |
| Operating temperature | –40°C to +105°C (Industrial Plus grade) - validated for under-hood automotive and industrial edge controllers |
Pinout & Package
Package: 64-ball LAE fortified BGA (9 mm × 9 mm), RoHS-compliant, lead-free, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address inputs | 22-bit address bus supporting full 128 MB linear addressing (byte/word aligned) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; configurable as ×8 or ×16 via BYTE# pin |
| CE#, OE#, WE# | Chip Enable, Output Enable, Write Enable | Asynchronous control signals defining read/write cycle timing windows per JEDEC standards |
| RY/BY# | Ready/Busy output | Open-drain status indicator signaling active program/erase operations to host controller |
| VCC, VIO | Core and I/O supplies | Separate 2.7–3.6 V VCC and 1.65–VCC VIO allow interfacing with mixed-voltage SoCs |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O voltage range | VIO supports 1.65 V to VCC - enables direct connection to 1.8 V, 2.5 V, or 3.3 V logic without level shifters |
| Uniform 128-KB sector architecture | 64 erasable sectors - simplifies firmware partitioning and OTA update management |
| Suspend/Resume during program/erase | Allows host to pause background flash operations for high-priority interrupt service - critical for real-time OS environments |
| Advanced sector protection (ASP) | Volatile and non-volatile locking per sector - prevents accidental overwrite of bootloader or calibration data |
| CFI-compliant parameter table | Standardized JEDEC JESD68 query structure - enables auto-detection and driver compatibility across toolchains |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing and executing ladder logic firmware in programmable logic controllers operating continuously in factory environments. IC Role / Device Role / Timing Role: Non-volatile code storage with XIP capability; provides deterministic <100 ns instruction fetch latency during runtime. Use Value: Eliminates need for external RAM-based code shadowing, reducing BOM cost and power while maintaining real-time determinism. | Use Scenario: Holding boot firmware and safety-critical initialization routines for radar ECU modules in AEC-Q100 Grade 2 systems. IC Role / Device Role / Timing Role: Secure, high-reliability boot memory with OTP-protected bootloader and hardware ECC for ASIL-B compliance. Use Value: Ensures verified boot integrity across thermal cycling and voltage transients typical in automotive under-hood conditions. |
| Medical Imaging System Configuration | Telecom Baseband Processor Code Storage |
Use Scenario: Retaining calibrated sensor profiles and regulatory-compliant operational parameters in portable ultrasound devices. IC Role / Device Role / Timing Role: Parameter storage with sector-level write protection and 20-year data retention guarantee. Use Value: Meets IEC 62304 requirements for persistent configuration data integrity over product lifetime without battery backup. | Use Scenario: Hosting baseband firmware for LTE/5G small cell radios requiring fast code load and field updates. IC Role / Device Role / Timing Role: High-density parallel flash with 512-byte buffer programming - cuts firmware update time by >40% vs. legacy 16-byte buffers. Use Value: Accelerates remote firmware deployment in carrier-grade infrastructure with minimal downtime. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GT11DHA020 | Same density and package, but rated for –40°C to +125°C (Extended grade); slightly higher tACC (120 ns) | Required for under-hood engine control units exceeding +105°C ambient | Select when full extended temperature operation is mandated, accepting marginal read latency penalty |
| S29GL512T11DHA020 | 512 Mb density, identical timing and feature set; same 64-ball LAE BGA footprint | Used where firmware image size fits within 64 MB and cost optimization is prioritized | Drop-in replacement if design has headroom for reduced capacity and seeks lower unit cost |
Compared with S29GL01GT10DHA023, the +125°C-rated variant trades 20 ns read latency for broader thermal coverage, while the 512 Mb alternative retains full pin and feature compatibility at lower density-enabling scalable memory sizing without PCB redesign.
Availability
S29GL01GT10DHA023 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system configuration requiring stable component supply across multi-year production cycles.
Supply support for S29GL01GT10DHA023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs, with leadership in flash memory for mission-critical embedded systems.
The GL-T family targets high-reliability embedded applications demanding XIP performance, robust data retention, and automotive-grade qualification-designed specifically for code storage in ECUs, PLCs, and medical devices.
FAQ
What is the difference between S29GL01GT10DHA023 and S29GL01GT11DHA020?
S29GL01GT10DHA023 is qualified for –40°C to +105°C (Industrial Plus grade) with 100 ns random access time, while S29GL01GT11DHA020 extends to –40°C to +125°C (Extended grade) with 120 ns tACC. Both share identical pinout, command set, and OTP structure. The extended-grade part undergoes additional burn-in and characterization for higher-temperature reliability.
Does this device support byte-level writes without erasing the entire sector?
No. S29GL01GT10DHA023 requires sector erase before any program operation. However, it supports single-word programming within an already-erased sector and allows multiple words to be buffered and written in one 512-byte operation, minimizing erase frequency and wear leveling overhead.
How is the 2048-byte OTP array structured and secured?
The OTP array contains four 512-byte sectors (SSR0–SSR3). SSR0 is permanently locked at factory; SSR1 and SSR2 are user-lockable via volatile/non-volatile bits; SSR3 supports password-based read protection. Locking is irreversible and enforced by on-chip logic-no software bypass is possible once committed.
Can this flash be used with a 1.8 V microcontroller interface?
Yes. With VIO supplied at 1.8 V and VCC at 3.0 V, the device meets all DC and AC specifications for 1.8 V I/O logic levels. The versatile I/O feature guarantees valid input thresholds and output drive strength across 1.65–3.6 V VIO, eliminating external level shifters in mixed-voltage designs.
S29GL01GT10DHA023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL01GT10DHA023 FAQ
1.How can I place an order for S29GL01GT10DHA023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GT10DHA023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GT10DHA023 reliable?
The price and inventory of S29GL01GT10DHA023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GT10DHA023 is usually 5 days.
3.What payment methods are accepted for S29GL01GT10DHA023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GT10DHA023 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GT10DHA023?
S29GL01GT10DHA023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GT10DHA023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GT10DHA023?
For technical support, including S29GL01GT10DHA023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GT10DHA023 requirements.
6.How does Aetrix verify that S29GL01GT10DHA023 is sourced from the original manufacturer or authorized distributors?
All S29GL01GT10DHA023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GT10DHA023 meets industry standards.
7.What is the process for return or replacement of S29GL01GT10DHA023?
All S29GL01GT10DHA023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GT10DHA023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GT10DHA023 part is unused and in its original packaging.
Return procedure for S29GL01GT10DHA023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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