Infineon Technologies S29GL01GT10DHI010
- Part No.:
- S29GL01GT10DHI010
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL01GT10DHI010.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 64FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:238
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S29GL01GT10DHI010 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, hardware ECC for single-bit correction, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C). It is used in boot code storage for industrial controllers requiring fast XIP execution and reliable non-volatile data retention.
For engineers reviewing the S29GL01GT10DHI010 datasheet, S29GL01GT10DHI010 pinout, S29GL01GT10DHI010 application, or S29GL01GT10DHI010 equivalent, key selection factors include verified 100,000 program/erase cycles, 20-year data retention, CFI-compliant interface, OTP array with four lockable SSR regions, and support for suspend/resume during embedded operations.
Technical Context
This device implements an asynchronous parallel interface with ×8/×16 configurable data bus, supporting byte- and word-aligned addressing only. Its embedded algorithm controller (EAC) manages all program/erase operations autonomously, including automatic ECC generation and correction on read, status monitoring via Status Register/Data Polling/RY/BY# pin, and sector-level protection via volatile/non-volatile ASP.
The architecture includes dedicated address space overlays (ASOs) for Device ID/CFI, Status Register, Data Polling, SSR (OTP), ECC status, and sector protection control - enabling standardized firmware compatibility and secure one-time programmable configuration without external logic.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 1 Gb (128 MB) – supports full boot image storage for mid-range microcontrollers |
| Access time (tACC) | 100 ns at –40°C to +85°C – enables direct XIP execution without wait states on 10 MHz bus |
| Page access time (tPACC) | 15 ns – accelerates sequential instruction fetch in page mode |
| Write buffer size | 512 bytes – reduces effective programming time by batching up to 256 words per command |
| ECC capability | Internal hardware single-bit error correction – ensures data integrity without host CPU overhead |
| Endurance & retention | 100,000 program/erase cycles / 20-year data retention – meets long-life industrial deployment requirements |
| Operating voltage | VCC = 2.7 V to 3.6 V, VIO = 1.65 V to VCC – allows flexible I/O rail design with mixed-voltage SoCs |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-141AC footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address inputs | 22-bit address bus supporting full 128 MB linear addressing (byte/word aligned only) |
| DQ0–DQ15 | Data I/O | Configurable ×8 or ×16 bidirectional data bus; DQ15 functions as BYTE# in ×8 mode |
| CE#, OE#, WE# | Chip Enable, Output Enable, Write Enable | Standard asynchronous control signals; CE# active-low enables device; OE#/WE# control read/write direction and timing |
| RY/BY# | Ready/Busy output | Open-drain status indicator: low = operation in progress, high = ready for next command |
| RESET# | Hardware reset input | Asynchronous active-low signal forcing device into standby and clearing internal state |
| VCC, VIO, GND | Power supplies | VCC = core supply (2.7–3.6 V); VIO = I/O supply (1.65–VCC); separate rails enable mixed-voltage interfacing |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O voltage range | VIO supports 1.65 V to VCC - eliminates level shifters when interfacing with 1.8 V or 3.3 V host processors |
| 512-byte programming buffer | Enables single-command programming of up to 256 words - cuts typical firmware update time by >60% vs. byte-by-byte writes |
| Hardware ECC engine | Single-bit correction implemented in silicon - no host driver or software overhead required for bit-flip recovery |
| Four-lockable OTP sectors (SSR0–SSR3) | SSR0 factory-locked, SSR3 password-protected - provides secure boot key storage and firmware signature validation |
| Common Flash Interface (CFI) | Standardized parameter table accessible via read commands - enables auto-detection and vendor-agnostic flash drivers |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot loader and real-time OS kernel in programmable logic controllers with field-upgrade capability. IC Role / Device Role / Timing Role: Non-volatile boot code memory with XIP support and deterministic 100 ns access for deterministic task scheduling. Use Value: Eliminates external SRAM copy step during boot; 20-year retention ensures firmware persistence across 15+ year product lifecycles. | Use Scenario: Holding safety-critical boot firmware for radar ECU in AEC-Q100 Grade 2 (–40°C to +105°C) automotive systems. IC Role / Device Role / Timing Role: Certified flash memory providing secure, ECC-protected startup code with RY/BY# status signaling for ASIL-B compliance. Use Value: Hardware ECC and OTP lock prevent unauthorized modification; 100,000-cycle endurance supports over-the-air updates throughout vehicle lifetime. |
| Medical Imaging System Configuration | Telecom Base Station BIOS |
Use Scenario: Storing calibration tables and FPGA configuration bitstreams in portable ultrasound devices requiring radiation-tolerant non-volatility. IC Role / Device Role / Timing Role: High-reliability configuration store with sector erase granularity enabling selective reprogramming without full chip erase. Use Value: Uniform 128-KB sectors allow independent update of calibration data while preserving firmware; extended temperature grade supports sterilization cycles. | Use Scenario: Hosting BIOS and FPGA initialization code in carrier-grade 5G base station control cards operating continuously at elevated ambient temperatures. IC Role / Device Role / Timing Role: Parallel NOR flash delivering deterministic boot latency and robustness against power interruption during firmware updates. Use Value: Suspend/resume capability prevents corruption during unexpected power loss; CFI interface simplifies BIOS porting across multiple hardware revisions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GP10DHI010 | Same density and package, but lacks OTP array and SSR lock capability | Not suitable for secure boot or cryptographic key storage | Select only if OTP functionality is unnecessary and cost sensitivity outweighs security requirements |
| MX29GL128FDTI-90G | 128 MB density, 90 ns tACC, no hardware ECC, no CFI support | Requires host-side error handling and custom driver development | Consider only for legacy designs where firmware stack already handles ECC and lacks CFI abstraction layer |
Compared with S29GL01GP10DHI010, this part adds secure OTP storage and password-protected SSR3; versus MX29GL128FDTI-90G, it delivers guaranteed ECC, standardized CFI detection, and superior data integrity - critical for safety- and security-sensitive deployments.
Availability
S29GL01GT10DHI010 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and telecom base station BIOS requiring stable component supply across extended temperature grades and long product lifecycles.
Supply support for S29GL01GT10DHI010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for industrial, automotive, and IoT applications.
The GL-T family targets high-reliability embedded systems needing fast XIP-capable flash with integrated ECC and secure OTP - bridging performance gaps between traditional NOR and NAND-based boot architectures.
FAQ
What is the function of the RY/BY# pin on S29GL01GT10DHI010?
The RY/BY# pin is an open-drain output that signals operational status: low indicates an embedded program or erase operation is in progress, while high confirms readiness for the next command. It operates independently of Status Register polling and supports hardware flow control in real-time systems where deterministic timing is critical.
Does S29GL01GT10DHI010 support both ×8 and ×16 data bus configurations?
Yes - the device automatically detects bus width via the BYTE# signal (DQ15 in ×8 mode). When BYTE# is asserted low, it operates in ×8 mode with DQ0–DQ7 active; when high or unconnected, it defaults to ×16 mode using DQ0–DQ15. Address alignment remains byte- or word-boundary only in both modes.
How does the 512-byte write buffer improve programming efficiency?
The buffer allows up to 512 bytes (256 words) to be loaded before initiating a single embedded program operation, reducing command overhead and bus arbitration delays. Measured performance shows 1.14 MBps effective programming rate - more than 3× faster than sequential single-word programming under identical conditions.
Can the OTP array (SSR0–SSR3) be reprogrammed after initial programming?
No - the 2048-byte OTP array is permanently programmable once written. SSR0 is factory-locked and cannot be modified; SSR1 and SSR2 are user-lockable via command sequence; SSR3 supports password-based read protection but cannot be erased or rewritten. Locking is irreversible and enforced by on-chip logic.
S29GL01GT10DHI010 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL01GT10DHI010 FAQ
1.How can I place an order for S29GL01GT10DHI010 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GT10DHI010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GT10DHI010 reliable?
The price and inventory of S29GL01GT10DHI010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GT10DHI010 is usually 5 days.
3.What payment methods are accepted for S29GL01GT10DHI010?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GT10DHI010 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GT10DHI010?
S29GL01GT10DHI010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GT10DHI010 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GT10DHI010?
For technical support, including S29GL01GT10DHI010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GT10DHI010 requirements.
6.How does Aetrix verify that S29GL01GT10DHI010 is sourced from the original manufacturer or authorized distributors?
All S29GL01GT10DHI010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GT10DHI010 meets industry standards.
7.What is the process for return or replacement of S29GL01GT10DHI010?
All S29GL01GT10DHI010 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GT10DHI010, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GT10DHI010 part is unused and in its original packaging.
Return procedure for S29GL01GT10DHI010:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL01GT10DHI010 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

