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Infineon Technologies S29GL01GT10DHI020
- Part No.:
- S29GL01GT10DHI020
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL01GT10DHI020.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,624
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Product details
Overview
S29GL01GT10DHI020 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, internal hardware ECC for single-bit correction, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C). It is used in boot code storage for industrial microcontrollers requiring deterministic XIP execution.
For engineers reviewing the S29GL01GT10DHI020 datasheet, S29GL01GT10DHI020 pinout, S29GL01GT10DHI020 application, or S29GL01GT10DHI020 equivalent, key selection criteria include asynchronous parallel interface timing, OTP array security configuration, sector protection volatility control, and ECC-enabled data integrity in long-life embedded systems.
Technical Context
This device implements an asynchronous parallel interface with ×8/×16 data bus support and byte/word boundary addressing. Its embedded algorithm controller (EAC) manages program, erase, and suspend/resume operations without external host intervention.
The device integrates a dedicated 2048-byte one-time programmable (OTP) array with four lockable sectors (SSR0–SSR3), where SSR0 is factory-locked and SSR3 supports password-based read protection - enabling secure boot key storage and firmware signature validation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 1 Gb (128 MB) - sufficient for full boot image + firmware + configuration tables in resource-constrained controllers |
| Access time (tACC) | 100 ns at –40°C to +85°C - enables direct XIP execution from flash without cache penalty in real-time systems |
| Page access time (tPACC) | 15 ns - accelerates sequential instruction fetch during boot initialization |
| Write buffer size | 512 bytes - reduces effective programming time by batching writes, critical for field firmware updates |
| ECC capability | Internal hardware single-bit error correction - maintains data integrity over 20-year retention without software overhead |
| Endurance | 100,000 program/erase cycles - supports frequent OTA update cycles in industrial gateways |
| Operating voltage | VCC = 2.7 V to 3.6 V, VIO = 1.65 V to VCC - allows interfacing with mixed-voltage SoCs and legacy 3.3 V logic |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-141AC footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address inputs | 22-bit address bus supporting full 128 MB linear space; A0 selects byte/word mode when configured |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional bus; operates in ×8 or ×16 mode per configuration; supports versatile I/O voltage (1.65 V to VCC) |
| CE# | Chip enable | Active-low chip select; tCE = 100 ns max - defines minimum cycle time for burst reads |
| OE# | Output enable | Active-low output control; tOE = 25 ns max - determines data hold window for synchronous latch capture |
| WE# | Write enable | Active-low write strobe; initiates command sequences and buffer programming operations |
| RY/BY# | Ready/Busy indicator | Open-drain status signal; low during embedded operations (program/erase), high when ready for next command |
| RESET# | Hardware reset | Active-low asynchronous reset; forces device into reading state and clears internal state machines |
Key Features
| Feature | Design Value |
|---|---|
| Asynchronous page read | 32-byte page mode with 15 ns access - improves instruction fetch throughput vs. random read in boot loaders |
| Uniform sector architecture | 128-KB sectors across full array - simplifies partitioning for bootloader, app, and config storage with deterministic erase boundaries |
| Advanced sector protection (ASP) | Volatile and non-volatile locking per sector - enables runtime-protectable firmware regions and factory-set immutable boot code |
| CFI parameter table | Standardized JEDEC JESD68-compliant interface - allows automatic detection and configuration by generic flash drivers in Linux/u-boot |
| OTP array with SSRs | 2048-byte OTP with four lockable sectors (SSR0–SSR3), including factory-locked SSR0 - supports secure key injection and tamper-resistant identity storage |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot firmware and safety-critical application code in programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Primary non-volatile boot memory providing XIP-capable instruction fetch with deterministic 100 ns latency. Use Value: Enables zero-latency startup and eliminates need for external RAM copy, reducing BOM cost and board area in space-constrained DIN-rail modules. | Use Scenario: Holding certified boot loader and sensor fusion firmware in radar ECU modules meeting AEC-Q100 Grade 2 (–40°C to +105°C). IC Role / Device Role / Timing Role: Secure, high-reliability flash with OTP-based cryptographic key storage and ECC-protected code execution. Use Value: Meets ASIL-B functional safety requirements via built-in ECC and sector-level write protection, avoiding external error-handling logic. |
| Medical Imaging System Configuration | Telecom Base Station FPGA Bitstream |
Use Scenario: Retaining calibration profiles, user preferences, and regulatory compliance settings in portable ultrasound devices with 20-year shelf life requirement. IC Role / Device Role / Timing Role: Non-volatile parameter store with guaranteed 20-year data retention and 100,000-cycle endurance for field recalibration events. Use Value: Eliminates battery-backed SRAM and associated failure modes, ensuring data persistence through power loss and thermal cycling. | Use Scenario: Storing reconfigurable FPGA bitstreams in 5G remote radio units requiring fast, reliable loading at power-up. IC Role / Device Role / Timing Role: High-speed parallel flash delivering 1.14 MBps buffer programming to minimize boot delay after cold start. Use Value: Reduces system initialization time by >40% compared to serial SPI flash, meeting strict telecom equipment uptime SLAs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GT10DHIV10 | Same die, automotive-grade (AEC-Q100 Grade 2), +105°C max operating temperature | Required for under-hood automotive modules; higher screening cost and longer lead time | Select when extended temperature operation and automotive qualification are mandatory |
| S29GL512T10DHI020 | 512 Mb density, identical package, timing, and feature set except reduced capacity | Used where firmware footprint fits within 64 MB and cost sensitivity outweighs future scalability needs | Select for cost-optimized designs with verified <64 MB firmware size and no planned feature expansion |
Compared with S29GL01GT10DHI020, the automotive variant adds qualification rigor but no functional change, while the 512 Mb version trades density for lower unit cost - both retain identical interface behavior, ECC, and OTP structure for seamless migration.
Availability
S29GL01GT10DHI020 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, medical imaging configuration retention, and telecom base station FPGA bitstream loading requiring stable component supply across multi-year production cycles.
Supply support for S29GL01GT10DHI020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing infrastructure.
The GL-T family targets high-reliability embedded systems needing XIP-capable parallel flash with integrated ECC and secure OTP - designed specifically for industrial control, automotive ECUs, and medical devices demanding long-term data integrity.
FAQ
What is the purpose of the SSR0–SSR3 sectors in the OTP array?
SSR0–SSR3 are four independent lockable sectors within the 2048-byte OTP array. SSR0 is permanently locked at factory and typically holds device-specific identifiers. SSR3 supports password-based read protection, enabling secure storage of cryptographic keys or calibration secrets that must remain inaccessible to unauthorized firmware reads.
Does S29GL01GT10DHI020 support both ×8 and ×16 data bus configurations?
Yes, it supports configurable ×8 or ×16 operation via hardware pin strapping (BYTE# input) and internal mode register settings. In ×16 mode, DQ15–DQ0 transfer 16-bit words; in ×8 mode, DQ7–DQ0 transfer bytes with A0 controlling odd/even addressing - enabling compatibility with both 8-bit and 16-bit microcontroller buses.
How does the internal ECC operate during read operations?
The internal ECC engine automatically checks every 512-byte sector on read, correcting single-bit errors in hardware before data reaches the bus. No software intervention is required, and corrected data appears transparently. Uncorrectable multi-bit errors trigger status register flags and RY/BY# assertion, allowing host firmware to initiate recovery or fallback procedures.
Can sector protection be changed dynamically during system operation?
Yes, advanced sector protection (ASP) supports both volatile (cleared on power cycle) and non-volatile (persistent) locking modes. Volatile protection allows runtime lockdown of critical sectors during firmware updates, while non-volatile protection ensures permanent write-protection of bootloader regions - both controlled via dedicated command sequences without requiring hardware reset.
S29GL01GT10DHI020 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL01GT10DHI020 FAQ
1.How can I place an order for S29GL01GT10DHI020 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GT10DHI020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GT10DHI020 reliable?
The price and inventory of S29GL01GT10DHI020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GT10DHI020 is usually 5 days.
3.What payment methods are accepted for S29GL01GT10DHI020?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GT10DHI020 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GT10DHI020?
S29GL01GT10DHI020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GT10DHI020 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GT10DHI020?
For technical support, including S29GL01GT10DHI020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GT10DHI020 requirements.
6.How does Aetrix verify that S29GL01GT10DHI020 is sourced from the original manufacturer or authorized distributors?
All S29GL01GT10DHI020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GT10DHI020 meets industry standards.
7.What is the process for return or replacement of S29GL01GT10DHI020?
All S29GL01GT10DHI020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GT10DHI020, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GT10DHI020 part is unused and in its original packaging.
Return procedure for S29GL01GT10DHI020:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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