Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Infineon Technologies S29GL01GT10DHI023

Part No.:
S29GL01GT10DHI023
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
64-LBGA
Datasheet:
AetrixS29GL01GT10DHI023.pdf
Description:
IC FLASH 1GBIT PARALLEL 64FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,458

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

S29GL01GT10DHI023 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, hardware ECC for single-bit correction, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C). It serves as non-volatile program storage in boot code execution and firmware update subsystems of embedded controllers.

For engineers reviewing the S29GL01GT10DHI023 datasheet, S29GL01GT10DHI023 pinout, S29GL01GT10DHI023 application, or S29GL01GT10DHI023 equivalent, key selection criteria include verified 100,000 program/erase cycles, 20-year data retention, CFI-compliant interface, OTP array with four lockable SSR regions, and support for suspend/resume during programming and erase.

Technical Context

This device implements an asynchronous parallel interface with ×8/×16 data bus configuration and byte/word boundary addressing. Its embedded algorithm controller (EAC) manages all program and erase operations, including automatic ECC generation and correction, status monitoring via Status Register/Data Polling/RY/BY# pin, and sector protection through volatile/non-volatile ASP methods.

The architecture includes dedicated address space overlays (ASOs) for Device ID/CFI, Status Register, Data Polling, SSR (OTP), ECC status, and sector protection control. The 2048-byte OTP array contains four lockable sectors (SSR0–SSR3), with SSR0 factory-locked and SSR3 password-read protected - enabling secure boot code and calibration data storage.

Key Specifications

ParameterValue and Actual Design Meaning
Memory density1 Gb (128 MB) - sufficient for full firmware images and multi-application storage in resource-constrained embedded systems
Supply voltage2.7 V to 3.6 V - single VCC operation simplifies power design and eliminates need for separate I/O voltage rails
Random access time100 ns at –40°C to +85°C - enables fast XIP execution without external cache in real-time microcontroller applications
Page access time15 ns - accelerates sequential instruction fetch during boot or interrupt vector loading
Write buffer size512 bytes - reduces effective programming time by batching up to 256 words per command, improving firmware update throughput
ECC capabilityInternal hardware single-bit error correction - maintains data integrity without software overhead or host CPU intervention
Endurance100,000 program/erase cycles - supports field firmware updates over extended product lifecycle in industrial gateways
Data retention20 years - ensures long-term reliability of stored configuration and calibration data without refresh

Pinout & Package

Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-141BA footprint, lead-free and RoHS compliant.

Pin/TerminalCircuit RoleDesign Meaning
A0–A21Address inputs22-bit address bus supporting full 128 MB address space; A0 selects byte/word mode when configured for ×8/×16 operation
DQ0–DQ15Data I/O16-bit bidirectional data bus; operates in ×8 or ×16 mode depending on BYTE# state; supports versatile I/O with VIO = 1.65 V to VCC
CE#Chip enableActive-low chip select; tCE = 100 ns max - defines minimum time between chip enable assertion and valid data output
OE#Output enableActive-low read strobe; tOE = 25 ns max - controls timing of data bus drive during read cycles
WE#Write enableActive-low write strobe; initiates internal program/erase algorithms when combined with command sequences
RY/BY#Ready/Busy indicatorOpen-drain output; low during embedded operations - allows host to poll status without reading Status Register or using Data Polling
RESET#Hardware resetActive-low asynchronous reset; forces device into standby mode and clears internal state, required before power-up initialization
VCCCore supply2.7–3.6 V main supply powering core logic, memory array, and EAC - no separate VPP required
VIOI/O supply1.65–3.6 V - decouples I/O voltage from core supply, enabling direct interfacing with 1.8 V, 2.5 V, or 3.3 V controllers
BYTE#Bus width selectHigh = ×8 mode (DQ0–DQ7 active); Low = ×16 mode (DQ0–DQ15 active) - configures data bus width at power-on

Key Features

FeatureDesign Value
45-nm MIRRORBIT™ processEnables 1 Gb density in compact TSOP package while maintaining industrial-grade reliability and low leakage current
Asynchronous 32-byte page readImproves burst instruction fetch efficiency over standard byte reads, reducing average latency for sequential code execution
Separate 2048-byte OTP arrayProvides immutable storage for secure boot keys, device-specific calibration, or factory-programmed identifiers with hardware-level locking
Advanced sector protection (ASP)Allows independent volatile/non-volatile locking of any 128-KB sector - prevents accidental overwrite of bootloader or safety-critical firmware
Common Flash Interface (CFI)Enables automatic detection of device geometry, timing, and command set by host BIOS or bootloader without hard-coded parameters

Applications

Industrial PLC Firmware StorageAutomotive ADAS Boot Memory

Use Scenario: Storing firmware and configuration data in programmable logic controllers deployed in factory automation environments with wide ambient temperature swings.

IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable instruction storage and field-upgradable application code.

Use Value: 100,000 erase cycles and 20-year retention ensure firmware integrity across 15+ year equipment lifecycles without maintenance.

Use Scenario: Hosting boot code and safety-critical sensor fusion firmware in automotive camera modules requiring AEC-Q100 grade 2 qualification (–40°C to +105°C).

IC Role / Device Role / Timing Role: Primary boot flash with hardware ECC and sector protection to meet ISO 26262 ASIL-B requirements.

Use Value: Internal single-bit ECC eliminates need for external error-handling logic, reducing BOM cost and board area.

Medical Imaging System ConfigurationTelecom Base Station Upgrade Storage

Use Scenario: Retaining calibration profiles, user preferences, and regulatory compliance settings in portable ultrasound devices subject to strict data integrity standards.

IC Role / Device Role / Timing Role: Secure parameter storage using OTP SSR regions with password-protected SSR3 for sensitive calibration constants.

Use Value: Factory-locked SSR0 and password-protected SSR3 prevent unauthorized modification of FDA-approved calibration data.

Use Scenario: Storing field-upgradable protocol stacks and radio firmware in 4G/5G base station remote radio units exposed to outdoor thermal cycling.

IC Role / Device Role / Timing Role: High-reliability firmware archive supporting suspend/resume during over-the-air updates to avoid service interruption.

Use Value: Program/erase suspend capability allows host to service real-time traffic while background firmware writes proceed safely.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S29GL01GP10DHI020Same 1 Gb density and 45-nm MIRRORBIT™ process but uses 64-ball LAE BGA (9 mm × 9 mm); lacks OTP array and SSR protectionTargeted at space-constrained consumer electronics where security and calibration storage are not requiredSelect only if PCB layout favors BGA and OTP functionality is unnecessary
MX29GL128FPTI-90G128-MB (1 Gb) parallel NOR flash from Macronix; 90 ns random access; no integrated ECC; requires external error managementSuitable for cost-sensitive industrial HMI where host MCU handles ECC in softwareChoose when BOM cost reduction outweighs added firmware complexity for error handling

Compared with S29GL01GP10DHI020, this part adds OTP-based security and hardware ECC - critical for certified medical/automotive use; versus MX29GL128FPTI-90G, it offloads ECC processing and guarantees data integrity without host software involvement.

Availability

S29GL01GT10DHI023 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system configuration requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for S29GL01GT10DHI023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global manufacturing and R&D infrastructure.

The GL-T family targets high-reliability embedded systems requiring XIP-capable flash with robust data integrity, security features, and extended temperature operation - specifically designed for industrial control, automotive, and medical applications.

FAQ

Is S29GL01GT10DHI023 pin-compatible with earlier S29GL01GTxxx variants?

Yes - it shares identical 56-pin TSOP pinout and electrical interface with other S29GL01GT devices in the same package variant. Address, data, and control signal assignments match exactly, enabling drop-in replacement where temperature grade and OTP requirements align.

Does this device require external VPP for programming or erasing?

No - S29GL01GT10DHI023 uses single-supply operation (VCC = 2.7–3.6 V) for read, program, and erase functions. No external high-voltage VPP rail is needed, simplifying power design and eliminating associated charge pump circuitry.

How is the OTP array secured against unauthorized access?

The 2048-byte OTP array is divided into four lockable sectors (SSR0–SSR3). SSR0 is permanently locked at factory; SSR3 supports password-based read protection. Locking is performed via dedicated CFI commands and persists through power cycles, enforced by on-die logic without software dependency.

Can the device operate reliably at 105°C junction temperature?

No - S29GL01GT10DHI023 is rated for industrial temperature range (–40°C to +85°C). For +105°C operation, Infineon offers the S29GL01GT10DHI022 variant (Industrial Plus grade), which shares identical functionality but is qualified to –40°C to +105°C with adjusted timing specs.

S29GL01GT10DHI023 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
GL-T
Package/Case:
64-LBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
1Gbit
Memory Organization:
128M x 8
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
60ns
Access Time:
100 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
64-FBGA (9x9)

S29GL01GT10DHI023 FAQ

1.How can I place an order for S29GL01GT10DHI023 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL01GT10DHI023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL01GT10DHI023 reliable?

The price and inventory of S29GL01GT10DHI023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GT10DHI023 is usually 5 days.

3.What payment methods are accepted for S29GL01GT10DHI023?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GT10DHI023 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL01GT10DHI023?

S29GL01GT10DHI023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL01GT10DHI023 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL01GT10DHI023?

For technical support, including S29GL01GT10DHI023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GT10DHI023 requirements.

6.How does Aetrix verify that S29GL01GT10DHI023 is sourced from the original manufacturer or authorized distributors?

All S29GL01GT10DHI023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GT10DHI023 meets industry standards.

7.What is the process for return or replacement of S29GL01GT10DHI023?

All S29GL01GT10DHI023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GT10DHI023, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL01GT10DHI023 part is unused and in its original packaging.

Return procedure for S29GL01GT10DHI023:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

S29GL01GT10DHI023 Tags

  • S29GL01GT10DHI023
  • S29GL01GT10DHI023 PDF
  • S29GL01GT10DHI023 Datasheet
  • S29GL01GT10DHI023 Specifications
  • S29GL01GT10DHI023 Images
  • Infineon Technologies
  • Infineon Technologies S29GL01GT10DHI023
  • Buy S29GL01GT10DHI023
  • S29GL01GT10DHI023 Price
  • S29GL01GT10DHI023 Distributor
  • S29GL01GT10DHI023 Supplier
  • S29GL01GT10DHI023 Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER