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Infineon Technologies S29GL01GT10DHSS20

Part No.:
S29GL01GT10DHSS20
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
64-LBGA
Datasheet:
AetrixS29GL01GT10DHSS20.pdf
Description:
IC FLASH 1GBIT PARALLEL 64FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,560

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Product details

Overview

S29GL01GT10DHSS20 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, hardware ECC for single-bit correction, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C). It is used in boot code storage for network routers requiring fast XIP execution and reliable non-volatile firmware retention.

For engineers reviewing the S29GL01GT10DHSS20 datasheet, S29GL01GT10DHSS20 pinout, S29GL01GT10DHSS20 application, or S29GL01GT10DHSS20 equivalent, key selection criteria include verified 100,000 program/erase cycles, 20-year data retention, CFI-compliant interface, OTP array with four lockable SSR regions, and support for suspend/resume during embedded operations.

Technical Context

This device implements an asynchronous parallel interface with ×8/×16 configurable data bus and byte/word boundary addressing. Its embedded algorithm controller (EAC) manages autonomous program and erase operations, while internal hardware ECC detects and corrects single-bit errors on-the-fly during read cycles.

The versatile I/O feature enables VIO operation from 1.65 V to VCC, decoupling I/O voltage from core supply. Sector protection includes volatile and non-volatile modes per 128-KB sector, and the 2048-byte OTP array provides factory-locked SSR0 and password-protected SSR3 for secure configuration storage.

Key Specifications

ParameterValue and Actual Design Meaning
Memory density1 Gb (128 MB) - sufficient for full boot image + firmware + parameter storage in edge gateway applications
Access time (tACC)100 ns at –40°C to +85°C - enables direct XIP execution without external cache in real-time control systems
Page access time (tPACC)15 ns - accelerates sequential instruction fetch during boot initialization
Write buffer size512 bytes - reduces effective programming time by batching up to 256 words per command
ECC capabilitySingle-bit error correction - ensures data integrity without software overhead in safety-critical firmware storage
Endurance100,000 program/erase cycles - supports field firmware updates over 10+ years of industrial deployment
Data retention20 years at +85°C - meets long-term reliability requirements for infrastructure equipment with no maintenance access

Pinout & Package

Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-141AC footprint, lead-free and RoHS compliant.

Pin/TerminalCircuit RoleDesign Meaning
A0–A21Address inputs22-bit address bus supporting full 128 MB linear addressing with byte/word alignment
DQ0–DQ15Data I/OConfigurable ×8/×16 bidirectional data bus; DQ15 functions as BYTE# in ×8 mode
CE#Chip enableActive-low chip select enabling device participation in parallel bus transactions
OE#Output enableControls output drivers during read cycles; independent of CE# for flexible timing
WE#Write enableInitiates write/program/erase commands when asserted with valid address/data
RY/BY#Ready/Busy indicatorOpen-drain status signal indicating ongoing embedded operation completion
VCCCore supply2.7 V–3.6 V single supply powering logic and memory array; no separate VPP required
VIOI/O supply1.65 V–VCC versatile I/O voltage allowing interfacing with mixed-voltage SoCs

Key Features

FeatureDesign Value
Hardware ECC engineOn-die single-bit error correction eliminates need for external error-handling logic in boot ROM applications
512-byte write bufferEnables 1.14 MBps effective programming rate - cuts firmware update time by >70% vs. single-word programming
Uniform 128-KB sectorsAllows precise, non-disruptive firmware partitioning (e.g., bootloader, kernel, config) without wear-leveling overhead
OTP array with SSR lockingFour 512-byte SSR regions (SSR0–SSR3) provide tamper-resistant storage for keys, calibration data, and MAC addresses
Suspend/Resume supportPermits high-priority interrupt servicing during long erase operations - critical for real-time deterministic response

Applications

Industrial Control PLCTelecom Edge Router

Use Scenario: Storing boot firmware and real-time motion control algorithms in programmable logic controllers deployed in factory automation lines.

IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable instruction fetch with <100 ns latency to meet deterministic scan cycle deadlines.

Use Value: Eliminates external SRAM caching; 20-year data retention ensures firmware persistence across 15+ year equipment lifecycles without refresh.

Use Scenario: Holding boot loader, OS kernel, and configuration tables in carrier-grade edge routers operating in temperature-controlled central offices.

IC Role / Device Role / Timing Role: Primary parallel NOR flash for secure, fast-recovery firmware storage with CFI-compliant interface for BIOS/UEFI compatibility.

Use Value: Hardware ECC prevents silent corruption of critical boot code; OTP SSR3 stores encrypted keys for secure boot verification.

Automotive ADAS ECUMedical Imaging Gateway

Use Scenario: Storing calibrated sensor fusion firmware and fail-safe routines in AEC-Q100 Grade 2 ADAS ECUs operating at –40°C to +105°C.

IC Role / Device Role / Timing Role: Automotive-qualified parallel flash delivering guaranteed performance across extended temperature range with sector-level protection.

Use Value: 100,000 endurance cycles support OTA firmware updates over vehicle lifetime; ASP enables selective lock of safety-critical sectors.

Use Scenario: Retaining DICOM protocol stack and regulatory-compliant diagnostic firmware in FDA-cleared medical imaging gateways requiring audit-trail firmware integrity.

IC Role / Device Role / Timing Role: Trusted firmware repository with hardware ECC and OTP-based secure signature storage for regulatory traceability.

Use Value: Single-bit ECC detection satisfies IEC 62304 SW safety Class C requirements; factory-locked SSR0 stores immutable device identity.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S29GL01GT11DHSS20Same die, but rated for –40°C to +105°C industrial plus grade; identical timing and featuresRequired for extended temperature environments (e.g., outdoor base stations, under-hood automotive)Select when ambient operating temperature exceeds +85°C; otherwise, S29GL01GT10DHSS20 is cost-optimized for standard industrial use
MX29GL128FPTI-90G128 MB ×16, 90 ns tACC, Macronix; lacks OTP array and hardware ECC; CFI-compatible but no SSR lockingSuitable for cost-sensitive consumer devices where firmware integrity is managed in softwareChoose only if ECC and secure OTP are not required; verify CFI command set compatibility before migration

Compared with S29GL01GT10DHSS20, the +105°C variant offers broader thermal margin without functional trade-offs, while the Macronix part sacrifices hardware reliability features for lower unit cost-making it viable only in non-safety-critical contexts.

Availability

S29GL01GT10DHSS20 is available at Aetrix Electronics and suitable for industrial control PLCs, telecom edge routers, automotive ADAS ECUs, and medical imaging gateways requiring stable component supply across multi-year production programs.

Supply support for S29GL01GT10DHSS20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global R&D and manufacturing infrastructure.

The GL-T family targets high-reliability embedded systems needing fast XIP-capable flash with robust data integrity, combining high-density storage and deterministic timing for mission-critical firmware.

FAQ

Is S29GL01GT10DHSS20 pin-compatible with earlier S29GL series devices?

Yes, it maintains identical 56-pin TSOP pinout and signal mapping with S29GL512T and S29GL01GP devices, including CE#, OE#, WE#, RY/BY#, and address/data bus assignments. However, the enhanced 45-nm process enables faster timing and lower power, so timing margins must be re-validated in legacy designs.

Does this device require an external VPP voltage for programming?

No. S29GL01GT10DHSS20 uses single-supply operation: VCC (2.7 V–3.6 V) powers both core logic and the memory array during read, program, and erase. No external high-voltage pump or VPP pin is present or required.

How is the OTP array protected against accidental overwrite?

The 2048-byte OTP array is divided into four 512-byte SSR regions (SSR0–SSR3). SSR0 is factory-locked permanently; SSR1 and SSR2 can be locked via command sequence; SSR3 supports password-based read protection. Once locked, no command can modify its contents.

Can S29GL01GT10DHSS20 operate with a 1.8 V I/O interface?

Yes. Its versatile I/O feature supports VIO from 1.65 V to VCC. When VCC = 3.3 V, VIO may be set to 1.8 V, enabling direct connection to 1.8 V SoC buses without level shifters-provided timing parameters (e.g., tOE, tCE) are met at that VIO level.

S29GL01GT10DHSS20 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
GL-T
Package/Case:
64-LBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
1Gbit
Memory Organization:
128M x 8
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
60ns
Access Time:
100 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
0°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
64-FBGA (9x9)

S29GL01GT10DHSS20 FAQ

1.How can I place an order for S29GL01GT10DHSS20 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL01GT10DHSS20 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL01GT10DHSS20 reliable?

The price and inventory of S29GL01GT10DHSS20 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GT10DHSS20 is usually 5 days.

3.What payment methods are accepted for S29GL01GT10DHSS20?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GT10DHSS20 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL01GT10DHSS20?

S29GL01GT10DHSS20 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL01GT10DHSS20 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL01GT10DHSS20?

For technical support, including S29GL01GT10DHSS20 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GT10DHSS20 requirements.

6.How does Aetrix verify that S29GL01GT10DHSS20 is sourced from the original manufacturer or authorized distributors?

All S29GL01GT10DHSS20 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GT10DHSS20 meets industry standards.

7.What is the process for return or replacement of S29GL01GT10DHSS20?

All S29GL01GT10DHSS20 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GT10DHSS20, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL01GT10DHSS20 part is unused and in its original packaging.

Return procedure for S29GL01GT10DHSS20:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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