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Infineon Technologies S29GL01GT10FAI010
- Part No.:
- S29GL01GT10FAI010
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL01GT10FAI010.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,235
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Product details
Overview
S29GL01GT10FAI010 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, internal hardware ECC for single-bit error correction, and uniform 128-KB sector erase-designed for boot code storage in industrial embedded controllers requiring deterministic XIP execution.
For engineers reviewing the S29GL01GT10FAI010 datasheet, S29GL01GT10FAI010 pinout, S29GL01GT10FAI010 application, or S29GL01GT10FAI010 equivalent, key selection criteria include verified 128-KB uniform sector architecture, Versatile I/O support (1.65 V–VCC), AEC-Q100 Grade 3 qualification, 100,000 program/erase cycles, and CFI-compliant software interface compatibility.
Technical Context
This device implements an asynchronous parallel interface with ×8/×16 data bus configuration and byte/word boundary addressing. Its embedded algorithm controller (EAC) manages all program and erase operations-including suspend/resume-and integrates automatic ECC generation and checking during read/write cycles.
The flash array is organized into uniform 128-KB sectors with independent protection control via Advanced Sector Protection (ASP), supporting both volatile and non-volatile lock states. The separate 2048-byte OTP array includes four lockable regions (SSR0–SSR3), with SSR0 factory-locked and SSR3 password-read protected.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 1 Gb (128 MB) - supports full boot image storage for ARM Cortex-A/R-based industrial gateways |
| Access time (tACC) | 100 ns at –40°C to +85°C - enables direct XIP execution without external cache penalty |
| Page access time (tPACC) | 15 ns - accelerates sequential instruction fetch in boot loader initialization |
| Write buffer size | 512 bytes - reduces effective programming time by batching up to 256 words per operation |
| ECC capability | Single-bit error correction - ensures data integrity during long-term storage in unattended edge devices |
| Endurance | 100,000 program/erase cycles - meets field upgrade requirements for telecom baseband firmware |
| Data retention | 20 years - validated for use in infrastructure equipment with >10-year deployment lifecycles |
Pinout & Package
Package: 56-pin TSOP (Type I, 400 mil width), RoHS-compliant, JEDEC standard footprint compatible with legacy socket designs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 | Address inputs | 24-bit address bus supporting full 128 MB linear addressing with byte/word alignment |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; operates in ×8 or ×16 mode per configuration pins |
| CE# | Chip enable | Active-low chip select enabling device participation in parallel bus transactions |
| OE# | Output enable | Controls output drivers during read cycles; decoupled from CE# for flexible timing |
| WE# | Write enable | Initiates internal program/erase algorithms when asserted with valid address/data |
| RY/BY# | Ready/Busy indicator | Open-drain status signal indicating ongoing embedded operations (low = busy) |
| VCC | Core supply | 2.7–3.6 V single supply powering logic and memory array; no auxiliary voltage required |
| VIO | I/O supply | 1.65–VCC versatile I/O voltage allowing interface to mixed-voltage SoC buses |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O voltage range | VIO supports 1.65 V–VCC - eliminates level-shifter requirement when interfacing with 1.8 V or 3.3 V host processors |
| Uniform 128-KB sector architecture | Enables precise firmware partitioning (e.g., bootloader, kernel, filesystem) with independent lock/unlock control per sector |
| Hardware ECC engine | On-the-fly single-bit correction without CPU intervention - critical for fail-safe boot in safety-critical systems |
| Suspend/Resume capability | Allows interruption of erase or program operations to service high-priority reads - maintains real-time responsiveness |
| CFI parameter table | Standardized software discovery mechanism enabling OS/driver auto-configuration without hard-coded timing parameters |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot firmware and runtime configuration for programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Primary non-volatile boot memory providing XIP-capable instruction fetch with <100 ns latency to meet deterministic scan cycle deadlines. Use Value: Uniform 128-KB sectors allow isolated updates of motion control modules without risking corruption of safety-critical I/O driver code. | Use Scenario: Holding boot code and sensor calibration data for radar processing units in Level 2+ ADAS systems. IC Role / Device Role / Timing Role: AEC-Q100 Grade 3 qualified parallel NOR flash serving as trusted boot source for TI TDA4VM SoC during cold start. Use Value: Hardware ECC ensures integrity of radar firmware after 15+ years of thermal cycling in under-hood environments. |
| Telecom Base Station BIOS | Medical Imaging System Configuration |
Use Scenario: Storing BIOS and FPGA configuration bitstreams in 5G macro base station remote radio units (RRUs). IC Role / Device Role / Timing Role: High-reliability parallel flash with 20-year data retention used for field-upgradable system-level firmware. Use Value: 512-byte write buffer cuts OTA firmware update time by 3.2× versus legacy 16-byte page programming. | Use Scenario: Retaining DICOM configuration profiles and calibration coefficients in portable ultrasound scanners. IC Role / Device Role / Timing Role: Non-volatile storage for regulatory-critical settings requiring tamper-proof write protection and audit trail capability. Use Value: Four-lockable OTP regions (SSR0–SSR3) enable secure storage of FDA-mandated calibration keys with factory-locked root key (SSR0). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GT10TFI010 | Same die, TSOP package, but rated for –40°C to +105°C (Industrial Plus grade) | Required for extended temperature deployments such as outdoor wireless infrastructure | Select when ambient operating temperature exceeds +85°C but does not require automotive qualification |
| S29GL01GT11FAI020 | Identical specs but with 64-ball LAE BGA (9 mm × 9 mm) instead of 56-pin TSOP | Used where board space constraints prohibit TSOP footprints and BGA reflow is supported | Select when migrating from through-hole to compact surface-mount layout with automated assembly |
Compared with S29GL01GT10FAI010, the TSOP-based S29GL01GT10TFI010 extends thermal range without changing interface or timing, while the LAE BGA variant S29GL01GT11FAI020 reduces PCB area by 42% but requires BGA routing expertise and reflow process validation.
Availability
S29GL01GT10FAI010 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and telecom base station BIOS requiring stable component supply across multi-year production programs.
Supply support for S29GL01GT10FAI010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and non-volatile memory solutions for industrial and automotive markets.
The GL-T family targets high-reliability embedded systems needing deterministic boot performance and long-term data integrity, combining XIP speed with data-storage density in a single parallel flash architecture.
FAQ
What is the maximum operating temperature range for S29GL01GT10FAI010?
S29GL01GT10FAI010 is rated for the Industrial temperature range of –40°C to +85°C. This grade is validated per JEDEC JESD22-A108 and supports continuous operation within this envelope without derating. It is not qualified to AEC-Q100 or extended temperature grades unless explicitly marked with corresponding suffixes (e.g., "I020" for +105°C).
Does S29GL01GT10FAI010 support both ×8 and ×16 data bus configurations?
Yes, S29GL01GT10FAI010 supports configurable ×8 or ×16 operation via hardware pin strapping (BYTE# input). When BYTE# is low, the device operates in ×16 mode with DQ0–DQ15 active; when high, it operates in ×8 mode with only DQ0–DQ7 used. Address lines remain identical in both modes.
How is hardware ECC implemented and what errors does it correct?
S29GL01GT10FAI010 includes on-die ECC circuitry that automatically generates and checks Hamming codes during every read and write. It detects and corrects all single-bit errors per 512-byte sector and flags uncorrectable multi-bit errors via the Status Register's ECCERR bit. No external ECC controller or software overhead is required.
Can the OTP array be reprogrammed after initial programming?
No. The 2048-byte OTP array consists of one-time programmable fuses. Once a region (SSR0–SSR3) is locked-either by factory setting (SSR0) or user command-it cannot be unlocked or rewritten. SSR3 supports password-based read protection, but write access remains permanently disabled after first programming.
S29GL01GT10FAI010 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL01GT10FAI010 FAQ
1.How can I place an order for S29GL01GT10FAI010 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GT10FAI010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GT10FAI010 reliable?
The price and inventory of S29GL01GT10FAI010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GT10FAI010 is usually 5 days.
3.What payment methods are accepted for S29GL01GT10FAI010?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GT10FAI010 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GT10FAI010?
S29GL01GT10FAI010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GT10FAI010 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GT10FAI010?
For technical support, including S29GL01GT10FAI010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GT10FAI010 requirements.
6.How does Aetrix verify that S29GL01GT10FAI010 is sourced from the original manufacturer or authorized distributors?
All S29GL01GT10FAI010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GT10FAI010 meets industry standards.
7.What is the process for return or replacement of S29GL01GT10FAI010?
All S29GL01GT10FAI010 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GT10FAI010, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GT10FAI010 part is unused and in its original packaging.
Return procedure for S29GL01GT10FAI010:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL01GT10FAI010 Tags
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