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Infineon Technologies S29GL01GT10FAI013
- Part No.:
- S29GL01GT10FAI013
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL01GT10FAI013.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,693
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Product details
Overview
S29GL01GT10FAI013 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, hardware ECC for single-bit correction, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C). It is used in boot code storage for industrial controllers requiring fast XIP execution and reliable non-volatile data retention.
For engineers reviewing the S29GL01GT10FAI013 datasheet, S29GL01GT10FAI013 pinout, S29GL01GT10FAI013 application, or S29GL01GT10FAI013 equivalent, key selection factors include its 128-KB uniform sector architecture, Versatile I/O (1.65 V to VCC), CFI compliance, OTP array with four lockable SSR regions, and AEC-Q100 grade 3 qualification for automotive control modules.
Technical Context
The device implements an embedded algorithm controller (EAC) that executes program/erase operations autonomously without host CPU intervention, supporting suspend/resume during both operations. Its status monitoring uses three concurrent methods: Status Register polling, Data Polling (DQ7), and RY/BY# pin assertion.
Memory organization includes a main array of 128 KB uniform sectors, a dedicated 2048-byte one-time programmable (OTP) array divided into four lockable sectors (SSR0–SSR3), and Common Flash Interface (CFI) parameter tables accessible at fixed address offsets for runtime configuration discovery.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 1 Gb (128 MB) - supports full firmware image storage for mid-tier microcontrollers |
| Random access time | 100 ns at –40°C to +85°C - enables direct XIP execution without cache penalty |
| Page access time | 15 ns - accelerates sequential instruction fetch within 32-byte pages |
| Write buffer size | 512 bytes - reduces average programming time by batching up to 256 words per command |
| ECC capability | Internal hardware single-bit error correction - maintains data integrity without software overhead |
| Endurance | 100,000 program/erase cycles - suitable for field-upgradable firmware with frequent updates |
| Data retention | 20 years at +85°C - ensures long-term reliability in sealed industrial enclosures |
Pinout & Package
Package: 56-pin TSOP (Type I, standard pitch), JEDEC MO-141AC compliant, body size 18.4 mm × 10.16 mm × 1.2 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A20 | Address inputs | 21-bit address bus supporting full 128 MB linear addressing (byte/word boundary aligned) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional bus; configurable as ×8 or ×16 via BYTE# pin; supports Versatile I/O (1.65 V to VCC) |
| CE# | Chip enable | Active-low device select; tCE = 100 ns max - critical for timing-critical boot ROM access |
| OE# | Output enable | Active-low read strobe; tOE = 25 ns - enables fast data sampling in high-speed bus interfaces |
| WE# | Write enable | Active-low write strobe; controls latching of command/data during programming/erase |
| RY/BY# | Ready/Busy output | Open-drain status indicator; asserts low during embedded operations - eliminates need for polling loops |
| RESET# | Hardware reset | Active-low asynchronous reset; restores device to read mode and clears internal state |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O voltage range | VIO supports 1.65 V to VCC - simplifies interface to mixed-voltage SoCs without level shifters |
| Uniform 128-KB sector architecture | No boot-block or parameter sectors - enables deterministic firmware partitioning and OTA update scheduling |
| Four-lockable OTP sectors (SSR0–SSR3) | SSR0 factory-locked, SSR3 password-protected - secures bootloader keys and calibration data against overwrite |
| CFI-compliant parameter table | Standardized JEDEC JESD68 query structure - enables automatic driver initialization in Linux/U-Boot environments |
| Suspend/Resume for program & erase | Allows interrupting long operations (e.g., 245 KBps sector erase) to service real-time interrupts - essential for hard real-time systems |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot firmware and configuration data in programmable logic controllers deployed in factory automation cabinets. IC Role / Device Role / Timing Role: Non-volatile boot ROM providing XIP-capable instruction fetch with ≤100 ns latency to ARM Cortex-M7 MCU. Use Value: Uniform 128-KB sectors allow atomic firmware updates without risking partial corruption; 20-year retention ensures 15+ year product lifecycle support. | Use Scenario: Holding safety-critical boot code for radar ECU in ISO 26262 ASIL-B systems. IC Role / Device Role / Timing Role: AEC-Q100 Grade 3 qualified parallel NOR flash serving as primary boot device for TI TDA4VM SoC. Use Value: Hardware ECC and 100K-cycle endurance meet ASIL-B fault containment requirements; CFI enables verified driver compatibility across ECU generations. |
| Medical Imaging System Configuration | Telecom Base Station BIOS |
Use Scenario: Storing calibration profiles and FPGA bitstreams in portable ultrasound devices requiring field recalibration. IC Role / Device Role / Timing Role: Secure configuration store with OTP-locked SSR3 protecting proprietary transducer calibration coefficients. Use Value: Password-protected SSR3 prevents unauthorized modification; Versatile I/O allows direct interfacing to 1.8 V FPGA configuration bus. | Use Scenario: Hosting BIOS and FPGA configuration images in carrier-grade 5G baseband units operating in extended temperature environments. IC Role / Device Role / Timing Role: High-reliability boot memory supporting –40°C to +105°C operation with 120 ns access at upper range. Use Value: Extended temperature grade and 20-year retention ensure uninterrupted operation in uncooled outdoor cabinets over 10+ years. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GT10FHIV10 | Same die, 64-ball LAE BGA (9 mm × 9 mm); no TSOP option; identical timing and feature set | Preferred for space-constrained PCBs where 56-pin TSOP footprint is prohibitive | Select when board layout requires BGA packaging and thermal profile supports reflow-compatible mounting |
| MX29GL128FDTM2I-90G | 128 MB, 90 ns random access, no hardware ECC, no OTP array, different CFI layout | Lacks ECC and secure OTP - unsuitable for safety-critical or secure boot use cases | Consider only for cost-sensitive, non-safety applications where firmware integrity is managed externally |
Compared with S29GL01GT10FAI013, the LAE BGA variant offers identical functionality in smaller form factor, while the Macronix part omits ECC and OTP-making it viable only where external error handling and open security models are acceptable.
Availability
S29GL01GT10FAI013 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system configuration requiring stable component supply across multi-year production cycles.
Supply support for S29GL01GT10FAI013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and industrial memory solutions, with global manufacturing and quality certification to ISO/TS 16949 and AEC-Q100.
The GL-T family targets high-reliability embedded systems needing XIP-capable parallel NOR flash with integrated ECC, secure OTP, and extended temperature operation - specifically designed for automotive, industrial, and medical applications demanding long-term data integrity.
FAQ
What is the purpose of the SSR0–SSR3 regions in the OTP array?
SSR0–SSR3 are four independent 512-byte sectors within the 2048-byte OTP array. SSR0 is factory-locked and immutable; SSR1 and SSR2 are user-lockable via command sequence; SSR3 supports password-based read protection. They store cryptographic keys, calibration data, or device-specific identifiers that must survive field updates and resist tampering.
Does S29GL01GT10FAI013 support byte-level writes?
No - it supports only word (16-bit) or byte (8-bit) writes depending on BYTE# pin state, but all programming occurs in minimum 512-byte buffer increments. Single-word programming is possible only within a buffer-aligned 512-byte page; true byte-level random writes are not supported due to NOR flash architecture constraints.
How does the Versatile I/O feature affect interface design?
Versatile I/O allows VIO to operate independently from VCC across 1.65 V to VCC, enabling direct connection to 1.8 V or 2.5 V logic buses without external level shifters. This reduces BOM count and signal integrity risk in mixed-voltage SoC designs, provided VIO remains within spec relative to the driving interface's output swing.
Can the device be used in synchronous interface modes?
No - S29GL01GT10FAI013 is strictly asynchronous. It lacks clock input, DLL, or strobe signals required for synchronous operation. All timing is governed by CE#, OE#, and WE# setup/hold relationships relative to address/data edges, per AC specifications in the datasheet's Table 11-4.
S29GL01GT10FAI013 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL01GT10FAI013 FAQ
1.How can I place an order for S29GL01GT10FAI013 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GT10FAI013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GT10FAI013 reliable?
The price and inventory of S29GL01GT10FAI013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GT10FAI013 is usually 5 days.
3.What payment methods are accepted for S29GL01GT10FAI013?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GT10FAI013 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GT10FAI013?
S29GL01GT10FAI013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GT10FAI013 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GT10FAI013?
For technical support, including S29GL01GT10FAI013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GT10FAI013 requirements.
6.How does Aetrix verify that S29GL01GT10FAI013 is sourced from the original manufacturer or authorized distributors?
All S29GL01GT10FAI013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GT10FAI013 meets industry standards.
7.What is the process for return or replacement of S29GL01GT10FAI013?
All S29GL01GT10FAI013 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GT10FAI013, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GT10FAI013 part is unused and in its original packaging.
Return procedure for S29GL01GT10FAI013:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL01GT10FAI013 Tags
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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
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AT21CS01-STUM10-T
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24LC01BT-I/OT
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M24C02-FMC6TG
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AT24CS02-SSHM-T
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93LC46BT-I/OT
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AT24C04C-SSHM-T
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24LC01BT-I/SN
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24AA02UIDT-I/OT
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AT24C08C-STUM-T
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