Infineon Technologies S29GL01GT10FAI020
- Part No.:
- S29GL01GT10FAI020
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL01GT10FAI020.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 64FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
S29GL01GT10FAI020 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, internal hardware ECC for single-bit error correction, and uniform 128-KB sector erase - deployed in industrial embedded systems requiring reliable code storage and XIP execution.
For engineers reviewing the S29GL01GT10FAI020 datasheet, S29GL01GT10FAI020 pinout, S29GL01GT10FAI020 application, or S29GL01GT10FAI020 equivalent, key selection criteria include its 128-KB uniform sector architecture, Versatile I/O support (1.65 V–VCC), AEC-Q100 Grade 2 qualification (–40°C to +105°C), and CFI-compliant interface for bootloader and firmware image storage.
Technical Context
This device implements an asynchronous parallel interface with ×8/×16 data bus configuration, supporting byte- and word-aligned addressing. Its embedded algorithm controller (EAC) manages program, erase, suspend/resume, and status monitoring without external intervention.
The internal ECC engine operates transparently during read cycles, correcting single-bit errors in real time while reporting uncorrectable multi-bit errors via status register bits. Sector protection uses both volatile (lock bits) and non-volatile (ASP) methods, with four OTP lockable regions including factory-locked SSR0 and password-protected SSR3.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 1 Gb (128 MB) - supports full firmware images and boot code for mid-range microcontrollers |
| Access time (tACC) | 100 ns at –40°C to +85°C - enables direct XIP execution from flash without SRAM caching |
| Page access time (tPACC) | 15 ns - accelerates sequential instruction fetch in burst-read scenarios |
| Write buffer size | 512 bytes - reduces effective programming time by batching up to 256 words per command |
| Erase endurance | 100,000 cycles per sector - ensures long-term field reliability in firmware update applications |
| Data retention | 20 years at +85°C - meets industrial lifecycle requirements for unattended operation |
| Operating voltage (VCC) | 2.7 V to 3.6 V - compatible with 3.3 V logic rails and tolerant of supply droop during system power transitions |
| I/O voltage range (VIO) | 1.65 V to VCC - allows interoperability with mixed-voltage SoCs and FPGAs |
Pinout & Package
Package: 56-pin TSOP (Type I, 400 mil width), RoHS-compliant, lead-free, JEDEC standard.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 | Address inputs | 24-bit address bus supporting full 128 MB linear space; byte/word aligned |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional bus; configurable as ×8 or ×16 via BYTE# signal |
| CE# | Chip enable | Active-low chip select; controls device power state and command latching |
| OE# | Output enable | Active-low read strobe; gates output drivers during read operations |
| WE# | Write enable | Active-low control for write/program/erase command initiation |
| RY/BY# | Ready/Busy indicator | Open-drain output signaling active embedded operations (program/erase) |
| RESET# | Hardware reset | Active-low asynchronous reset that halts all operations and clears status registers |
| VCC / VIO | Power supplies | VCC = core supply (2.7–3.6 V); VIO = I/O supply (1.65–VCC) - independently configurable |
Key Features
| Feature | Design Value |
|---|---|
| 45-nm MIRRORBIT™ process | Enables higher density and lower leakage vs. older floating-gate NOR, improving standby current (100 μA at +85°C) |
| Internal hardware ECC | Single-bit error correction on every read cycle without software overhead or latency penalty |
| 512-byte programming buffer | Reduces average programming time by >60% vs. single-word writes for firmware patch updates |
| Uniform 128-KB sectors | Eliminates complexity of variable-sector architectures; simplifies partitioning for bootloader + app + config |
| CFI parameter table | Enables automatic driver detection and configuration in U-Boot, Linux MTD, and RTOS flash abstraction layers |
| ASP + OTP array | Supports secure boot via factory-locked SSR0 and password-protected SSR3 for critical configuration storage |
Applications
| Industrial HMI Controller | Automotive ADAS ECU |
|---|---|
|
Use Scenario: Storing boot firmware, GUI assets, and calibration tables in panel-mounted HMIs with extended temperature operation. IC Role / Device Role / Timing Role: Non-volatile code storage with XIP capability and deterministic 100 ns read latency for real-time UI response. Use Value: Eliminates need for external SRAM cache; 20-year data retention ensures field longevity without recalibration. |
Use Scenario: Holding sensor fusion firmware and safety-critical boot code in radar or camera ECUs certified to AEC-Q100 Grade 2. IC Role / Device Role / Timing Role: Primary boot memory with hardware ECC and sector-level write protection for ASIL-B compliance. Use Value: Internal ECC satisfies ISO 26262 fault-detection requirements; 100,000 erase cycles support over-the-air update logging. |
| Medical Diagnostic Imaging | Energy Grid RTU |
|
Use Scenario: Storing FPGA configuration bitstreams and diagnostic firmware in portable ultrasound devices requiring Class II medical certification. IC Role / Device Role / Timing Role: Configuration and firmware repository with CFI auto-detection for field-upgradable modules. Use Value: Versatile I/O (1.65 V–3.6 V) interfaces directly with low-voltage FPGAs; OTP regions store encryption keys securely. |
Use Scenario: Hosting communication protocol stacks and metering firmware in remote terminal units deployed in substations (-40°C to +105°C). IC Role / Device Role / Timing Role: Field-updatable firmware storage with suspend/resume during grid transients to prevent corruption. Use Value: Sector erase suspend allows safe interruption of firmware updates during brownouts or lightning surges. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GT10FHIV10 | Same die, 64-ball LAE BGA (9 mm × 9 mm); no TSOP option; identical timing and ECC | Targeted for space-constrained PCBs where footprint reduction outweighs hand-solderability | Select when board layout prioritizes density over rework accessibility |
| MX29GL128FPTI-90G | 128-MB (1 Gb), 90 ns tACC, no built-in ECC; requires external error handling or SW ECC | Lacks hardware ECC and OTP security features; lower cost but higher validation burden | Choose only if firmware update frequency is low and ECC can be implemented in host software |
Compared with S29GL01GT10FAI020, the LAE BGA variant offers identical functionality in smaller area, while the Macronix part trades hardware ECC and OTP security for lower unit cost - making Infineon's device preferred for safety- or security-critical deployments.
Availability
S29GL01GT10FAI020 is available at Aetrix Electronics and suitable for industrial HMI controllers, automotive ADAS ECUs, medical imaging systems, and energy grid RTUs requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S29GL01GT10FAI020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions with global manufacturing and quality certification (ISO/TS 16949, AEC-Q100).
The GL-T family targets embedded systems needing robust, high-density NOR flash with XIP performance and automotive-grade reliability - designed specifically for code storage in safety-critical and long-lifecycle applications.
FAQ
Does S29GL01GT10FAI020 support both ×8 and ×16 data bus modes?
Yes, it supports both configurations via the BYTE# pin: asserted low for ×16 mode (DQ0–DQ15 active), high for ×8 mode (DQ0–DQ7 active). Address lines remain unchanged; A0 is LSB in both modes. This flexibility allows reuse across 8-bit and 16-bit microcontroller designs without hardware modification.
What is the function of the SSR0–SSR3 OTP regions?
SSR0–SSR3 are four 2048-byte one-time-programmable arrays. SSR0 is factory-locked and used for permanent device ID or calibration data. SSR3 supports password-based read protection. SSR1 and SSR2 are user-lockable for secure boot keys or cryptographic seeds, enabling tamper-resistant firmware authentication.
How does the suspend/resume feature work during sector erase?
The device accepts a Suspend Erase command at any point during sector erase, halting the operation and returning status within 20 µs. Resume Erase restores the exact erase state. This prevents data corruption during unexpected power loss or host interrupts - critical for field-upgrade reliability in unattended systems.
Is the CFI table accessible without issuing commands?
Yes, the Common Flash Interface parameter table is mapped to fixed address offsets (0x0055, 0x0056, etc.) and readable using standard read cycles after entering CFI query mode with the 0x98 command. No special timing or voltage is required - it enables automatic driver initialization in Linux MTD and U-Boot environments.
S29GL01GT10FAI020 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL01GT10FAI020 FAQ
1.How can I place an order for S29GL01GT10FAI020 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GT10FAI020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GT10FAI020 reliable?
The price and inventory of S29GL01GT10FAI020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GT10FAI020 is usually 5 days.
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S29GL01GT10FAI020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GT10FAI020 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GT10FAI020?
For technical support, including S29GL01GT10FAI020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GT10FAI020 requirements.
6.How does Aetrix verify that S29GL01GT10FAI020 is sourced from the original manufacturer or authorized distributors?
All S29GL01GT10FAI020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GT10FAI020 meets industry standards.
7.What is the process for return or replacement of S29GL01GT10FAI020?
All S29GL01GT10FAI020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GT10FAI020, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GT10FAI020 part is unused and in its original packaging.
Return procedure for S29GL01GT10FAI020:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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