Infineon Technologies S29GL01GT10FAI023
- Part No.:
- S29GL01GT10FAI023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL01GT10FAI023.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 64FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
S29GL01GT10FAI023 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, hardware ECC for single-bit correction, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C). It is used in boot code storage for industrial controllers requiring fast XIP execution and reliable non-volatile data retention.
For engineers reviewing the S29GL01GT10FAI023 datasheet, S29GL01GT10FAI023 pinout, S29GL01GT10FAI023 application, or S29GL01GT10FAI023 equivalent, key selection criteria include verified 100,000 program/erase cycles, OTP array with four lockable SSR regions, CFI-compliant interface, and support for both ×8 and ×16 data bus configurations in TSOP and FBGA packages.
Technical Context
The S29GL01GT10FAI023 implements an embedded algorithm controller (EAC) that executes autonomous program and erase operations without host intervention. Its architecture supports asynchronous read, page-mode read, suspend/resume commands, and status monitoring via Status Register, Data Polling, or RY/BY# pin.
It integrates hardware-based ECC for real-time single-bit error correction during read operations and includes advanced sector protection (ASP) with volatile/non-volatile locking per sector. The device uses Common Flash Interface (CFI) parameter tables for standardized software identification and configuration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 1 Gb (128 MB) - supports full firmware image storage for mid-tier microcontrollers |
| Supply voltage (VCC) | 2.7 V to 3.6 V - enables direct integration with 3.3 V system rails without level shifting |
| Random access time (tACC) | 100 ns at –40°C to +85°C - meets timing requirements for real-time boot code fetch in industrial PLCs |
| Page access time (tPACC) | 15 ns - accelerates sequential instruction fetch during XIP operation |
| Write buffer size | 512 bytes - reduces effective programming time by up to 4× vs. single-word writes |
| ECC capability | Single-bit error correction - ensures data integrity without software overhead in safety-critical systems |
| Endurance | 100,000 program/erase cycles - qualifies for long-life field deployments in telecom infrastructure |
| Data retention | 20 years - guarantees firmware persistence across product lifecycle without refresh |
Pinout & Package
This device is packaged in a 56-pin TSOP (Thin Small Outline Package) with standard JEDEC MO-142AC footprint, compatible with automated PCB assembly and reflow profiles for industrial applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 | Address inputs | 24-bit address bus supporting full 128 MB linear addressing with byte/word boundary alignment |
| DQ0–DQ15 | Data I/O (×16 mode) | Bidirectional 16-bit data bus; configurable as DQ0–DQ7 in ×8 mode via BYTE# control |
| CE# | Chip enable | Active-low chip select enabling device participation in memory-mapped bus transactions |
| OE# | Output enable | Controls output drivers during read cycles; decouples data bus contention in multi-device systems |
| WE# | Write enable | Initiates internal program/erase algorithms when asserted with valid address/data setup |
| RY/BY# | Ready/Busy indicator | Open-drain output signaling active embedded operation; eliminates need for polling loops |
| RESET# | Hardware reset | Asynchronous pin forcing device into reset state, clearing status registers and halting ongoing operations |
| VIO | I/O supply | Independent 1.65 V to VCC input allowing interfacing with mixed-voltage logic families |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O (VIO) | Supports 1.65 V to VCC I/O voltage - enables direct connection to 1.8 V, 2.5 V, or 3.3 V controllers without external level shifters |
| 512-byte programming buffer | Enables burst programming of up to 512 bytes per command - cuts firmware update time in embedded gateways by >70% vs. legacy flash |
| Hardware ECC | On-the-fly single-bit error correction - maintains functional safety compliance (IEC 61508 SIL2) without CPU intervention |
| OTP array with SSR locking | 2048-byte one-time-programmable space segmented into four lockable regions (SSR0–SSR3), with SSR0 factory-locked and SSR3 password-protected - secures bootloader keys and calibration data |
| CFI compliance | Standardized parameter table accessible via read commands - allows generic flash drivers to auto-detect geometry, timing, and command set |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot firmware and runtime configuration for programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable instruction fetch with ≤100 ns latency to meet deterministic scan cycle timing. Use Value: 128 MB capacity accommodates dual-image firmware with rollback support; 100,000-cycle endurance ensures >10-year field life under frequent OTA updates. | Use Scenario: Holding boot code and sensor calibration data for radar processing units in AEC-Q100 grade 2 automotive systems (–40°C to +105°C). IC Role / Device Role / Timing Role: Safety-critical boot memory with hardware ECC and OTP-secured calibration parameters for ISO 26262 ASIL-B compliance. Use Value: SSR3 password protection prevents unauthorized calibration tampering; 20-year data retention guarantees integrity over vehicle lifetime. |
| Telecom Base Station Configuration | Medical Imaging System BIOS |
Use Scenario: Storing FPGA configuration bitstreams and protocol stack binaries in 5G remote radio units exposed to wide thermal cycling. IC Role / Device Role / Timing Role: High-reliability parallel flash supporting rapid reconfiguration via 15 ns page reads and buffered programming. Use Value: Uniform 128-KB sectors allow atomic firmware updates; extended temperature grade (–40°C to +125°C) ensures operation in outdoor enclosures. | Use Scenario: Hosting BIOS and diagnostic self-test routines in FDA-cleared medical imaging equipment requiring traceable firmware integrity. IC Role / Device Role / Timing Role: CFI-compliant boot memory enabling certified UEFI firmware drivers to verify flash contents pre-boot. Use Value: Built-in ECC and CFI parameter table simplify validation documentation; 20-year retention satisfies regulatory record-keeping mandates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GP10FAI020 | Same density and core voltage but lacks Versatile I/O (VIO); fixed 3.3 V I/O only | Requires external level shifters when interfacing with 1.8 V or 2.5 V SoCs | Select when system uses uniform 3.3 V logic and cost optimization outweighs I/O flexibility |
| MX29GL128FDTI-90G | 128 MB density, 90 ns tACC, no hardware ECC, no OTP array, CFI-compatible but different command set | Lacks built-in error correction and secure storage - requires software ECC and external key management | Choose for legacy designs where driver compatibility with Macronix toolchains is prioritized over safety features |
Compared with S29GL01GP10FAI020 and MX29GL128FDTI-90G, the S29GL01GT10FAI023 delivers superior system-level reliability through integrated ECC and OTP security, while its Versatile I/O eliminates board-level level-shifting components-reducing BOM count and improving thermal margin in compact industrial modules.
Availability
S29GL01GT10FAI023 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and telecom base station configuration requiring stable component supply across extended temperature grades and long production lifecycles.
Supply support for S29GL01GT10FAI023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global manufacturing and quality certifications including IATF 16949 and ISO 9001.
The GL-T family targets high-reliability embedded systems needing fast XIP execution and robust data storage, combining NOR flash speed with NAND-like density and advanced data integrity features.
FAQ
What is the maximum operating temperature range supported by S29GL01GT10FAI023?
The S29GL01GT10FAI023 is rated for industrial temperature range (–40°C to +85°C) as indicated by the "I" suffix in the part number. It is not qualified for automotive grade 2 (–40°C to +105°C) or extended grade (–40°C to +125°C) unless explicitly ordered with corresponding suffixes (e.g., "J" or "K"). This variant meets EN 50155 and IEC 60068-2 environmental test requirements for industrial control cabinets.
Does S29GL01GT10FAI023 support both ×8 and ×16 data bus widths?
Yes, the device supports configurable ×8 or ×16 operation via the BYTE# pin. When BYTE# is low, it operates in ×16 mode using DQ0–DQ15; when high, it operates in ×8 mode using DQ0–DQ7 only. Address lines remain identical in both modes, and all commands function identically-enabling flexible integration with 8-bit or 16-bit microcontroller buses without redesign.
How does the hardware ECC work during read operations?
Hardware ECC operates transparently during every read access: the device automatically calculates and checks Hamming codes on each 512-byte sector. If a single-bit error is detected, it is corrected in real time before data is placed on the bus; no CPU intervention or additional timing overhead is required. Uncorrectable multi-bit errors trigger the Status Register's ECC Error bit, signaling host firmware to initiate recovery.
Can the OTP array be reprogrammed after initial programming?
No-the 2048-byte OTP array is permanently programmable once written. Each of the four SSR regions (SSR0–SSR3) can be individually locked: SSR0 is factory-locked and immutable; SSR3 supports password-based read protection but cannot be erased or rewritten after programming. This design ensures cryptographic keys, calibration constants, or serial numbers remain tamper-proof throughout the device's operational life.
S29GL01GT10FAI023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL01GT10FAI023 FAQ
1.How can I place an order for S29GL01GT10FAI023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GT10FAI023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GT10FAI023 reliable?
The price and inventory of S29GL01GT10FAI023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GT10FAI023 is usually 5 days.
3.What payment methods are accepted for S29GL01GT10FAI023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GT10FAI023 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GT10FAI023?
S29GL01GT10FAI023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GT10FAI023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GT10FAI023?
For technical support, including S29GL01GT10FAI023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GT10FAI023 requirements.
6.How does Aetrix verify that S29GL01GT10FAI023 is sourced from the original manufacturer or authorized distributors?
All S29GL01GT10FAI023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GT10FAI023 meets industry standards.
7.What is the process for return or replacement of S29GL01GT10FAI023?
All S29GL01GT10FAI023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GT10FAI023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GT10FAI023 part is unused and in its original packaging.
Return procedure for S29GL01GT10FAI023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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