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Infineon Technologies S29GL01GT10FHI010
- Part No.:
- S29GL01GT10FHI010
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL01GT10FHI010.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,957
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Product details
Overview
S29GL01GT10FHI010 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, internal hardware ECC for single-bit error correction, and uniform 128-KB sector erase - deployed in industrial-grade embedded systems requiring reliable code storage and XIP execution.
For engineers reviewing the S29GL01GT10FHI010 datasheet, S29GL01GT10FHI010 pinout, S29GL01GT10FHI010 application, or S29GL01GT10FHI010 equivalent, key selection criteria include verified 128-KB uniform sector architecture, OTP array with four lockable SSR regions, CFI compliance, and support for suspend/resume during program/erase operations across –40°C to +85°C.
Technical Context
This device implements an asynchronous parallel interface with ×8/×16 data bus configuration and byte/word boundary addressing. Its embedded algorithm controller (EAC) manages all program, erase, and status monitoring functions without external microcontroller intervention.
The MIRRORBIT™ cell architecture enables dual-bit storage per cell while maintaining NOR-like read performance and deterministic timing. Hardware ECC operates transparently during read cycles, correcting single-bit errors and flagging uncorrectable multi-bit errors via status register bits.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 1 Gb (128 MB) - supports full firmware images and boot code in space-constrained industrial controllers. |
| Access time (tACC) | 100 ns at –40°C to +85°C - enables direct XIP execution from flash without caching latency penalties. |
| Page access time (tPACC) | 15 ns - accelerates sequential instruction fetch in burst-mode applications. |
| Write buffer size | 512 bytes - reduces effective programming time by batching up to 256 words per command. |
| ECC capability | Single-bit correction, double-bit detection - ensures data integrity over 20-year retention without software overhead. |
| Endurance | 100,000 program/erase cycles - suitable for field-upgradable firmware with infrequent but critical updates. |
| Operating temperature | –40°C to +85°C (Industrial grade) - validated for deployment in factory automation and motor control environments. |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-142AB footprint with 0.5 mm pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 | Address inputs | 24-bit address bus supporting full 128-MB linear addressing; A0 selects byte/word mode when configured for ×8/×16 operation. |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; operates as DQ0–DQ7 in ×8 mode; supports versatile I/O voltage range (1.65 V to VCC). |
| CE# | Chip enable | Active-low chip select; tCE = 100 ns max - defines minimum assertion time before valid read data appears. |
| OE# | Output enable | Active-low output control; tOE = 25 ns max - determines data hold timing relative to OE# deassertion. |
| WE# | Write enable | Active-low write strobe; initiates command sequences including program and erase when combined with address/data patterns. |
| RY/BY# | Ready/Busy indicator | Open-drain output signaling active embedded operations; used for hardware polling instead of status register reads. |
| VCC | Core supply | 2.7 V to 3.6 V single supply - powers logic, memory array, and ECC engine; no separate VPP required. |
| VIO | I/O supply | 1.65 V to VCC - decouples interface voltage from core, enabling interoperability with 1.8 V or 3.3 V host processors. |
Key Features
| Feature | Design Value |
|---|---|
| Asynchronous page read | 32-byte burst capability with 15 ns page access - improves instruction throughput in XIP-based boot loaders. |
| Uniform 128-KB sectors | 1024 independent erasable blocks - simplifies firmware partitioning and OTA update management without wear-leveling firmware. |
| OTP array with SSR locking | 2048-byte one-time-programmable region split into four lockable sectors (SSR0–SSR3), with SSR0 factory-locked and SSR3 password-protected - secures bootloader keys and calibration data. |
| CFI-compliant interface | Standardized parameter table accessible via address/command sequence - enables automatic driver detection and configuration in Linux MTD and U-Boot environments. |
| Suspend/resume support | Interrupts ongoing program or erase to service high-priority read requests - maintains real-time responsiveness in multitasking embedded OSes. |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing and executing boot firmware and real-time control logic in programmable logic controllers with extended thermal cycling. IC Role / Device Role / Timing Role: Non-volatile code storage with XIP capability and deterministic 100 ns read latency for deterministic task scheduling. Use Value: Eliminates need for external RAM loading; 128-KB uniform sectors simplify firmware version rollback and field patching. | Use Scenario: Hosting boot code and safety-critical sensor fusion algorithms in automotive camera ECU modules certified to AEC-Q100 Grade 2. IC Role / Device Role / Timing Role: Primary boot memory with hardware ECC and 100,000-cycle endurance for safe reprogramming during vehicle service. Use Value: SSR-locked OTP stores cryptographic keys; CFI compliance enables standardized flash driver reuse across OEM platforms. |
| Medical Imaging System BIOS | Telecom Base Station Configuration |
Use Scenario: Storing diagnostic firmware and calibration tables in portable ultrasound devices requiring long-term data retention and low-power standby. IC Role / Device Role / Timing Role: High-reliability storage with 20-year data retention and 100 μA standby current at +85°C. Use Value: Internal ECC prevents silent corruption of image processing parameters; sector protection prevents accidental overwrite during field updates. | Use Scenario: Holding FPGA configuration bitstreams and protocol stack parameters in 5G remote radio units exposed to wide ambient temperature swings. IC Role / Device Role / Timing Role: Parallel interface flash with –40°C to +105°C operation and suspend/resume for concurrent configuration reads during runtime updates. Use Value: 512-byte write buffer accelerates bitstream reload; versatile I/O allows direct interfacing with 1.8 V FPGAs without level shifters. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GP10FHIV10 | Same 1 Gb density and 45-nm MIRRORBIT™ process, but uses 64-ball LAE BGA (9 mm × 9 mm); lacks OTP SSR3 password protection. | Targeted at space-constrained telecom modules where BGA footprint is preferred over TSOP; no requirement for password-protected OTP. | Select when board layout favors BGA and full SSR security is not mandated. |
| MX29GL128FTEI-90G | 128-MB parallel NOR from Macronix; 90 ns random access, no integrated ECC; requires external error handling. | Used in cost-sensitive industrial gateways where firmware integrity is managed in software and thermal range is limited to –40°C to +85°C. | Select only if ECC is implemented externally and tighter timing margins are acceptable. |
Compared with S29GL01GP10FHIV10, this TSOP-packaged variant offers SSR3 password protection and easier PCB assembly; versus MX29GL128FTEI-90G, it delivers hardware ECC and faster 15 ns page access - critical for XIP latency budgets in safety-certified systems.
Availability
S29GL01GT10FHI010 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system BIOS requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S29GL01GT10FHI010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global R&D and manufacturing infrastructure.
The GL-T family targets high-reliability embedded systems needing deterministic NOR flash performance, combining XIP execution speed with data storage density and built-in ECC - designed specifically for industrial, automotive, and medical applications demanding long-term data integrity.
FAQ
Does S29GL01GT10FHI010 support both ×8 and ×16 data bus configurations?
Yes. The device supports configurable ×8 or ×16 operation via A0 pin state at power-on reset: A0 low enables ×16 mode (DQ0–DQ15 active); A0 high enables ×8 mode (DQ0–DQ7 active). Bus width is fixed after initialization and cannot be changed dynamically during operation.
What is the function of the SSR (Secure Sector Register) array and how is it protected?
The 2048-byte SSR array contains four lockable regions (SSR0–SSR3). SSR0 is permanently locked at factory; SSR1–SSR2 are volatile-lockable; SSR3 supports password-based read protection. Password entry requires a specific command sequence to SRAM-based lock register, preventing unauthorized access to stored keys or calibration data.
Can the internal ECC correct errors introduced during power-loss events?
No. Internal ECC corrects only single-bit errors occurring during normal read operations due to charge leakage or radiation effects. It does not recover data corrupted during incomplete program/erase cycles caused by sudden power loss - such cases require external error recovery protocols or redundant sector mapping.
Is the Ready/Busy# (RY/BY#) pin compatible with standard microcontroller GPIO interrupt inputs?
Yes. RY/BY# is an open-drain output with 3.3 V tolerant pull-up capability. It can directly drive standard GPIO interrupt pins configured for active-low edge detection. The signal asserts low during any embedded operation (program/erase/suspend) and returns high within 100 ns after completion, meeting typical MCU interrupt response requirements.
S29GL01GT10FHI010 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL01GT10FHI010 FAQ
1.How can I place an order for S29GL01GT10FHI010 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GT10FHI010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GT10FHI010 reliable?
The price and inventory of S29GL01GT10FHI010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GT10FHI010 is usually 5 days.
3.What payment methods are accepted for S29GL01GT10FHI010?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GT10FHI010 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GT10FHI010?
S29GL01GT10FHI010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GT10FHI010 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GT10FHI010?
For technical support, including S29GL01GT10FHI010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GT10FHI010 requirements.
6.How does Aetrix verify that S29GL01GT10FHI010 is sourced from the original manufacturer or authorized distributors?
All S29GL01GT10FHI010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GT10FHI010 meets industry standards.
7.What is the process for return or replacement of S29GL01GT10FHI010?
All S29GL01GT10FHI010 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GT10FHI010, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GT10FHI010 part is unused and in its original packaging.
Return procedure for S29GL01GT10FHI010:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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