Infineon Technologies S29GL01GT10FHI013
- Part No.:
- S29GL01GT10FHI013
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL01GT10FHI013.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 64FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,207
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Product details
Overview
S29GL01GT10FHI013 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, hardware ECC for single-bit correction, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C). It is used in boot code storage for industrial controllers requiring fast XIP execution and reliable non-volatile firmware retention.
For engineers reviewing the S29GL01GT10FHI013 datasheet, S29GL01GT10FHI013 pinout, S29GL01GT10FHI013 application, or S29GL01GT10FHI013 equivalent, key selection factors include verified 100,000 program/erase cycles, 20-year data retention, CFI-compliant interface, OTP array with four lockable SSR regions, and support for suspend/resume during programming and erase.
Technical Context
This device implements an asynchronous parallel interface with ×8/×16 configurable data bus, supporting byte- and word-aligned addressing. Its embedded algorithm controller (EAC) manages all program/erase operations, including automatic ECC generation and verification per 512-byte sector.
The architecture includes dedicated address space overlays (ASOs) for Device ID/CFI, Status Register, Data Polling, SSR (OTP), and ECC status - enabling standardized software drivers and robust firmware update workflows in resource-constrained embedded systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 1 Gb (128 MB) - sufficient for full bootloader + application image in single-chip boot memory |
| Random access time | 100 ns at –40°C to +85°C - enables direct XIP execution without wait states on 10 MHz bus |
| Page access time | 15 ns - accelerates sequential instruction fetch during boot initialization |
| Write buffer size | 512 bytes - reduces effective programming time by up to 4× vs. single-word writes |
| ECC capability | Internal hardware single-bit error correction - eliminates need for external ECC logic or SW overhead |
| Endurance | 100,000 program/erase cycles - supports field firmware updates over 10+ years of operation |
| Data retention | 20 years at +85°C - meets long-lifecycle requirements for industrial control and medical devices |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-141AC footprint. Compatible with automated PCB assembly and legacy socket-based debug interfaces.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address inputs | 22-bit address bus supporting full 128 MB linear addressing (byte/word aligned) |
| DQ0–DQ15 | Data I/O | Configurable ×8 or ×16 bidirectional data bus; supports multiplexed or non-multiplexed timing |
| CE# | Chip enable | Active-low chip select; controls device power state and command latching |
| OE# | Output enable | Active-low read strobe; gates output drivers without affecting internal state |
| WE# | Write enable | Active-low write strobe; initiates program/erase command sequences when CE# and OE# are inactive |
| RY/BY# | Ready/Busy indicator | Open-drain output signaling active embedded operation (low = busy, high = ready) |
| VCC | Core supply | 2.7–3.6 V single supply for read/program/erase - eliminates need for auxiliary voltage rails |
| VIO | I/O supply | 1.65–VCC versatile I/O voltage - allows interfacing with 1.8 V, 2.5 V, or 3.3 V host processors |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O (VIO) | Independent 1.65 V to VCC I/O supply enables mixed-voltage system integration without level shifters |
| 512-byte write buffer | Reduces average programming time to ≤450 μs per 512-byte block - critical for OTA firmware patching |
| Hardware ECC | On-the-fly single-bit correction with no CPU intervention - preserves deterministic real-time response |
| OTP array with SSR locking | 2048-byte factory-programmable region with four password-protected sectors (SSR0–SSR3) for secure key storage |
| CFI compliance | Standardized parameter table accessible via read commands - enables auto-detection and driver portability across flash vendors |
Applications
| Industrial PLC Boot Memory | Medical Imaging Firmware Storage |
|---|---|
Use Scenario: Storing boot loader and safety-critical firmware in programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Primary non-volatile boot memory providing XIP-capable instruction fetch with <100 ns latency. Use Value: 20-year data retention and 100K endurance ensure firmware integrity across extended maintenance cycles without replacement. | Use Scenario: Holding calibrated image processing algorithms and DICOM protocol stacks in portable ultrasound and MRI subsystems. IC Role / Device Role / Timing Role: Secure firmware repository with OTP-locked calibration keys and hardware ECC for fault-tolerant operation. Use Value: SSR3 password protection prevents unauthorized access to proprietary imaging IP while maintaining AEC-Q100 grade 3 compliance. |
| Automotive ADAS Camera Module | Ruggedized Network Router |
Use Scenario: Hosting firmware and configuration profiles in front-facing camera modules operating at –40°C to +105°C. IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 qualified parallel flash serving as primary boot device for SoC-based vision processors. Use Value: Verified 120 ns access at +105°C ensures deterministic boot timing under thermal stress conditions. | Use Scenario: Storing Linux kernel, root filesystem, and failover configuration in carrier-grade edge routers with 15+ year service life. IC Role / Device Role / Timing Role: High-reliability firmware storage with suspend/resume capability for safe field updates during traffic peaks. Use Value: Sector erase suspend allows interruption of 128-KB erase without data corruption - essential for zero-downtime maintenance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GT10FHIV10 | Same die, automotive grade AEC-Q100 Grade 2 (–40°C to +105°C); identical timing and feature set | Qualified for under-hood automotive use; requires PPAP documentation | Select when full automotive qualification and traceability are mandatory |
| MX29GL128FDTI-90G | 128 MB ×16, 90 ns tACC, no hardware ECC, no OTP array, different CFI layout | Lacks ECC and secure OTP - requires external error handling and key management | Choose only if cost sensitivity outweighs reliability and security requirements |
Compared with S29GL01GT10FHIV10, the -013 variant offers industrial-grade qualification at lower cost and simpler compliance; versus MX29GL128FDTI-90G, it delivers superior data integrity, longer lifecycle, and built-in security - justifying higher BOM cost in safety-critical designs.
Availability
S29GL01GT10FHI013 is available at Aetrix Electronics and suitable for industrial PLC boot memory, medical imaging firmware storage, and ruggedized network router applications requiring stable component supply across multi-year production programs.
Supply support for S29GL01GT10FHI013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for industrial, automotive, and IoT markets.
The GL-T family targets high-reliability embedded systems needing fast XIP execution, secure firmware storage, and long-term data retention - bridging performance gaps between traditional NOR and NAND flash.
FAQ
Does S29GL01GT10FHI013 support both ×8 and ×16 data bus configurations?
Yes, it supports configurable ×8 or ×16 operation via hardware pin strapping (BYTE# input). When BYTE# is low, the device operates in ×16 mode with DQ0–DQ15 active; when high, it operates in ×8 mode with DQ0–DQ7 only. Address alignment remains byte-based in both modes, and CFI reports correct bus width automatically.
What is the function of the SSR (One-Time Programmable) array?
The 2048-byte SSR array contains four lockable regions (SSR0–SSR3). SSR0 is factory-locked and holds device-specific identifiers; SSR3 supports password-protected read access for storing cryptographic keys or calibration data. Once locked, SSR regions cannot be reprogrammed, ensuring permanent, tamper-resistant storage.
How does hardware ECC operate during read cycles?
Hardware ECC runs transparently on every 512-byte sector read: syndrome calculation occurs in parallel with data transfer, and single-bit errors are corrected before data reaches the bus. No software intervention is required, and the Status Register flags uncorrectable multi-bit errors. ECC does not impact read timing - tACC remains 100 ns.
Can S29GL01GT10FHI013 be used in systems with 1.8 V I/O voltage?
Yes, its Versatile I/O (VIO) feature supports 1.65 V to VCC operation. With VCC = 3.3 V and VIO = 1.8 V, the device accepts 1.8 V logic levels on all control and address pins while driving 1.8 V–compatible outputs. This eliminates external level shifters in mixed-voltage SoC interfaces such as those found in ARM Cortex-A/M series designs.
S29GL01GT10FHI013 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL01GT10FHI013 FAQ
1.How can I place an order for S29GL01GT10FHI013 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GT10FHI013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GT10FHI013 reliable?
The price and inventory of S29GL01GT10FHI013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GT10FHI013 is usually 5 days.
3.What payment methods are accepted for S29GL01GT10FHI013?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GT10FHI013 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GT10FHI013?
S29GL01GT10FHI013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GT10FHI013 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GT10FHI013?
For technical support, including S29GL01GT10FHI013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GT10FHI013 requirements.
6.How does Aetrix verify that S29GL01GT10FHI013 is sourced from the original manufacturer or authorized distributors?
All S29GL01GT10FHI013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GT10FHI013 meets industry standards.
7.What is the process for return or replacement of S29GL01GT10FHI013?
All S29GL01GT10FHI013 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GT10FHI013, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GT10FHI013 part is unused and in its original packaging.
Return procedure for S29GL01GT10FHI013:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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