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Infineon Technologies S29GL01GT10FHI020
- Part No.:
- S29GL01GT10FHI020
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL01GT10FHI020.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:899
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Product details
Overview
S29GL01GT10FHI020 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, hardware ECC for single-bit correction, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C). It is used in boot code storage for network routers requiring fast XIP execution and reliable non-volatile firmware retention.
For engineers reviewing the S29GL01GT10FHI020 datasheet, S29GL01GT10FHI020 pinout, S29GL01GT10FHI020 application, or S29GL01GT10FHI020 equivalent, key selection criteria include verified 100,000 program/erase cycles, OTP array with four lockable SSR regions, CFI compliance, and support for suspend/resume during embedded operations.
Technical Context
This device implements an asynchronous parallel interface with ×8/×16 data bus configuration and byte/word boundary addressing. Its embedded algorithm controller (EAC) manages all program and erase operations autonomously, including automatic ECC generation and verification during write/erase cycles.
The architecture includes dedicated address space overlays (ASOs) for Device ID/CFI, Status Register, Data Polling, SSR (OTP), and ECC status - enabling standardized software drivers and robust error recovery without host CPU intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 1 Gb (128 MB) - sufficient for full boot image + firmware + parameter storage in edge gateway applications |
| Access time (tACC) | 100 ns at –40°C to +85°C - enables direct XIP execution from flash without external cache penalty |
| Page access time (tPACC) | 15 ns - accelerates sequential instruction fetch in burst-read scenarios |
| Write buffer size | 512 bytes - reduces effective programming time by batching up to 256 words per command |
| ECC capability | Internal hardware single-bit error correction - ensures data integrity without host-side ECC logic |
| Endurance | 100,000 program/erase cycles - supports field firmware updates over 10+ years of industrial deployment |
| Data retention | 20 years - guarantees long-term reliability in unpowered storage for medical and infrastructure systems |
Pinout & Package
Package: 56-pin TSOP (Type I, standard thickness), JEDEC MO-141AC compliant, lead-free and RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address inputs | 22-bit address bus supporting full 128 MB linear addressing with byte/word alignment |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; configurable as ×8 or ×16 via BYTE# pin |
| CE# | Chip enable | Active-low chip select controlling device power state and command latching |
| OE# | Output enable | Active-low control for data bus output driver activation during read cycles |
| WE# | Write enable | Active-low signal initiating internal write/erase algorithms when combined with valid address/data |
| RY/BY# | Ready/Busy indicator | Open-drain output signaling active embedded operation (low) or completion (high) |
| VCC | Core supply | Single 2.7–3.6 V supply powering logic, memory array, and EAC - eliminates dual-rail design complexity |
| VIO | I/O supply | Independent 1.65–VCC V versatile I/O voltage - allows interfacing with 1.8 V, 2.5 V, or 3.3 V controllers |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O voltage (VIO) | Supports 1.65 V to VCC - enables seamless integration with mixed-voltage SoCs without level shifters |
| Hardware ECC engine | On-die single-bit error correction - eliminates need for external ECC logic or software overhead |
| 2048-byte OTP array | Four lockable SSR regions (SSR0–SSR3), with SSR0 factory-locked and SSR3 password-protected - secures bootloader keys and calibration data |
| Suspend/Resume commands | Allows pausing ongoing program/erase to service high-priority reads - critical for real-time OS environments |
| Common Flash Interface (CFI) | Standardized parameter table accessible via read commands - enables auto-detection and vendor-agnostic driver support |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot code and safety-critical firmware in programmable logic controllers deployed in factory automation. IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable instruction fetch with deterministic 100 ns access latency. Use Value: Ensures deterministic startup timing and immunity to power loss during firmware update due to sector protection and suspend/resume capability. | Use Scenario: Holding certified boot loader and sensor fusion firmware in automotive camera ECUs meeting AEC-Q100 Grade 2 (–40°C to +105°C). IC Role / Device Role / Timing Role: Automotive-grade parallel NOR flash with OTP-secured bootloader region and hardware ECC for ASIL-B compliance. Use Value: Meets functional safety requirements via factory-locked SSR0 and password-protected SSR3, reducing validation effort for ISO 26262 workflows. |
| Network Router Boot Image | Medical Imaging System Parameter Storage |
Use Scenario: Hosting compressed Linux kernel and initramfs in enterprise-grade Layer 3 switches requiring rapid cold boot. IC Role / Device Role / Timing Role: High-speed parallel flash enabling sub-500 ms boot time through 15 ns page access and 512-byte buffered writes. Use Value: Reduces boot latency by 35% vs. legacy 200 ns flash, improving network uptime after failover events. | Use Scenario: Retaining calibrated imaging parameters and regulatory audit logs in portable ultrasound devices with 10+ year shelf life. IC Role / Device Role / Timing Role: Long-retention (20-year) flash with 100,000-cycle endurance for field-updatable calibration tables. Use Value: Eliminates need for battery-backed SRAM or EEPROM, lowering BOM cost and simplifying thermal design for Class II medical certification. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GP10FHIV10 | Same density and package but rated for extended temperature (–40°C to +125°C); higher standby current (215 μA) | Required for under-hood automotive or high-temp industrial enclosures where ambient exceeds +85°C | Select when thermal environment exceeds industrial grade limits; verify power budget impact on standby mode |
| MX29GL128FXTI-90G | 128 MB ×16, 90 ns tACC, no integrated ECC, requires external error handling | Lacks hardware ECC and OTP security - suitable only for non-safety-critical consumer applications | Choose only if cost sensitivity outweighs reliability and security requirements; additional SW/FW validation needed |
Compared with S29GL01GP10FHIV10, this part offers lower standby current and validated industrial-grade operation, while MX29GL128FXTI-90G lacks ECC and OTP - making S29GL01GT10FHI020 optimal for safety-aware, long-life embedded systems.
Availability
S29GL01GT10FHI020 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and network router boot image applications requiring stable component supply across multi-year production cycles.
Supply support for S29GL01GT10FHI020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and non-volatile memory solutions for industrial and automotive markets.
The GL-T family targets high-reliability embedded systems needing fast XIP execution, robust data retention, and hardware-assisted security - specifically designed for boot code, firmware, and parameter storage in mission-critical applications.
FAQ
Is S29GL01GT10FHI020 compatible with legacy S29GLxxxT devices?
Yes, it maintains pin-to-pin compatibility and command set consistency with earlier GL-T family members such as S29GL512T, including identical CFI structure and ASO mapping. Software drivers written for S29GL512T require no modification to operate with S29GL01GT10FHI020, provided address decoding accounts for the larger 1 Gb address space.
Does this device support both ×8 and ×16 data bus modes?
Yes, the device supports configurable ×8 or ×16 operation via the BYTE# pin. When BYTE# is low, DQ0–DQ7 function as the data bus (×8 mode); when high, DQ0–DQ15 are active (×16 mode). Address lines remain unchanged in both configurations, with A0 always representing the LSB for byte-aligned access.
What is the purpose of the SSR0–SSR3 regions in the OTP array?
SSR0–SSR3 are four independent 512-byte sectors within the 2048-byte OTP array. SSR0 is permanently locked at factory and typically holds immutable device identifiers. SSR1–SSR2 are user-lockable for calibration data or cryptographic keys. SSR3 supports password-based read protection, allowing secure storage of sensitive credentials accessible only after authentication.
How does the suspend/resume feature affect system responsiveness?
Suspend/resume allows interrupting a background program or erase operation to immediately service a high-priority read request. Once suspended, the device halts the embedded algorithm and responds to read commands within one bus cycle. Resume restores the interrupted operation without data loss or reinitialization, maintaining deterministic latency for real-time tasks like motor control or sensor polling.
S29GL01GT10FHI020 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL01GT10FHI020 FAQ
1.How can I place an order for S29GL01GT10FHI020 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GT10FHI020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GT10FHI020 reliable?
The price and inventory of S29GL01GT10FHI020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GT10FHI020 is usually 5 days.
3.What payment methods are accepted for S29GL01GT10FHI020?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GT10FHI020 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GT10FHI020?
S29GL01GT10FHI020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GT10FHI020 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GT10FHI020?
For technical support, including S29GL01GT10FHI020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GT10FHI020 requirements.
6.How does Aetrix verify that S29GL01GT10FHI020 is sourced from the original manufacturer or authorized distributors?
All S29GL01GT10FHI020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GT10FHI020 meets industry standards.
7.What is the process for return or replacement of S29GL01GT10FHI020?
All S29GL01GT10FHI020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GT10FHI020, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GT10FHI020 part is unused and in its original packaging.
Return procedure for S29GL01GT10FHI020:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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