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Infineon Technologies S29GL01GT10FHI023
- Part No.:
- S29GL01GT10FHI023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL01GT10FHI023.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,900
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Product details
Overview
S29GL01GT10FHI023 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, internal hardware ECC for single-bit correction, and uniform 128-KB sector erase-designed for boot code storage in industrial microcontroller-based systems requiring high reliability and fast XIP execution.
For engineers reviewing the S29GL01GT10FHI023 datasheet, S29GL01GT10FHI023 pinout, S29GL01GT10FHI023 application, or S29GL01GT10FHI023 equivalent, key selection criteria include verified 100,000 program/erase cycles, 20-year data retention, industrial temperature grade (–40°C to +85°C), TSOP-56 packaging, and CFI-compliant command set for legacy embedded boot memory integration.
Technical Context
This device implements an asynchronous parallel interface with ×8/×16 data bus support and byte/word boundary addressing. Its embedded algorithm controller (EAC) executes program and erase operations autonomously, while status monitoring uses Data Polling, Ready/Busy#, and Status Register reads.
The architecture includes dedicated address space overlays for Device ID/CFI, Status Register, OTP SSR regions (SSR0–SSR3), and ECC status reporting. Sector protection supports both volatile (lock bits) and non-volatile (ASP) methods, with SSR0 factory-locked and SSR3 password-read-protected.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 1 Gb (128 MB) - sufficient for full firmware images and dual-bank boot code in resource-constrained controllers. |
| Access Time (tACC) | 100 ns at –40°C to +85°C - enables direct XIP execution without external cache in real-time MCU applications. |
| Page Access (tPACC) | 15 ns - accelerates sequential instruction fetch during boot initialization or firmware update verification. |
| Write Buffer Size | 512 bytes - reduces effective programming time by batching up to 256 words per command, improving OTA update throughput. |
| ECC Capability | Internal hardware single-bit error correction - maintains data integrity without host CPU overhead in long-life industrial deployments. |
| Endurance & Retention | 100,000 program/erase cycles / 20-year data retention - meets lifetime requirements for unattended infrastructure equipment. |
| Operating Voltage | VCC = 2.7 V to 3.6 V, VIO = 1.65 V to VCC - supports mixed-voltage board designs with 1.8 V or 3.3 V I/O domains. |
| Temperature Grade | Industrial (–40°C to +85°C) - qualified for deployment in factory automation, motor drives, and power conversion systems. |
Pinout & Package
Package: 56-pin Thin Small Outline Package (TSOP), 14 mm × 20 mm, standard JEDEC MO-142AB footprint with gull-wing leads.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 | Address Inputs | 24-bit address bus supporting full 128 MB linear addressing; A0 selects byte/word mode when configured for ×8/×16 operation. |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; operates in ×8 mode (DQ0–DQ7 only) or ×16 mode depending on BYTE# state. |
| CE# | Chip Enable | Active-low enable controlling device selection; tCE = 100 ns max defines minimum chip select assertion window for read timing. |
| OE# | Output Enable | Active-low control for data output gating; tOE = 25 ns max ensures valid data hold after OE# deassertion. |
| WE# | Write Enable | Active-low signal initiating write/program commands; used with CE# and OE# to define command latching windows. |
| RY/BY# | Ready/Busy Output | Open-drain status indicator: low = operation in progress, high = ready; eliminates need for polling in interrupt-driven systems. |
| RESET# | Hardware Reset | Active-low input forcing device into reset state; required for power-on initialization and recovery from unknown states. |
| BYTE# | Bus Width Select | Configures ×8 (high) or ×16 (low) data bus mode; determines DQ0–DQ7 vs. DQ0–DQ15 usage and address alignment. |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O voltage range | VIO supports 1.65 V to VCC - allows direct interfacing with 1.8 V logic without level shifters in mixed-supply systems. |
| Asynchronous 32-byte page read | Enables burst-like sequential access within page boundaries - improves instruction fetch efficiency over standard random reads. |
| Separate 2048-byte OTP array | Four lockable SSR regions (SSR0–SSR3) provide secure storage for calibration data, MAC addresses, or cryptographic keys with factory-lock and password protection. |
| Advanced sector protection (ASP) | Combines volatile (SRAM-based) and non-volatile (flash-based) lock bits - permits dynamic protection during runtime and persistent lockdown across power cycles. |
| Common Flash Interface (CFI) | Standardized parameter table accessible via read commands - enables automatic driver detection and configuration in OS-bootloader environments. |
Applications
| Industrial Motor Control | Factory Automation HMI |
|---|---|
Use Scenario: Boot firmware and motion control algorithms stored in flash for servo drive MCUs operating in harsh EMI environments. IC Role / Device Role / Timing Role: Primary non-volatile boot memory providing XIP-capable instruction storage with deterministic 100 ns access latency. Use Value: Eliminates external SRAM caching requirement while sustaining 20-year data retention under thermal cycling between –40°C and +85°C. | Use Scenario: Storing GUI assets, configuration profiles, and firmware updates on ARM-based HMIs deployed on production lines. IC Role / Device Role / Timing Role: High-density parallel flash acting as system code and asset repository with CFI-enabled auto-configuration. Use Value: 512-byte write buffer cuts firmware update time by >3× versus single-word programming, reducing machine downtime during maintenance. |
| Power Converter Firmware | Railway Signaling Controller |
Use Scenario: Holding safety-critical control firmware and calibration tables in isolated DC-DC converter modules certified to IEC 61000-4 standards. IC Role / Device Role / Timing Role: Trusted boot memory with hardware ECC ensuring bit-error-free instruction fetch during transient voltage events. Use Value: Internal single-bit ECC corrects soft errors induced by radiation or switching noise without software intervention or system reset. | Use Scenario: Storing fail-safe logic and communication protocol stacks in EN 5012x-certified signaling controllers operating continuously for decades. IC Role / Device Role / Timing Role: Long-life non-volatile memory with 100,000-cycle endurance and 20-year retention for mission-critical railway infrastructure. Use Value: Uniform 128-KB sectors simplify field firmware patching via sector-erase granularity, minimizing risk of corruption during partial updates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GP10TFI020 | Same density and core voltage, but uses 64-ball LAE BGA (9 mm × 9 mm); no TSOP option; lacks OTP SSR array. | Targeted at space-constrained PCBs where BGA routing is acceptable; unsuitable for through-hole or legacy TSOP footprints. | Select when board area is critical and OTP functionality is not required. |
| MX29GL128FPTI-90G | Micron 128-MB part; 90 ns random access; no built-in ECC; requires external error handling; different CFI layout and command set. | Lower cost alternative for non-safety-critical applications where host-side ECC implementation is feasible. | Select only if firmware stack already supports custom error management and timing margins allow 90 ns vs. 100 ns access. |
Compared with S29GL01GP10TFI020, this TSOP-packaged variant offers drop-in compatibility with existing industrial control boards and integrated OTP security; versus MX29GL128FPTI-90G, it delivers guaranteed ECC, longer retention, and standardized CFI-critical for certified safety systems.
Availability
S29GL01GT10FHI023 is available at Aetrix Electronics and suitable for industrial motor control, factory automation HMI, and power converter firmware requiring stable component supply across extended product lifecycles.
Supply support for S29GL01GT10FHI023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and industrial memory solutions, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.
The GL-T family targets high-reliability embedded boot memory applications, combining XIP performance with data-storage density and robustness for industrial, automotive, and infrastructure systems.
FAQ
Does S29GL01GT10FHI023 support both ×8 and ×16 data bus modes?
Yes. The BYTE# pin configures bus width: high for ×8 mode (DQ0–DQ7 active), low for ×16 mode (DQ0–DQ15 active). Address alignment and command interpretation change accordingly, and both modes are fully supported across all operating temperatures and voltage ranges specified in the datasheet.
What is the function of the SSR0–SSR3 regions in the OTP array?
SSR0–SSR3 are four independent 512-byte lockable regions within the 2048-byte OTP array. SSR0 is factory-locked and read-only; SSR3 supports password-based read protection. SSR1 and SSR2 are user-lockable for storing calibration data, serial numbers, or cryptographic keys with hardware-enforced immutability.
How does the internal ECC operate during read operations?
The device performs automatic single-bit error correction on every read access using dedicated on-die ECC circuitry. Corrected data is delivered to the bus; uncorrectable multi-bit errors trigger status register flags (ECCERR bit) and assert RY/BY# low, enabling host firmware to initiate recovery or logging without interrupting normal operation.
Can S29GL01GT10FHI023 be used in automotive applications?
No. This specific variant (S29GL01GT10FHI023) is rated for industrial temperature range (–40°C to +85°C) and carries no AEC-Q100 qualification. Automotive-grade equivalents exist (e.g., S29GL01GT10FHIV20 for Grade 2), but require separate ordering and validation against vehicle-level EMC and reliability requirements.
S29GL01GT10FHI023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL01GT10FHI023 FAQ
1.How can I place an order for S29GL01GT10FHI023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GT10FHI023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GT10FHI023 reliable?
The price and inventory of S29GL01GT10FHI023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GT10FHI023 is usually 5 days.
3.What payment methods are accepted for S29GL01GT10FHI023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GT10FHI023 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GT10FHI023?
S29GL01GT10FHI023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GT10FHI023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GT10FHI023?
For technical support, including S29GL01GT10FHI023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GT10FHI023 requirements.
6.How does Aetrix verify that S29GL01GT10FHI023 is sourced from the original manufacturer or authorized distributors?
All S29GL01GT10FHI023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GT10FHI023 meets industry standards.
7.What is the process for return or replacement of S29GL01GT10FHI023?
All S29GL01GT10FHI023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GT10FHI023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GT10FHI023 part is unused and in its original packaging.
Return procedure for S29GL01GT10FHI023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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