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Infineon Technologies S29GL01GT10FHI030
- Part No.:
- S29GL01GT10FHI030
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL01GT10FHI030.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,152
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Product details
Overview
S29GL01GT10FHI030 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, hardware ECC for single-bit correction, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C). It is used in boot code storage for industrial controllers requiring fast XIP execution and reliable non-volatile data retention.
For engineers reviewing the S29GL01GT10FHI030 datasheet, S29GL01GT10FHI030 pinout, S29GL01GT10FHI030 application, or S29GL01GT10FHI030 equivalent, key selection factors include verified 100,000 program/erase cycles, 20-year data retention, CFI-compliant interface, OTP array with four lockable SSR regions, and support for suspend/resume during embedded operations.
Technical Context
This device implements an asynchronous parallel interface with ×8/×16 data bus configuration and byte/word boundary addressing. Its embedded algorithm controller (EAC) manages all program and erase operations, including automatic ECC generation and correction, status monitoring via Status Register/Data Polling/RY/BY# pin, and sector protection via volatile/non-volatile ASP methods.
The GL-T architecture integrates execute-in-place (XIP) capability with high-density data storage functionality-enabling direct code execution while maintaining fast 1.14 MBps buffer programming and 245 KBps sector erase rates across –40°C to +85°C, +105°C, and +125°C grades.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 1 Gb (128 MB), enabling full firmware image storage for mid-tier industrial microcontrollers |
| Access Time | 100 ns random access (tACC), meeting real-time boot latency requirements for deterministic startup |
| Page Access | 15 ns (tPACC), supporting high-throughput instruction fetch in XIP mode |
| Write Buffer | 512-byte buffer, reducing effective programming time by up to 4× vs. single-word writes |
| ECC Support | Internal hardware single-bit error correction, eliminating need for external ECC logic in safety-critical systems |
| Endurance | 100,000 program/erase cycles per sector, qualifying for long-life embedded deployments |
| Data Retention | 20 years at +85°C, ensuring firmware integrity over full product lifecycle without refresh |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm body, standard JEDEC MO-141AC footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 | Address Inputs | 24-bit address bus supporting full 128 MB linear addressing with byte/word alignment |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; configurable as ×8 or ×16 via BYTE# pin |
| CE# | Chip Enable | Active-low enable controlling device selection in multi-chip memory subsystems |
| OE# | Output Enable | Active-low control for read data output timing and bus contention management |
| WE# | Write Enable | Active-low signal initiating internal program/erase command execution |
| RY/BY# | Ready/Busy Output | Open-drain status indicator signaling active embedded operation completion |
| VCC | Core Supply | Single 2.7–3.6 V supply powering core logic, array, and I/O drivers |
| VIO | I/O Supply | Independent 1.65–VCC V versatile I/O voltage, enabling interfacing with mixed-voltage SoCs |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O Voltage | VIO range 1.65 V to VCC enables direct connection to 1.8 V, 2.5 V, or 3.3 V host processors without level shifters |
| Hardware ECC Engine | On-die single-bit error correction eliminates external ECC overhead and reduces BOM cost in safety-certified designs |
| OTP Array with SSR Locking | 2048-byte one-time-programmable area with four password-protected lockable regions (SSR0–SSR3), supporting secure boot key storage |
| Suspend/Resume | Interruptible program/erase operations allow real-time system response to higher-priority events without data corruption |
| CFI Compliance | Standard Common Flash Interface parameter table enables automatic driver detection and configuration in Linux/U-Boot environments |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot firmware and configuration parameters in programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable instruction fetch with ≤100 ns latency for deterministic startup. Use Value: 20-year data retention and 100,000-cycle endurance ensure firmware integrity over 15+ year equipment lifespans without field updates. | Use Scenario: Holding boot code and calibration data for radar ECU modules operating under AEC-Q100 Grade 2 (–40°C to +105°C). IC Role / Device Role / Timing Role: Automotive-grade parallel NOR flash delivering guaranteed timing margins across extended temperature range. Use Value: Hardware ECC and sector protection prevent silent corruption of safety-critical boot images during vehicle lifetime. |
| Medical Imaging System BIOS | Telecom Base Station Configuration |
Use Scenario: Hosting BIOS and FPGA configuration bitstreams in portable ultrasound and MRI subsystems requiring regulatory compliance. IC Role / Device Role / Timing Role: Secure, certified non-volatile memory with OTP-based key storage (SSR3 password protection) for HIPAA/FDA traceability. Use Value: Factory-locked SSR0 and user-lockable SSR3 provide auditable chain-of-custody for cryptographic keys and calibration data. | Use Scenario: Storing FPGA configuration, DSP firmware, and network protocol stacks in 5G remote radio units exposed to thermal cycling. IC Role / Device Role / Timing Role: High-reliability parallel flash with suspend/resume capability enabling background reconfiguration without service interruption. Use Value: 512-byte write buffer and 1.14 MBps programming rate reduce firmware update windows by >70% vs. legacy NOR devices. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GP10FHIV10 | Same density and process, but uses 64-ball LAE BGA (9 mm × 9 mm); no TSOP option | Targeted for space-constrained PCB layouts where board area is prioritized over manual assembly or socket compatibility | Select when footprint miniaturization outweighs TSOP's reworkability and test accessibility |
| MX29GL128FPTI-70G | 128 MB density, 70 ns max tACC, no hardware ECC, no OTP array, supports only –40°C to +85°C | Lacks ECC and secure OTP - unsuitable for safety-critical or secure-boot applications | Choose only for cost-sensitive, non-safety applications where firmware integrity is managed externally |
Compared with S29GL01GT10FHI030, the S29GL01GP10FHIV10 offers identical electrical performance in a smaller BGA package, while the MX29GL128FPTI-70G trades ECC, OTP, and extended temp support for lower unit cost in non-critical roles.
Availability
S29GL01GT10FHI030 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system BIOS requiring stable component supply and long-term lifecycle assurance.
Supply support for S29GL01GT10FHI030 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions for industrial and automotive markets.
The GL-T family was designed specifically for embedded systems needing both XIP performance and robust data storage-bridging the gap between traditional code-execution and data-logging flash architectures.
FAQ
Is S29GL01GT10FHI030 compatible with legacy S29GL series footprints?
Yes, it shares the same 56-pin TSOP package outline and pinout as earlier S29GL01Gxxx variants. Signal assignments, voltage tolerances, and timing parameters are backward-compatible per Infineon's migration guidance in document 002-00247 Rev. *M Section 14.1.
Does this device support dual-plane or interleaved read operations?
No. The S29GL01GT10FHI030 implements a single-plane architecture with asynchronous parallel interface only. It does not support DDR, burst reads, or interleaving-unlike newer HyperFlash or Octal SPI devices.
What is the function of the BYTE# pin on this device?
The BYTE# pin configures data bus width: asserted low selects ×16 mode (DQ0–DQ15 active), high selects ×8 mode (DQ0–DQ7 only). This allows flexible integration with 8-bit or 16-bit host processors without hardware redesign.
Can the OTP array be reprogrammed after initial programming?
No. The 2048-byte OTP array is physically one-time programmable. Once any bit is set to '0', it cannot be reset to '1'. SSR locking is permanent and irreversible-intended for secure key or calibration storage in final production.
S29GL01GT10FHI030 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL01GT10FHI030 FAQ
1.How can I place an order for S29GL01GT10FHI030 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GT10FHI030 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GT10FHI030 reliable?
The price and inventory of S29GL01GT10FHI030 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GT10FHI030 is usually 5 days.
3.What payment methods are accepted for S29GL01GT10FHI030?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GT10FHI030 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GT10FHI030?
S29GL01GT10FHI030 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GT10FHI030 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GT10FHI030?
For technical support, including S29GL01GT10FHI030 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GT10FHI030 requirements.
6.How does Aetrix verify that S29GL01GT10FHI030 is sourced from the original manufacturer or authorized distributors?
All S29GL01GT10FHI030 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GT10FHI030 meets industry standards.
7.What is the process for return or replacement of S29GL01GT10FHI030?
All S29GL01GT10FHI030 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GT10FHI030, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GT10FHI030 part is unused and in its original packaging.
Return procedure for S29GL01GT10FHI030:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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