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Infineon Technologies S29GL01GT10FHI040
- Part No.:
- S29GL01GT10FHI040
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL01GT10FHI040.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,434
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Product details
Overview
S29GL01GT10FHI040 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, internal single-bit ECC, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C). It is used in boot code storage for network routers requiring fast XIP execution and reliable firmware retention.
For engineers reviewing the S29GL01GT10FHI040 datasheet, S29GL01GT10FHI040 pinout, S29GL01GT10FHI040 application, or S29GL01GT10FHI040 equivalent, key selection criteria include asynchronous parallel interface timing, OTP array configuration, sector protection granularity, and AEC-Q100 grade compatibility for embedded control systems.
Technical Context
This device implements an asynchronous parallel interface with ×8/×16 data bus support and byte/word boundary addressing. Its embedded algorithm controller (EAC) manages program, erase, and suspend/resume operations without external microcontroller intervention.
The internal hardware ECC corrects single-bit errors on-the-fly during read operations, and the Common Flash Interface (CFI) parameter table enables host software to auto-configure driver parameters. Sector protection uses both volatile (lock bits) and non-volatile (ASP) methods per 128-KB sector.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 1 Gb (128 MB) - sufficient for full boot image + firmware + configuration tables in edge gateway applications |
| Access time (tACC) | 100 ns at –40°C to +85°C - enables direct XIP execution from flash without cache penalty in real-time control loops |
| Page access time (tPACC) | 15 ns - accelerates sequential instruction fetch during boot initialization |
| Write buffer size | 512 bytes - reduces effective programming time by batching up to 256 words per command, improving firmware update throughput |
| ECC capability | Single-bit error correction - maintains data integrity over 20-year retention without host-side correction logic |
| Endurance | 100,000 program/erase cycles - supports field firmware updates in industrial PLCs with multi-year service life |
| Operating voltage | VCC = 2.7 V to 3.6 V, VIO = 1.65 V to VCC - allows interfacing with 1.8 V or 3.3 V controllers without level shifters |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-141AC footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 | Address inputs | 24-bit address bus supporting full 128 MB linear space; A0 selects byte/word mode when configured for ×8/×16 operation |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; operates in ×8 mode (DQ0–DQ7 only) or ×16 mode (full DQ0–DQ15) per CFI configuration |
| CE# | Chip enable | Active-low chip select; tCE = 100 ns max - defines minimum setup time before valid address/data assertion |
| OE# | Output enable | Active-low read strobe; tOE = 25 ns max - controls data bus drive timing during asynchronous read cycles |
| WE# | Write enable | Active-low write strobe; initiates program/erase commands when combined with address/data sequences per command set |
| RY/BY# | Ready/Busy output | Open-drain status indicator; low during embedded operations (program/erase), high when ready for next command |
| RESET# | Hardware reset | Active-low asynchronous reset; forces device into standby and clears internal state without power cycle |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O voltage range | VIO supports 1.65 V to VCC - eliminates level-shifter requirement when interfacing with mixed-voltage SoCs |
| Uniform 128-KB sectors | 1024 independent erasable sectors - enables granular firmware partitioning (e.g., bootloader, app, config, OTA staging) |
| OTP array (2048 B) | Four lockable SSR regions (SSR0–SSR3); SSR0 factory-locked, SSR3 password-protected - secures cryptographic keys and calibration data |
| Suspend/Resume | Interrupts ongoing program/erase to service high-priority reads - critical for real-time systems with concurrent firmware access |
| CFI compliance | Standardized parameter table accessible via read commands - enables automatic driver initialization across multiple flash vendors |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot loader, real-time OS kernel, and motion control algorithms in programmable logic controllers with no external RAM cache. IC Role / Device Role / Timing Role: Primary non-volatile code storage enabling eXecute-in-Place (XIP) execution directly from flash address space. Use Value: 100 ns random access ensures deterministic interrupt latency under worst-case thermal conditions (–40°C to +85°C). | Use Scenario: Holding certified boot firmware for radar ECU that must pass AEC-Q100 Grade 2 (–40°C to +105°C) qualification. IC Role / Device Role / Timing Role: Secure, high-reliability boot memory with OTP-protected calibration constants and ASP-enabled sector locking. Use Value: Factory-locked SSR0 and password-protected SSR3 prevent unauthorized modification of safety-critical parameters. |
| Network Router Boot Image | Medical Imaging System Configuration |
Use Scenario: Hosting U-Boot, Linux kernel, and device tree binaries in carrier-grade edge routers requiring field-upgradable firmware. IC Role / Device Role / Timing Role: High-density parallel flash interfaced to MIPS-based SoC via static memory controller with wait-state-free reads. Use Value: 512-byte write buffer cuts OTA firmware update time by >40% compared to single-word programming. | Use Scenario: Retaining DICOM configuration profiles, calibration offsets, and regulatory audit logs in FDA-cleared MRI subsystems. IC Role / Device Role / Timing Role: Long-term data archive with 20-year retention guarantee and ECC-backed integrity verification on power-up. Use Value: Internal single-bit ECC eliminates need for host-side checksum validation during boot sequence, reducing startup time. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GP10FHIV10 | Same density and core voltage, but uses 64-ball LAE BGA (9 mm × 9 mm); lacks OTP array and SSR protection | Targeted at space-constrained consumer electronics where security features are not required | Select when board area is critical and firmware protection is handled externally |
| MX29GL128FPTI-90G | 128 MB density, 90 ns access time, no built-in ECC, no OTP array, supports only ×16 bus mode | Used in cost-sensitive industrial HMIs where host MCU handles error detection and sector locking | Select when system-level ECC and secure OTP are implemented in software/firmware layer |
Compared with S29GL01GP10FHIV10 and MX29GL128FPTI-90G, the S29GL01GT10FHI040 uniquely combines OTP-based security, hardware ECC, and TSOP packaging-making it optimal for industrial and automotive designs requiring tamper-resistant boot storage without redesigning PCB layout for BGA.
Availability
S29GL01GT10FHI040 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and network router boot image applications requiring stable component supply across extended lifecycle programs.
Supply support for S29GL01GT10FHI040 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for industrial, automotive, and IoT applications.
The GL-T family targets high-reliability embedded systems needing fast XIP-capable flash with integrated data integrity and security features-designed specifically for boot code and firmware storage in mission-critical environments.
FAQ
Does S29GL01GT10FHI040 support both ×8 and ×16 data bus configurations?
Yes. The device automatically detects bus width via A0 pin state at power-on reset: low for ×8 mode (DQ0–DQ7 active), high for ×16 mode (DQ0–DQ15 active). This is confirmed in Section 8.3 of the datasheet and validated by CFI query responses.
What is the function of the SSR0–SSR3 regions in the OTP array?
SSR0–SSR3 are four 512-byte lockable sectors within the 2048-byte OTP array. SSR0 is permanently locked at factory; SSR1–SSR2 are user-lockable via command; SSR3 supports password-based read protection. They store immutable keys, calibration data, or security certificates.
Can S29GL01GT10FHI040 operate at 1.8 V I/O voltage while VCC is 3.3 V?
Yes. The Versatile I/O feature allows VIO to be independently set from 1.65 V to VCC. At VCC = 3.3 V, VIO may be 1.8 V, enabling direct connection to 1.8 V logic without level translation-verified in Table 10.4 (DC Characteristics) and Section 8.4.
How does the internal ECC interact with the Ready/Busy# signal during read operations?
The internal ECC operates transparently during read cycles: single-bit errors are corrected in real time, and no RY/BY# assertion occurs. Only multi-bit errors trigger status register flags (ECC_FAIL bit), requiring host software intervention-detailed in Section 5.3 and Table 5-10 (ECC Status ASO).
S29GL01GT10FHI040 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL01GT10FHI040 FAQ
1.How can I place an order for S29GL01GT10FHI040 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GT10FHI040 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GT10FHI040 reliable?
The price and inventory of S29GL01GT10FHI040 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GT10FHI040 is usually 5 days.
3.What payment methods are accepted for S29GL01GT10FHI040?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GT10FHI040 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GT10FHI040?
S29GL01GT10FHI040 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GT10FHI040 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GT10FHI040?
For technical support, including S29GL01GT10FHI040 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GT10FHI040 requirements.
6.How does Aetrix verify that S29GL01GT10FHI040 is sourced from the original manufacturer or authorized distributors?
All S29GL01GT10FHI040 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GT10FHI040 meets industry standards.
7.What is the process for return or replacement of S29GL01GT10FHI040?
All S29GL01GT10FHI040 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GT10FHI040, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GT10FHI040 part is unused and in its original packaging.
Return procedure for S29GL01GT10FHI040:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL01GT10FHI040 Tags
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M24C02-WMN6TP
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AT24C02C-XHM-T
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AT21CS01-STUM10-T
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24LC01BT-I/OT
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M24C02-FMC6TG
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93LC46BT-I/OT
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