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Infineon Technologies S29GL01GT10TFA010
- Part No.:
- S29GL01GT10TFA010
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL01GT10TFA010.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:3,349
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Product details
Overview
S29GL01GT10TFA010 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, hardware ECC for single-bit correction, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C). It is used in boot code storage for industrial controllers requiring deterministic XIP execution.
For engineers reviewing the S29GL01GT10TFA010 datasheet, S29GL01GT10TFA010 pinout, S29GL01GT10TFA010 application, or S29GL01GT10TFA010 equivalent, key selection criteria include parallel ×16 bus interface, CFI-compliant command set, OTP array with four lockable SSR regions, and AEC-Q100 grade 3 qualification for automotive control modules.
Technical Context
This device implements an asynchronous parallel interface with byte/word boundary addressing, supporting both 8-bit and 16-bit data bus configurations. Its embedded algorithm controller (EAC) manages program, erase, and suspend/resume operations without external timing control.
The internal hardware ECC operates transparently during read cycles, correcting single-bit errors and flagging uncorrectable multi-bit errors via status register bits. Sector protection uses volatile (lock bits) and non-volatile (ASP) methods, with separate 2048-byte OTP array containing factory-locked SSR0 and password-protected SSR3.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 1 Gb (128 MB), enabling full firmware image storage for mid-tier microcontrollers |
| Access time (tACC) | 100 ns at –40°C to +85°C, ensuring deterministic boot timing in real-time systems |
| Page access time (tPACC) | 15 ns, accelerating sequential instruction fetch in XIP applications |
| Write buffer size | 512 bytes, reducing effective programming time by up to 10× vs. single-word writes |
| ECC capability | Single-bit error correction per 512-byte sector, maintaining data integrity over 20-year retention |
| Endurance | 100,000 program/erase cycles per sector, supporting field-upgradable firmware |
| Operating voltage | 2.7 V to 3.6 V VCC with 1.65 V to VCC VIO, enabling interoperability with mixed-voltage SoCs |
Pinout & Package
Package: 56-pin TSOP (Type I, 14 mm × 20 mm, 0.5 mm pitch), RoHS-compliant, lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address inputs | 22-bit address bus supporting full 128 MB linear space; A0 selects byte/word mode when x16 configured |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional bus; operates in x8 mode when DQ15/A-1 grounded |
| CE# | Chip enable | Active-low enable controlling device power state; tCE = 100 ns max defines minimum chip select assertion window |
| OE# | Output enable | Active-low control for data bus drivers; tOE = 25 ns max ensures valid read data hold timing |
| WE# | Write enable | Active-low strobe for write cycles; initiates command sequences when CE# and OE# are high |
| RY/BY# | Ready/Busy output | Open-drain status indicator; low during embedded operations, enabling hardware polling without software overhead |
| VCC | Core supply | 3.0 V nominal supply powering logic and memory array; supports 2.7–3.6 V range for brown-out tolerance |
| VIO | I/O supply | Independent 1.65–3.6 V rail allowing interface to 1.8 V or 3.3 V controllers without level shifters |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O voltage | VIO supports 1.65 V to VCC, eliminating external level shifters when interfacing with 1.8 V FPGAs or 3.3 V MCUs |
| Hardware ECC engine | On-the-fly single-bit correction per 512-byte sector, reducing host CPU overhead and extending usable lifetime |
| 512-byte write buffer | Enables burst programming of up to 512 bytes in one command, cutting typical firmware update time by >70% vs. legacy flash |
| Four-lock OTP array | SSR0–SSR3 provide secure storage for keys, calibration data, or bootloader configuration with factory lock (SSR0) and password protection (SSR3) |
| CFI-compliant interface | Standardized parameter table allows automatic detection and configuration by BIOS/bootloader without hard-coded timing tables |
Applications
| Industrial PLC Boot Memory | Automotive ADAS Camera Module |
|---|---|
|
Use Scenario: Storing boot firmware and safety-critical configuration data in programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Primary non-volatile boot memory providing XIP-capable instruction fetch with <100 ns latency to meet IEC 61508 SIL-3 timing constraints. Use Value: 128 MB capacity accommodates dual-image firmware with rollback support; 100,000-cycle endurance enables in-field updates across 15+ years of operation. |
Use Scenario: Holding camera sensor initialization parameters, lens calibration tables, and firmware patches in rear-view and surround-view ADAS cameras. IC Role / Device Role / Timing Role: Secure configuration store with OTP-protected SSR3 region for anti-tampering; AEC-Q100 Grade 2 qualification ensures reliability at +105°C junction temperature. Use Value: Hardware ECC prevents silent corruption of calibration data; Versatile I/O allows direct connection to 1.8 V image signal processors without level-shifting components. |
| Medical Imaging Control Board | Telecom Base Station FPGA Config |
|
Use Scenario: Storing FPGA bitstreams and real-time control algorithms for ultrasound and MRI subsystems requiring FDA-certified data integrity. IC Role / Device Role / Timing Role: High-reliability configuration memory with 20-year data retention and automatic ECC reporting via status register flags. Use Value: Sector erase granularity (128 KB) enables selective reprogramming of safety-critical modules without full device reset; industrial temperature range covers medical chassis thermal profiles. |
Use Scenario: Loading FPGA configuration bitstreams and runtime firmware in 4G/5G remote radio units exposed to wide ambient temperature swings. IC Role / Device Role / Timing Role: Parallel NOR flash serving as primary configuration memory for Xilinx Zynq SoCs, leveraging fast page read (15 ns) for sub-100 ms boot times. Use Value: Extended temperature grade (–40°C to +125°C) ensures stable operation under RF power amplifier thermal stress; CFI compliance simplifies bootloader porting across hardware revisions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GP10TFI010 | Same density and pinout, but uses older 65-nm process; 110 ns tACC vs. 100 ns; no OTP array | Lacks SSR-based secure storage; unsuitable for applications requiring cryptographic key protection | Select only if cost sensitivity outweighs need for OTP security and tighter timing margins |
| MX29GL128FPTI-90G | 128 MB ×16, 90 ns tACC, but no hardware ECC and no versatile I/O (VIO fixed at VCC) | Requires external level shifters for 1.8 V controllers; no built-in error correction increases host validation burden | Choose only for legacy designs where ECC and mixed-voltage support are not required |
Compared with S29GL01GP10TFI010 and MX29GL128FPTI-90G, the S29GL01GT10TFA010 delivers superior reliability through integrated ECC and secure OTP, faster timing for XIP, and flexible I/O voltage-making it optimal for next-generation industrial and automotive firmware storage where data integrity and mixed-voltage compatibility are mandatory.
Availability
S29GL01GT10TFA010 is available at Aetrix Electronics and suitable for industrial PLC boot memory, automotive ADAS camera modules, medical imaging control boards, and telecom base station FPGA configuration requiring stable component supply across extended product lifecycles.
Supply support for S29GL01GT10TFA010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and memory solutions, with global R&D and manufacturing infrastructure.
The GL-T family targets high-reliability embedded systems requiring XIP-capable flash with robust data integrity, extended temperature operation, and secure configuration storage-designed specifically for industrial control, automotive, and medical applications.
FAQ
Does S29GL01GT10TFA010 support both ×8 and ×16 data bus widths?
Yes, it supports configurable ×8/×16 operation. When DQ15/A-1 is grounded, the device operates in ×8 mode with DQ0–DQ7 active; when floating or pulled high, it operates in ×16 mode with DQ0–DQ15 active. Address lines remain identical in both modes, with A0 determining byte alignment in ×16 mode.
What is the function of the SSR0–SSR3 regions in the OTP array?
SSR0–SSR3 are four 512-byte lockable sectors within the 2048-byte OTP array. SSR0 is factory-locked and immutable; SSR1 and SSR2 are user-lockable via command sequence; SSR3 supports password-based read protection. These regions store cryptographic keys, calibration data, or bootloader configuration with hardware-enforced access control.
How does the hardware ECC interact with the status register?
ECC status is reported in Status Register bits SR7 (ECC Fail) and SR6 (ECC Detected). When a correctable single-bit error occurs, SR6 sets and data is corrected transparently; if uncorrectable multi-bit error is detected, SR7 sets and the read returns invalid data. Both flags persist until cleared by a Read Status Register command or hardware reset.
Is the S29GL01GT10TFA010 compatible with JEDEC-standard parallel NOR flash interfaces?
It implements the Common Flash Interface (CFI) specification and supports standard AMD/Fujitsu command sets (e.g., Read Array, Program, Sector Erase). While pin-compatible with JEDEC JESD21-C compliant devices, its Versatile I/O feature and OTP architecture extend beyond baseline JEDEC requirements, requiring minor bootloader adaptations for full feature utilization.
S29GL01GT10TFA010 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL01GT10TFA010 FAQ
1.How can I place an order for S29GL01GT10TFA010 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GT10TFA010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GT10TFA010 reliable?
The price and inventory of S29GL01GT10TFA010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GT10TFA010 is usually 5 days.
3.What payment methods are accepted for S29GL01GT10TFA010?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GT10TFA010 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GT10TFA010?
S29GL01GT10TFA010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GT10TFA010 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GT10TFA010?
For technical support, including S29GL01GT10TFA010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GT10TFA010 requirements.
6.How does Aetrix verify that S29GL01GT10TFA010 is sourced from the original manufacturer or authorized distributors?
All S29GL01GT10TFA010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GT10TFA010 meets industry standards.
7.What is the process for return or replacement of S29GL01GT10TFA010?
All S29GL01GT10TFA010 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GT10TFA010, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GT10TFA010 part is unused and in its original packaging.
Return procedure for S29GL01GT10TFA010:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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