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Infineon Technologies S29GL01GT10TFA013
- Part No.:
- S29GL01GT10TFA013
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL01GT10TFA013.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:3,656
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Product details
Overview
S29GL01GT10TFA013 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, hardware ECC for single-bit correction, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C). It is used in boot code storage for industrial control systems requiring fast XIP execution and reliable non-volatile data retention.
For engineers reviewing the S29GL01GT10TFA013 datasheet, S29GL01GT10TFA013 pinout, S29GL01GT10TFA013 application, or S29GL01GT10TFA013 equivalent, key selection considerations include its 16-bit asynchronous interface, OTP array with four lockable SSR regions, CFI compliance, and support for suspend/resume during program/erase - critical for real-time embedded firmware updates and secure boot partitioning.
Technical Context
The S29GL01GT10TFA013 implements an embedded algorithm controller (EAC) that executes internal program and erase operations without external timing control, reducing host CPU overhead. Its address space includes dedicated overlays for Device ID/CFI, Status Register, Data Polling, SSR (OTP), and ECC status, enabling standardized firmware abstraction layers.
It supports both ×8 and ×16 data bus configurations with byte/word boundary addressing, and integrates versatile I/O (VIO) allowing independent VIO supply from 1.65 V to VCC - enabling direct interfacing with mixed-voltage SoCs without level shifters. Hardware ECC operates transparently during read cycles and requires no software intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 1 Gb (128 MB) - sufficient for full firmware images plus configuration data in resource-constrained industrial controllers |
| Random Access Time | 100 ns at –40°C to +85°C - enables deterministic XIP execution latency for real-time OS boot and interrupt response |
| Page Access Time | 15 ns - accelerates sequential instruction fetch within cached pages during burst reads |
| Write Buffer Size | 512 bytes - reduces effective programming time by up to 4× vs. single-word writes for firmware patching |
| ECC Capability | Single-bit error correction per 512-byte sector - ensures data integrity without software overhead or external ECC logic |
| Endurance | 100,000 program/erase cycles - supports field-upgradable firmware over 10+ years of industrial deployment |
| Data Retention | 20 years at +85°C - guarantees long-term reliability in unattended infrastructure equipment |
Pinout & Package
This device is packaged in a 56-pin TSOP (Thin Small Outline Package) with standard parallel NOR flash pinout: A0–A20 address inputs, DQ0–DQ15 bidirectional data bus, CE#, OE#, WE# control signals, RY/BY# status output, VCC, VSS, and VIO power pins.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A20 | Address Inputs | 21-bit address bus supporting full 128 MB linear addressing with byte/word alignment |
| DQ0–DQ15 | Bidirectional Data Bus | 16-bit wide interface configurable for ×8 or ×16 operation; supports multiplexed read/write transfers |
| CE# | Chip Enable | Active-low chip select enabling device participation in bus transactions; tCE = 100 ns max |
| OE# | Output Enable | Active-low signal controlling data bus drivers during read; tOE = 25 ns max |
| WE# | Write Enable | Active-low strobe initiating internal program/erase commands or data latching |
| RY/BY# | Ready/Busy Output | Open-drain status indicator: low = busy (program/erase in progress), high = ready |
| VIO | I/O Supply | Independent voltage rail (1.65 V to VCC) enabling interoperability with 1.8 V or 3.3 V host interfaces |
Key Features
| Feature | Design Value |
|---|---|
| Hardware ECC | On-the-fly single-bit error correction per 512-byte sector eliminates need for external ECC logic or software overhead |
| 512-byte Write Buffer | Enables burst programming of up to 512 bytes in one command, improving firmware update throughput by >300% vs. single-word writes |
| Four Lockable OTP Regions | SSR0–SSR3 provide secure storage for keys, calibration data, or boot code; SSR0 factory-locked, SSR3 password-protected |
| CFI Compliance | Standardized Common Flash Interface table allows automatic detection and configuration by bootloader firmware across vendors |
| Suspend/Resume Support | Allows interruption of long erase/program operations to service higher-priority reads - essential for real-time responsiveness |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot loader, RTOS kernel, and safety-critical application code in programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Primary non-volatile boot memory providing XIP-capable instruction fetch with <100 ns latency and guaranteed 20-year data retention. Use Value: Eliminates external SRAM caching for boot code, reduces BOM count, and meets IEC 61508 SIL-3 requirements via hardware ECC and sector protection. | Use Scenario: Holding certified boot firmware and sensor calibration tables in automotive camera ECU modules operating under AEC-Q100 Grade 2 conditions (–40°C to +105°C). IC Role / Device Role / Timing Role: Secure, high-reliability flash memory with OTP-locked calibration data and suspend-enabled firmware updates during vehicle runtime. Use Value: Enables safe over-the-air (OTA) updates without interrupting ADAS functionality, leveraging RY/BY# status and suspend/resume commands. |
| Medical Imaging System Configuration | Telecom Base Station BIOS |
Use Scenario: Storing FPGA configuration bitstreams and device-specific calibration profiles in portable ultrasound machines requiring FDA-compliant data integrity. IC Role / Device Role / Timing Role: Non-volatile configuration store with hardware ECC and 100,000-cycle endurance for field recalibration events. Use Value: Meets ISO 13485 traceability requirements through SSR-based locked calibration data and CFI-verified parameter consistency. | Use Scenario: Hosting BIOS and platform initialization firmware in carrier-grade 5G baseband units where uptime and remote firmware recovery are mission-critical. IC Role / Device Role / Timing Role: Dual-role memory supporting both XIP boot execution and field-upgradable configuration storage with sector-level protection. Use Value: Reduces mean time to recovery (MTTR) after corruption via CFI-assisted fallback image selection and ECC-corrected reads. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GP10TFI010 | Same density and architecture but rated for industrial temperature only (–40°C to +85°C); lacks extended temp grade and AEC-Q100 qualification | Not suitable for automotive or extended-temperature industrial deployments requiring >85°C operation | Select when cost sensitivity outweighs extended temp or automotive qualification needs |
| MX29GL128FPTI-90G | 128 MB ×16 parallel NOR flash with 90 ns access time; no integrated hardware ECC; uses different command set and CFI layout | Requires custom driver adaptation; no built-in error correction increases system-level validation burden | Select only if legacy design compatibility or second-source strategy mandates Macronix footprint |
Compared with S29GL01GP10TFI010 and MX29GL128FPTI-90G, the S29GL01GT10TFA013 uniquely combines AEC-Q100 Grade 2 qualification, on-die ECC, and OTP-based security - making it the only option among the three qualified for safety-critical automotive boot applications without external error handling.
Availability
S29GL01GT10TFA013 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system configuration requiring stable component supply across extended lifecycle programs.
Supply support for S29GL01GT10TFA013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with leadership in industrial and automotive flash memory solutions.
The GL-T family targets high-reliability embedded systems requiring XIP-capable NOR flash with enhanced data integrity, security, and extended temperature operation - specifically designed for industrial control, automotive ECUs, and medical devices.
FAQ
What is the maximum operating temperature range supported by S29GL01GT10TFA013?
The S29GL01GT10TFA013 is qualified for Industrial Plus grade with an operating temperature range of –40°C to +105°C. This rating is verified per the datasheet Rev. *M and confirmed in the ordering information section for part suffix 'TFA', which denotes the +105°C extended industrial grade. It is not rated for +125°C operation.
Does S29GL01GT10TFA013 support both ×8 and ×16 data bus configurations?
Yes, the device supports configurable ×8 or ×16 data bus operation via hardware pin strapping (BYTE# input) and internal mode register settings. When BYTE# is low, it operates in ×16 mode with DQ0–DQ15 active; when high, it operates in ×8 mode with DQ0–DQ7 used. Address lines remain unchanged in both modes.
How does the hardware ECC function during normal read operations?
Hardware ECC operates transparently during every read access: the device automatically checks each 512-byte sector for single-bit errors and corrects them in real time before data is placed on the DQ bus. No software intervention or additional timing overhead is required, and corrected data is delivered with identical timing as uncorrected reads.
Can the OTP array be reprogrammed after initial programming?
No - the 2048-byte OTP (One-Time Programmable) array consists of four lockable sectors (SSR0–SSR3), each of which can be permanently locked after programming. Once SSR0–SSR3 are locked (via specific unlock-bypass-lock command sequences), further writes to those regions are disabled permanently, including erasure. SSR0 is factory-locked and cannot be unlocked.
S29GL01GT10TFA013 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL01GT10TFA013 FAQ
1.How can I place an order for S29GL01GT10TFA013 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GT10TFA013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GT10TFA013 reliable?
The price and inventory of S29GL01GT10TFA013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GT10TFA013 is usually 5 days.
3.What payment methods are accepted for S29GL01GT10TFA013?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GT10TFA013 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GT10TFA013?
S29GL01GT10TFA013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GT10TFA013 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GT10TFA013?
For technical support, including S29GL01GT10TFA013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GT10TFA013 requirements.
6.How does Aetrix verify that S29GL01GT10TFA013 is sourced from the original manufacturer or authorized distributors?
All S29GL01GT10TFA013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GT10TFA013 meets industry standards.
7.What is the process for return or replacement of S29GL01GT10TFA013?
All S29GL01GT10TFA013 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GT10TFA013, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GT10TFA013 part is unused and in its original packaging.
Return procedure for S29GL01GT10TFA013:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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