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Infineon Technologies S29GL01GT10TFI010
- Part No.:
- S29GL01GT10TFI010
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL01GT10TFI010.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:586
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Product details
Overview
S29GL01GT10TFI010 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, hardware ECC for single-bit correction, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C). It is used in boot code storage for industrial controllers requiring deterministic XIP execution.
For engineers reviewing the S29GL01GT10TFI010 datasheet, S29GL01GT10TFI010 pinout, S29GL01GT10TFI010 application, or S29GL01GT10TFI010 equivalent, key selection criteria include verified 100,000 program/erase cycles, 20-year data retention, CFI-compliant interface, OTP array with four lockable SSR regions, and support for suspend/resume during embedded operations.
Technical Context
This device implements an asynchronous parallel interface with ×8/×16 data bus configuration and byte/word boundary addressing. Its embedded algorithm controller (EAC) manages all program/erase operations, including automatic ECC generation and status reporting via Status Register, Data Polling, or RY/BY# pin.
The versatile I/O feature enables independent VIO supply (1.65 V to VCC), allowing interoperability with mixed-voltage host systems. Sector protection includes both volatile (lock bits) and non-volatile (ASP) methods, while the 2048-byte OTP array provides secure boot code storage with factory-locked SSR0 and password-protected SSR3.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 1 Gb (128 MB) - sufficient for full firmware images and dual-bank boot code storage |
| Access Time (tACC) | 100 ns at –40°C to +85°C - enables real-time XIP execution without CPU stall penalties |
| Page Access Time (tPACC) | 15 ns - accelerates sequential instruction fetch in page mode |
| Write Buffer Size | 512 bytes - reduces effective programming time by batching up to 256 words per operation |
| ECC Support | Internal hardware single-bit error correction - maintains data integrity without software overhead |
| Endurance & Retention | 100,000 program/erase cycles / 20-year data retention - meets long-life industrial deployment requirements |
| Operating Voltage | VCC = 2.7 V to 3.6 V, VIO = 1.65 V to VCC - supports legacy and low-voltage host interfaces |
| Temperature Grade | Industrial (–40°C to +85°C) - qualified for uncontrolled ambient environments in factory automation |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-142AB footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address Inputs | 22-bit address bus supporting full 128-MB linear space with byte/word alignment |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional bus; operates in ×8 or ×16 mode per configuration pins |
| CE#, OE#, WE# | Chip Enable, Output Enable, Write Enable | Asynchronous control signals enabling standard SRAM-like read/write timing |
| RY/BY# | Ready/Busy Output | Open-drain status indicator for polling-based operation monitoring |
| VCC, VIO, GND | Power Supplies | Separate core (VCC) and I/O (VIO) rails allow voltage translation between host and flash |
| RESET# | Hardware Reset Input | Asynchronous reset that forces device into standby and clears internal state |
Key Features
| Feature | Design Value |
|---|---|
| 45-nm MIRRORBIT™ Technology | Enables higher density and lower power vs. older floating-gate NOR, with improved endurance |
| 512-byte Programming Buffer | Reduces average programming time by >3× compared to single-word writes in firmware update scenarios |
| Hardware ECC Engine | Corrects single-bit errors on-the-fly during read, eliminating need for external error-handling logic |
| Uniform 128-KB Sectors | Simplifies partitioning for bootloader, kernel, and filesystem sections with consistent erase granularity |
| OTP Array with SSR Locking | Four 512-byte lockable regions enable secure boot key storage and immutable configuration blocks |
Applications
| Industrial PLC Firmware Storage | Automotive Instrument Cluster Boot Memory |
|---|---|
Use Scenario: Storing boot loader and real-time control firmware in programmable logic controllers deployed in factory environments. IC Role / Device Role / Timing Role: Primary non-volatile boot code storage with XIP capability and deterministic 100 ns access for hard real-time task startup. Use Value: Eliminates external RAM copy step during boot; supports field firmware updates via sector erase without disrupting runtime operation. | Use Scenario: Holding calibrated display firmware and safety-critical initialization routines in automotive digital instrument clusters. IC Role / Device Role / Timing Role: AEC-Q100 grade 3 qualified boot memory interfacing directly to MCU's parallel bus for cold-start execution. Use Value: Meets automotive reliability requirements with 100K cycle endurance and 20-year retention under thermal cycling. |
| Medical Imaging System Configuration | Telecom Base Station Boot Loader |
Use Scenario: Storing calibration tables, sensor profiles, and regulatory compliance settings in portable ultrasound devices. IC Role / Device Role / Timing Role: Secure, tamper-resistant configuration store using OTP SSR3 with password read protection. Use Value: Prevents unauthorized modification of FDA-cleared parameters while enabling field recalibration via protected update paths. | Use Scenario: Hosting primary bootloader and FPGA configuration bitstreams in carrier-grade 5G base station control modules. IC Role / Device Role / Timing Role: High-reliability parallel flash with suspend/resume for safe over-the-air (OTA) updates during active radio operation. Use Value: Enables zero-downtime firmware upgrades by pausing erase/program without corrupting active system state. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GP10TFI010 | Same density and package, but uses 64-ball LAE BGA (9 mm × 9 mm); no TSOP option | Preferred for space-constrained PCB layouts where footprint area is critical | Select when board space is limited and BGA assembly capability exists |
| MX29GL128FHT2I-90G | 128 MB, 90 ns tACC, 3.3 V only, no versatile I/O (VIO = VCC), no OTP array | Lacks SSR-based security and mixed-voltage flexibility; lower cost for basic boot storage | Select when security and voltage flexibility are not required and cost sensitivity dominates |
Compared with S29GL01GP10TFI010, this TSOP variant offers easier prototyping and rework; versus MX29GL128FHT2I-90G, it adds OTP security, wider VIO range, and superior endurance-justifying use in certified industrial and automotive systems.
Availability
S29GL01GT10TFI010 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive instrument cluster boot memory, and medical imaging system configuration requiring stable component supply across extended product lifecycles.
Supply support for S29GL01GT10TFI010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global manufacturing and quality certification to ISO/TS 16949 and AEC-Q standards.
The GL-T family targets high-reliability embedded systems needing deterministic boot performance, combining XIP speed with data storage density-designed specifically for industrial automation, automotive, and medical equipment where firmware integrity and longevity are critical.
FAQ
What is the maximum operating temperature range for S29GL01GT10TFI010?
This part is rated for the industrial temperature range of –40°C to +85°C, as confirmed in the datasheet revision *M. It does not support extended (–40°C to +125°C) or automotive grade 2 (–40°C to +105°C) variants - those require different suffixes (e.g., "T" for +105°C, "X" for +125°C).
Does S29GL01GT10TFI010 support both ×8 and ×16 data bus modes?
Yes, it supports configurable ×8 or ×16 operation via hardware pin strapping (BYTE# input). In ×16 mode, DQ15–DQ0 transfer 16-bit words; in ×8 mode, DQ7–DQ0 transfer bytes with DQ15–DQ8 unused. Addressing remains word-aligned in both configurations.
How is the OTP array structured and secured?
The 2048-byte OTP array is divided into four 512-byte sectors (SSR0–SSR3). SSR0 is factory-locked and permanently read-only. SSR3 supports password-based read protection, while SSR1 and SSR2 are user-lockable via dedicated commands. All SSRs are one-time programmable and non-erasable.
Can S29GL01GT10TFI010 be used with a 1.8 V I/O interface?
Yes, its versatile I/O feature allows VIO from 1.65 V to VCC. With VCC = 3.3 V, VIO can be set to 1.8 V, enabling direct connection to 1.8 V logic without level shifters - provided timing margins (e.g., tOE = 35 ns) are met per the datasheet's Versatile I/O timing table.
S29GL01GT10TFI010 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL01GT10TFI010 FAQ
1.How can I place an order for S29GL01GT10TFI010 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GT10TFI010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GT10TFI010 reliable?
The price and inventory of S29GL01GT10TFI010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GT10TFI010 is usually 5 days.
3.What payment methods are accepted for S29GL01GT10TFI010?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GT10TFI010 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GT10TFI010?
S29GL01GT10TFI010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GT10TFI010 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GT10TFI010?
For technical support, including S29GL01GT10TFI010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GT10TFI010 requirements.
6.How does Aetrix verify that S29GL01GT10TFI010 is sourced from the original manufacturer or authorized distributors?
All S29GL01GT10TFI010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GT10TFI010 meets industry standards.
7.What is the process for return or replacement of S29GL01GT10TFI010?
All S29GL01GT10TFI010 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GT10TFI010, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GT10TFI010 part is unused and in its original packaging.
Return procedure for S29GL01GT10TFI010:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL01GT10TFI010 Tags
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