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Infineon Technologies S29GL01GT10TFI020
- Part No.:
- S29GL01GT10TFI020
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL01GT10TFI020.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:105
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Product details
Overview
S29GL01GT10TFI020 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, hardware ECC for single-bit correction, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C). It is used in boot code storage for network routers requiring fast XIP execution and reliable firmware retention.
For engineers reviewing the S29GL01GT10TFI020 datasheet, S29GL01GT10TFI020 pinout, S29GL01GT10TFI020 application, or S29GL01GT10TFI020 equivalent, key selection criteria include parallel ×16 bus interface timing, OTP array configuration (SSR0–SSR3), sector protection volatility, CFI compliance, and industrial-grade thermal performance across voltage variations.
Technical Context
This device implements an asynchronous parallel interface with byte/word boundary addressing and supports both 8-bit and 16-bit data bus widths. Its embedded algorithm controller (EAC) manages program, erase, suspend/resume, and automatic ECC operations without host intervention.
The flash array is organized into uniform 128-KB sectors, each independently erasable, and includes a dedicated 2048-byte one-time programmable (OTP) array partitioned into four lockable regions-SSR0 (factory-locked), SSR1–SSR3-with SSR3 supporting password-based read protection.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 1 Gb (128 MB) - sufficient for full boot image + firmware + parameter storage in edge gateway applications |
| Access time (tACC) | 100 ns at –40°C to +85°C - enables direct XIP execution from flash without external cache penalty |
| Page access time (tPACC) | 15 ns - accelerates sequential instruction fetch during burst reads |
| Write buffer size | 512 bytes - reduces effective programming time by batching up to 256 words per command |
| ECC capability | Single-bit error correction via internal hardware - eliminates need for external ECC logic in safety-critical boot paths |
| Endurance | 100,000 program/erase cycles - supports field firmware updates over 10+ years of operation |
| Data retention | 20 years at +85°C - ensures long-term reliability in uncooled industrial enclosures |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-141AC footprint, lead-free and RoHS compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 | Address inputs | 24-bit address bus supporting full 128 MB linear addressing with byte/word alignment |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; operates in ×8 or ×16 mode per configuration |
| CE# | Chip enable | Active-low chip select; tCE = 100 ns max - defines minimum chip activation delay |
| OE# | Output enable | Active-low read strobe; tOE = 25 ns max - controls data valid window timing |
| WE# | Write enable | Active-low write strobe; initiates program/erase commands when CE# and OE# are inactive |
| RY/BY# | Ready/Busy output | Open-drain status indicator; low during embedded operations, high when ready |
| VCC | Core supply | 2.7 V to 3.6 V single supply - powers core logic and memory array |
| VIO | I/O supply | 1.65 V to VCC - enables interfacing with mixed-voltage SoCs (e.g., 1.8 V I/O, 3.3 V core) |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O voltage range | VIO supports 1.65 V to VCC - allows seamless integration with 1.8 V, 2.5 V, or 3.3 V host processors without level shifters |
| Hardware ECC engine | On-die single-bit error correction - eliminates software overhead and guarantees boot code integrity without host CPU involvement |
| OTP array with SSR locking | 2048-byte factory-programmable space split into four regions, with SSR0 permanently locked and SSR3 password-protected - secures bootloader keys and calibration data |
| CFI-compliant interface | Standard Common Flash Interface table accessible via ID-CFI ASO - enables automatic driver detection and cross-platform firmware compatibility |
| Suspend/resume capability | Interrupts active program or erase to service high-priority read requests - maintains real-time responsiveness in multitasked embedded OS environments |
Applications
| Industrial HMI Boot Storage | Telecom Edge Router Firmware |
|---|---|
Use Scenario: Storing boot loader and real-time OS kernel in panel-mounted HMIs deployed in factory automation cabinets. IC Role / Device Role / Timing Role: Primary non-volatile boot memory providing XIP-capable instruction fetch with ≤100 ns latency. Use Value: Eliminates external SRAM cache requirement due to fast random access and built-in ECC, reducing BOM cost and board area. | Use Scenario: Holding firmware images and configuration tables in carrier-grade edge routers operating continuously in telecom central offices. IC Role / Device Role / Timing Role: High-reliability firmware repository supporting field upgrades and A/B partitioning via sector-level erase control. Use Value: 100,000 erase cycles and 20-year data retention ensure >10 years of uninterrupted service with zero firmware corruption incidents. |
| Automotive ADAS Camera Module | Medical Imaging Device Calibration |
Use Scenario: Storing camera firmware and sensor calibration parameters in AEC-Q100 grade 3 automotive vision modules. IC Role / Device Role / Timing Role: Qualified non-volatile memory meeting –40°C to +85°C industrial-plus spec with OTP-secured calibration data. Use Value: SSR3 password protection prevents unauthorized access to proprietary image tuning algorithms while maintaining traceable update history. | Use Scenario: Retaining factory-calibrated ADC offset/gain coefficients and safety-critical diagnostic routines in portable ultrasound systems. IC Role / Device Role / Timing Role: Secure, long-life parameter storage with hardware ECC and sector-lock protection against accidental overwrite. Use Value: Guarantees measurement accuracy over product lifetime by preventing bit-rot corruption in critical calibration constants. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GT10TFI010 | Same die, identical specs, but rated for –40°C to +105°C industrial-plus grade | Required for extended-temperature industrial controllers or fanless embedded systems with higher ambient thermal load | Select when ambient operating temperature exceeds +85°C; otherwise, S29GL01GT10TFI020 offers optimal cost/performance balance at industrial grade |
| S29GL01GT11TFI020 | Different timing grade: tACC = 110 ns (vs. 100 ns), same package and feature set | Suitable for cost-sensitive designs where marginal timing margin is acceptable, e.g., legacy processor interfaces with relaxed setup/hold | Choose only if system timing budget permits 10 ns slower access; avoid for XIP-critical applications demanding sub-100 ns latency |
Compared with S29GL01GT10TFI010 and S29GL01GT11TFI020, the S29GL01GT10TFI020 delivers the best combination of speed (100 ns tACC), industrial temperature compliance, and cost for mainstream embedded boot applications - making it the default choice unless extended temperature or cost-down drives alternative selection.
Availability
S29GL01GT10TFI020 is available at Aetrix Electronics and suitable for industrial HMI boot storage, telecom edge router firmware, and automotive ADAS camera module applications requiring stable component supply, long-lifecycle support, and guaranteed traceable sourcing.
Supply support for S29GL01GT10TFI020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global R&D and manufacturing infrastructure.
The GL-T family targets high-reliability embedded systems needing fast XIP execution and robust firmware storage, combining NOR flash speed with data-flash density and advanced protection features.
FAQ
What is the difference between S29GL01GT10TFI020 and S29GL01GT10TFI010?
The S29GL01GT10TFI020 is rated for –40°C to +85°C (industrial grade), while the S29GL01GT10TFI010 extends to +105°C (industrial-plus grade). Both share identical density, timing (100 ns tACC), package, and feature set including OTP and ECC. The higher-grade variant is intended for thermally demanding environments like enclosed industrial controllers or fanless gateways.
Does S29GL01GT10TFI020 support both ×8 and ×16 data bus modes?
Yes, the device supports configurable ×8 (byte) or ×16 (word) operation via hardware pin strapping (BYTE# signal). In ×16 mode, DQ0–DQ15 carry full 16-bit data; in ×8 mode, only DQ0–DQ7 are active with DQ8–DQ15 unused. Address lines remain unchanged in both configurations, and all commands function identically.
How is the 2048-byte OTP array protected and accessed?
The OTP array is divided into four 512-byte sectors (SSR0–SSR3), each independently lockable. SSR0 is factory-permanently locked; SSR1 and SSR2 are volatile-lockable via command; SSR3 supports password-based read protection. Access requires issuing specific CFI-compatible unlock sequences followed by SSR-specific read commands - no standard read commands retrieve OTP content.
Can S29GL01GT10TFI020 be used in automotive applications?
No - S29GL01GT10TFI020 is qualified only for industrial temperature range (–40°C to +85°C) and lacks AEC-Q100 certification. For automotive use, Infineon offers variants like S29GL01GT10TFI022 (AEC-Q100 grade 3) or S29GL01GT10TFI021 (grade 2), which include additional qualification testing, enhanced screening, and automotive-specific documentation.
S29GL01GT10TFI020 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL01GT10TFI020 FAQ
1.How can I place an order for S29GL01GT10TFI020 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GT10TFI020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GT10TFI020 reliable?
The price and inventory of S29GL01GT10TFI020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GT10TFI020 is usually 5 days.
3.What payment methods are accepted for S29GL01GT10TFI020?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GT10TFI020 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GT10TFI020?
S29GL01GT10TFI020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GT10TFI020 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GT10TFI020?
For technical support, including S29GL01GT10TFI020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GT10TFI020 requirements.
6.How does Aetrix verify that S29GL01GT10TFI020 is sourced from the original manufacturer or authorized distributors?
All S29GL01GT10TFI020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GT10TFI020 meets industry standards.
7.What is the process for return or replacement of S29GL01GT10TFI020?
All S29GL01GT10TFI020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GT10TFI020, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GT10TFI020 part is unused and in its original packaging.
Return procedure for S29GL01GT10TFI020:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL01GT10TFI020 Tags
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