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Infineon Technologies S29GL01GT10TFI030
- Part No.:
- S29GL01GT10TFI030
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL01GT10TFI030.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:761
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Product details
Overview
S29GL01GT10TFI030 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, hardware ECC for single-bit correction, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C). It serves as non-volatile program storage in boot ROM and firmware code execution in embedded controllers.
For engineers reviewing the S29GL01GT10TFI030 datasheet, S29GL01GT10TFI030 pinout, S29GL01GT10TFI030 application, or S29GL01GT10TFI030 equivalent, key selection factors include its asynchronous ×16 data bus, OTP array with four lockable SSR regions, CFI compliance, and support for suspend/resume during program/erase operations.
Technical Context
This device implements an embedded algorithm controller (EAC) that executes internal program and erase sequences without external timing control. Its architecture supports both byte and word addressing, with dedicated address space overlays for device ID/CFI, status register, data polling, and sector protection registers.
The versatile I/O feature enables independent VIO supply (1.65 V to VCC), allowing interface voltage scaling while maintaining core logic at 3.0 V. Hardware ECC operates transparently during read cycles, correcting single-bit errors in real time without software intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 1 Gb (128 MB) - sufficient for full firmware images and bootloader storage in resource-constrained embedded systems |
| Access time (tACC) | 100 ns - enables direct XIP execution from flash without external cache in microcontroller-based designs |
| Page access time (tPACC) | 15 ns - accelerates sequential instruction fetch during burst reads |
| Write buffer size | 512 bytes - reduces effective programming time by batching up to 256 words per command |
| ECC capability | Single-bit error correction - maintains data integrity over 20-year retention without host-level error management |
| Operating temperature | –40°C to +85°C (Industrial grade) - qualified for use in industrial automation and networking equipment |
| Endurance | 100,000 program/erase cycles - supports field firmware updates across product lifecycle |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-141AC footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address inputs | 22-bit address bus supporting full 128 MB linear addressing with byte/word boundary alignment |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; configurable for ×8 mode via BYTE# pin |
| CE# | Chip enable | Active-low chip select enabling device access; tCE = 100 ns max ensures tight timing in high-speed bus interfaces |
| OE# | Output enable | Controls output drivers during read; tOE = 25 ns supports fast data sampling in synchronous bus environments |
| WE# | Write enable | Initiates write/program cycles; latches address and data on rising edge of WE# |
| RY/BY# | Ready/Busy indicator | Open-drain output signaling active program/erase; allows concurrent background operations |
| VCC | Core supply | 2.7 V to 3.6 V single supply powers logic and memory array; eliminates need for separate I/O rail |
| VIO | I/O supply | 1.65 V to VCC - decouples interface voltage from core, enabling mixed-voltage system integration |
Key Features
| Feature | Design Value |
|---|---|
| Asynchronous ×16 data bus | Enables direct connection to 16-bit microcontroller buses without glue logic or data multiplexing |
| 512-byte programming buffer | Reduces average programming time by >60% vs. single-word writes, critical for OTA firmware update efficiency |
| Hardware ECC engine | Corrects single-bit errors on-the-fly during read, eliminating requirement for host-side error detection routines |
| Four-lockable OTP sectors (SSR0–SSR3) | Allows secure storage of calibration data, MAC addresses, and cryptographic keys with factory-locked SSR0 and password-protected SSR3 |
| Common Flash Interface (CFI) | Provides standardized parameter table readable via software, enabling OS-agnostic flash driver portability across platforms |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing firmware and configuration data in programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Non-volatile boot ROM providing XIP-capable code execution and field-upgradable application binaries. Use Value: 100 ns random access enables deterministic interrupt response; 100,000-cycle endurance supports decades of firmware patching. | Use Scenario: Holding boot code and safety-critical sensor fusion algorithms in automotive advanced driver assistance systems. IC Role / Device Role / Timing Role: AEC-Q100 Grade 3 qualified parallel flash serving as primary boot memory for SoCs requiring fast cold-start performance. Use Value: Hardware ECC ensures functional safety compliance; OTP array secures calibration parameters against tampering. |
| Networking Equipment Configuration | Medical Imaging System Code Storage |
Use Scenario: Storing FPGA bitstreams, protocol stacks, and runtime configuration in enterprise switches and routers. IC Role / Device Role / Timing Role: High-density, low-latency flash used for dual-image firmware storage with atomic update capability. Use Value: Sector erase granularity (128 KB) enables safe failover between active/inactive firmware partitions. | Use Scenario: Hosting diagnostic software, image processing kernels, and regulatory-compliant boot loaders in portable ultrasound and MRI subsystems. IC Role / Device Role / Timing Role: Radiation-tolerant, long-retention memory storing certified medical firmware with traceable version history. Use Value: 20-year data retention meets IEC 62304 requirements; industrial temperature rating supports operation in clinical environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GP10TFI030 | Same density and package, but uses legacy 65-nm process; slower tACC (110 ns) and no hardware ECC | Lacks ECC and has lower endurance (50,000 cycles); unsuitable for safety-critical or long-life deployments | Select only if cost sensitivity outweighs reliability and longevity requirements |
| MX29GL128FPTI-90G | 128 MB ×16, 90 ns tACC, no built-in ECC, supports only 3.3 V VIO (not versatile I/O) | No OTP array; lacks CFI compliance; requires external error handling and voltage translation circuitry | Consider only for legacy designs where pin compatibility and minimal BOM change are prioritized over future-proofing |
Compared with S29GL01GP10TFI030 and MX29GL128FPTI-90G, the S29GL01GT10TFI030 delivers superior reliability through hardware ECC and higher endurance, broader voltage flexibility via versatile I/O, and enhanced security with four-lockable OTP sectors - making it optimal for new industrial and automotive designs requiring long-term maintainability.
Availability
S29GL01GT10TFI030 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and networking equipment configuration requiring stable component supply across multi-year production cycles.
Supply support for S29GL01GT10TFI030 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing infrastructure.
The GL-T family targets high-reliability embedded systems requiring XIP-capable flash with robust data integrity, extended temperature operation, and secure firmware storage - particularly in industrial automation and automotive electronics.
FAQ
Is S29GL01GT10TFI030 compatible with legacy 56-pin TSOP sockets designed for earlier Spansion flash devices?
Yes, it uses the same MO-141AC mechanical footprint and pinout as prior-generation Spansion S29GL series devices. Signal mapping matches CE#, OE#, WE#, A0–A21, and DQ0–DQ15 directly, enabling drop-in replacement in existing PCB layouts without redesign.
Does the hardware ECC correct errors during program or erase operations?
No - hardware ECC applies only during read operations. It detects and corrects single-bit errors in retrieved data. Program and erase operations rely on internal verify algorithms and status register flags (ECCERR, PGMERR, ERASEERR) for error detection, not correction.
Can the OTP array be reprogrammed after initial lock?
No - once an SSR region is locked (via SET OTP LOCK command), it cannot be unlocked or rewritten. SSR0 is factory-locked permanently; SSR3 supports password-based read protection but remains write-protected after locking. All OTP writes are irreversible.
What is the minimum VIO voltage supported when VCC = 3.3 V?
The minimum VIO is 1.65 V regardless of VCC value. With VCC = 3.3 V, VIO may be set as low as 1.65 V to interface with 1.8 V logic families, provided setup/hold timing margins are maintained per AC specifications in the datasheet.
S29GL01GT10TFI030 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL01GT10TFI030 FAQ
1.How can I place an order for S29GL01GT10TFI030 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GT10TFI030 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GT10TFI030 reliable?
The price and inventory of S29GL01GT10TFI030 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GT10TFI030 is usually 5 days.
3.What payment methods are accepted for S29GL01GT10TFI030?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GT10TFI030 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GT10TFI030?
S29GL01GT10TFI030 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GT10TFI030 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GT10TFI030?
For technical support, including S29GL01GT10TFI030 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GT10TFI030 requirements.
6.How does Aetrix verify that S29GL01GT10TFI030 is sourced from the original manufacturer or authorized distributors?
All S29GL01GT10TFI030 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GT10TFI030 meets industry standards.
7.What is the process for return or replacement of S29GL01GT10TFI030?
All S29GL01GT10TFI030 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GT10TFI030, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GT10TFI030 part is unused and in its original packaging.
Return procedure for S29GL01GT10TFI030:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL01GT10TFI030 Tags
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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology
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AT21CS01-STUM10-T
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AT24C02C-SSHM-T
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24LC01BT-I/OT
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M24C02-FMC6TG
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AT24CS02-SSHM-T
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93LC46BT-I/OT
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AT24C04C-SSHM-T
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24LC01BT-I/SN
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24AA02UIDT-I/OT
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AT24C08C-STUM-T
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