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Infineon Technologies S29GL01GT11DHAV23
- Part No.:
- S29GL01GT11DHAV23
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL01GT11DHAV23.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,415
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Product details
Overview
S29GL01GT11DHAV23 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, internal single-bit ECC, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C). It is used in boot code storage for industrial controllers requiring deterministic XIP execution.
For engineers reviewing the S29GL01GT11DHAV23 datasheet, S29GL01GT11DHAV23 pinout, S29GL01GT11DHAV23 application, or S29GL01GT11DHAV23 equivalent, key selection criteria include parallel ×16 bus interface timing compliance, OTP array security configuration (SSR0–SSR3), ASP protection granularity, CFI parameter table support, and thermal grade validation for embedded control systems.
Technical Context
This device implements an asynchronous parallel interface with byte/word boundary addressing and supports both 8-bit and 16-bit data bus widths. Its embedded algorithm controller (EAC) manages program/erase operations with suspend/resume capability and status reporting via Status Register, Data Polling, and RY/BY# pin.
The internal hardware ECC corrects single-bit errors on-the-fly during read operations, while the 2048-byte one-time programmable (OTP) array includes four lockable sectors-SSR0 factory-locked, SSR3 password-protected-enabling secure boot key and configuration storage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 1 Gb (128 MB) - sufficient for full firmware image + parameter storage in industrial HMI and PLC boot loaders |
| Interface type | Asynchronous parallel ×16 - enables direct CPU address/data bus connection without translation logic |
| Random access time | 100 ns at –40°C to +85°C - meets real-time boot latency requirements for deterministic startup |
| Page access time | 15 ns - accelerates sequential instruction fetch during XIP execution |
| Write buffer size | 512 bytes - reduces effective programming time by batching up to 256 words per command |
| ECC capability | Single-bit error correction - ensures data integrity without software overhead in safety-critical applications |
| Endurance | 100,000 program/erase cycles - supports field firmware updates over 10+ year product lifecycle |
| Data retention | 20 years - guarantees long-term reliability of stored calibration and configuration data |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-142AB footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address inputs | 22-bit address bus supporting full 1 Gb linear addressing with byte/word alignment |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; operates in ×16 mode with DQ15/A-1 as LSB/MSB selector |
| CE# | Chip enable | Active-low chip select enabling device participation in bus transactions; tCE = 100 ns max |
| OE# | Output enable | Controls output drivers during read; tOE = 25 ns max ensures fast data sampling |
| WE# | Write enable | Initiates write/program/erase commands; latches command sequences on falling edge |
| RY/BY# | Ready/Busy indicator | Open-drain active-low signal indicating internal operation progress; eliminates polling overhead |
| VCC | Core supply | 2.7 V to 3.6 V single supply powers all read/program/erase functions |
| VIO | I/O supply | 1.65 V to VCC versatile I/O voltage allows interfacing with mixed-voltage SoCs |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O (VIO) | Supports 1.65 V to VCC I/O voltage - enables direct connection to 1.8 V, 2.5 V, or 3.3 V host processors without level shifters |
| Uniform 128-KB sectors | 64 identical erase blocks - simplifies firmware partitioning and wear leveling in bootloader design |
| Advanced sector protection (ASP) | Volatile and non-volatile locking per sector - prevents accidental overwrite of critical boot code during field updates |
| CFI parameter table | Standardized JEDEC JESD68 query structure - enables automatic driver detection and configuration in Linux MTD and U-Boot |
| OTP array with SSR lock | 2048-byte one-time programmable space with four lockable regions - secures cryptographic keys and device-specific identifiers |
Applications
| Industrial PLC Boot Memory | Medical Imaging System Firmware Storage |
|---|---|
Use Scenario: Stores boot loader and real-time OS kernel in programmable logic controller with deterministic startup requirement. IC Role / Device Role / Timing Role: Parallel NOR flash providing XIP-capable boot code execution with ≤100 ns random access latency. Use Value: Eliminates external RAM copy step during boot, reducing BOM count and power-on delay by >15 ms. | Use Scenario: Holds FPGA configuration bitstream and diagnostic firmware in portable ultrasound equipment. IC Role / Device Role / Timing Role: Non-volatile storage with 20-year data retention and AEC-Q100 grade 3 qualification for medical-grade reliability. Use Value: Ensures firmware persistence across 10,000+ power cycles and ambient temperature swings from 5°C to 40°C. |
| Automotive ADAS Camera Module | Ruggedized Edge Gateway Firmware |
Use Scenario: Stores camera ISP firmware and calibration data in rear-view ADAS module operating at –40°C to +105°C. IC Role / Device Role / Timing Role: Automotive-grade (AEC-Q100 Grade 2) parallel flash with 120 ns access at +105°C. Use Value: Maintains functional safety compliance under thermal stress without derating or throttling. | Use Scenario: Hosts secure boot firmware and encrypted OTA update payload in industrial IoT gateway deployed in oilfield environments. IC Role / Device Role / Timing Role: OTP-secured boot image storage with hardware ECC and sector-level ASP for tamper resistance. Use Value: Prevents unauthorized firmware modification and detects bit corruption before system initialization. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GT11TFIV23 | Same die, 64-ball LAE FBGA (9 mm × 9 mm) package - no TSOP footprint compatibility | Targeted for space-constrained automotive modules where board area is prioritized over manual reworkability | Select when PCB layout requires BGA miniaturization and automated assembly is available |
| S29GL01GP11TFIV23 | Legacy 65-nm process, slower 110 ns random access, no OTP array or SSR lock capability | Lacks secure boot features; suitable only for cost-sensitive consumer applications without firmware integrity requirements | Avoid for industrial/automotive use due to missing ECC, OTP, and ASP functionality |
Compared with S29GL01GT11TFIV23, the TSOP version offers easier prototyping and rework but larger footprint; versus S29GL01GP11TFIV23, it delivers verified ECC, OTP security, and faster timing essential for safety-certified firmware storage.
Availability
S29GL01GT11DHAV23 is available at Aetrix Electronics and suitable for industrial PLCs, medical imaging systems, automotive ADAS modules, and ruggedized edge gateways requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for S29GL01GT11DHAV23 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for industrial, automotive, and IoT applications.
The GL-T family was designed specifically for high-reliability embedded boot code storage, combining XIP performance with data storage density and hardware-based security features like OTP and ECC.
FAQ
What is the purpose of the SSR0–SSR3 regions in the OTP array?
SSR0–SSR3 are four independent 512-byte lockable sectors within the 2048-byte OTP array. SSR0 is factory-locked and reserved for Infineon use; SSR3 supports password-based read protection. These regions store immutable keys, device IDs, or calibration data that must survive field updates and resist tampering.
Does S29GL01GT11DHAV23 support both ×8 and ×16 data bus modes?
Yes - it supports configurable ×8/×16 operation via DQ15/A-1 pin function selection. In ×16 mode, DQ0–DQ15 carry full word data; in ×8 mode, DQ0–DQ7 operate as data bus with DQ15/A-1 repurposed as address line A-1, enabling flexible integration with 8-bit microcontrollers.
How does the Versatile I/O (VIO) feature impact system design?
VIO allows independent 1.65 V to VCC I/O supply voltage, decoupling interface logic from core voltage. This permits direct connection to 1.8 V FPGAs or 2.5 V ASICs without external level shifters, reducing component count, signal integrity risk, and board area in mixed-voltage embedded systems.
Can the device perform program or erase operations while another sector is being read?
No - S29GL01GT11DHAV23 does not support true concurrent read/program or read/erase. However, suspend/resume commands allow pausing an ongoing program or erase operation to service a high-priority read request, then resuming the suspended operation without data loss or timing penalty.
S29GL01GT11DHAV23 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL01GT11DHAV23 FAQ
1.How can I place an order for S29GL01GT11DHAV23 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GT11DHAV23 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GT11DHAV23 reliable?
The price and inventory of S29GL01GT11DHAV23 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GT11DHAV23 is usually 5 days.
3.What payment methods are accepted for S29GL01GT11DHAV23?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GT11DHAV23 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GT11DHAV23?
S29GL01GT11DHAV23 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GT11DHAV23 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GT11DHAV23?
For technical support, including S29GL01GT11DHAV23 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GT11DHAV23 requirements.
6.How does Aetrix verify that S29GL01GT11DHAV23 is sourced from the original manufacturer or authorized distributors?
All S29GL01GT11DHAV23 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GT11DHAV23 meets industry standards.
7.What is the process for return or replacement of S29GL01GT11DHAV23?
All S29GL01GT11DHAV23 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GT11DHAV23, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GT11DHAV23 part is unused and in its original packaging.
Return procedure for S29GL01GT11DHAV23:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL01GT11DHAV23 Tags
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