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Infineon Technologies S29GL01GT11DHB010
- Part No.:
- S29GL01GT11DHB010
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL01GT11DHB010.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,093
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Product details
Overview
S29GL01GT11DHB010 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, hardware ECC for single-bit correction, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C). It is used in boot code storage for embedded microcontrollers in industrial control systems.
For engineers reviewing the S29GL01GT11DHB010 datasheet, S29GL01GT11DHB010 pinout, S29GL01GT11DHB010 application, or S29GL01GT11DHB010 equivalent, key selection criteria include parallel ×16 bus interface timing, OTP array configuration, sector protection granularity, and AEC-Q100 grade compatibility for automotive variants.
Technical Context
This device implements an asynchronous parallel interface with CE#, OE#, and WE# control signals, supporting byte/word addressing and page-mode read operations. Its embedded algorithm controller (EAC) manages program/erase sequences, status monitoring via Status Register or Data Polling, and automatic ECC generation/correction during read cycles.
The flash array is organized into uniform 128-KB sectors, each independently erasable, and includes a dedicated 2048-byte one-time programmable (OTP) array partitioned into four lockable regions (SSR0–SSR3), with SSR0 factory-locked and SSR3 password-protected.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 1 Gb (128 MB) - supports full firmware image storage for mid-tier microcontrollers |
| Interface type | Parallel ×16 - enables direct connection to 16-bit microprocessor address/data buses without glue logic |
| Random access time | 100 ns at –40°C to +85°C - meets real-time boot latency requirements for industrial PLCs |
| Page access time | 15 ns - accelerates sequential instruction fetch in XIP execution mode |
| Write buffer size | 512 bytes - reduces effective programming time by batching up to 256 words per command |
| ECC capability | Internal hardware single-bit error correction - ensures data integrity without host CPU overhead |
| Endurance | 100,000 program/erase cycles - suitable for field-upgradable firmware with infrequent updates |
| Data retention | 20 years - guarantees long-term reliability in unpowered storage applications |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-141AC footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address inputs | 22-bit address bus supporting full 128 MB linear addressing (byte/word boundary aligned) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports ×8 or ×16 operation via BYTE# signal |
| CE# | Chip enable | Active-low device select; controls power state entry and access timing window |
| OE# | Output enable | Active-low read strobe; gates output drivers during asynchronous read cycles |
| WE# | Write enable | Active-low write strobe; initiates program/erase commands and data latching |
| RY/BY# | Ready/Busy indicator | Open-drain output signaling internal operation progress; used for polling-based status detection |
| VCC | Core supply | 2.7 V to 3.6 V single supply powering core logic and memory array |
| VIO | I/O supply | 1.65 V to VCC versatile I/O voltage - allows interfacing with mixed-voltage SoCs |
| RESET# | Hardware reset | Active-low asynchronous reset that halts ongoing operations and returns device to read mode |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O voltage range | VIO supports 1.65 V to VCC - enables interoperability with 1.8 V, 2.5 V, and 3.3 V host processors |
| Uniform 128-KB sector architecture | 1024 independent sectors - simplifies firmware partitioning and over-the-air update management |
| Dedicated OTP array | 2048-byte region with four lockable SSRs - secures bootloader keys, calibration data, and device identity |
| CFI-compliant parameter table | Standardized JEDEC JESD68 query structure - enables automatic driver initialization in Linux/U-Boot environments |
| Suspend/Resume for program/erase | Interruptible erase cycles - allows high-priority read access during long-duration sector erases |
Applications
| Industrial PLC Firmware Storage | Automotive Instrument Cluster Boot Memory |
|---|---|
Use Scenario: Storing boot code and runtime firmware for programmable logic controllers deployed in factory automation. IC Role / Device Role / Timing Role: Parallel NOR flash providing XIP-capable boot memory mapped directly to ARM Cortex-M7 address space. Use Value: 100 ns random access ensures sub-100 µs interrupt response after reset; 128-KB sector granularity aligns with IEC 61131-3 firmware update blocks. | Use Scenario: Holding calibrated display graphics and safety-critical boot firmware in automotive digital instrument clusters. IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 (–40°C to +105°C) non-volatile memory storing signed bootloader and GUI assets. Use Value: Hardware ECC prevents silent corruption of safety-critical display assets; OTP array stores cryptographic keys for secure boot verification. |
| Medical Imaging System Configuration | Telecom Baseband Processor Code Storage |
Use Scenario: Retaining calibration profiles, sensor compensation tables, and regulatory compliance settings in portable ultrasound devices. IC Role / Device Role / Timing Role: Non-volatile configuration store accessed during power-up initialization sequence of FPGA-based imaging pipeline. Use Value: 20-year data retention guarantees calibration persistence across device lifetime; 512-byte write buffer minimizes reprogramming time during field service. | Use Scenario: Hosting DSP firmware and protocol stacks for 4G/LTE baseband processors in small-cell radio units. IC Role / Device Role / Timing Role: High-reliability parallel flash executing XIP code while supporting concurrent background firmware updates. Use Value: Suspend/Resume capability allows real-time packet processing during sector erase; CFI support enables standardized driver integration in Yocto Linux BSPs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GP11TFB010 | Same density and timing, but uses 64-ball LAE BGA (9 mm × 9 mm) instead of TSOP | Targeted at space-constrained PCB layouts where board area is prioritized over manual assembly | Select when footprint miniaturization and thermal performance outweigh hand-soldering feasibility |
| N25Q064A13ESE40F | 64 Mb serial Quad SPI interface, 80 MHz clock, no parallel bus or hardware ECC | Requires SPI controller and software ECC layer; lower pin count but higher latency for random reads | Select only if system already uses SPI flash infrastructure and can tolerate 8× slower random access vs. 100 ns |
Compared with S29GL01GP11TFB010, this TSOP variant offers easier prototyping and thermal management; versus N25Q064A13ESE40F, it delivers deterministic low-latency XIP execution but requires more PCB real estate and routing complexity.
Availability
S29GL01GT11DHB010 is available at Aetrix Electronics and suitable for industrial control, automotive instrumentation, medical imaging, and telecom infrastructure requiring stable component supply across extended product lifecycles.
Supply support for S29GL01GT11DHB010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and non-volatile memory solutions, with global manufacturing and R&D centers.
The GL-T family targets high-reliability embedded systems needing fast XIP execution and robust data retention, specifically designed for industrial, automotive, and medical applications demanding AEC-Q100 qualification and long-term supply stability.
FAQ
What is the purpose of the SSR0–SSR3 regions in the OTP array?
SSR0–SSR3 are four separately lockable 512-byte regions within the 2048-byte OTP array. SSR0 is factory-locked and reserved for Infineon use; SSR3 supports password-based read protection. These regions securely store immutable data such as cryptographic keys, calibration constants, or device-specific identifiers that must survive field reprogramming.
Does S29GL01GT11DHB010 support both ×8 and ×16 data bus configurations?
Yes, it supports both modes via the BYTE# input signal. When BYTE# is high, the device operates in ×16 mode with DQ0–DQ15 active; when low, it operates in ×8 mode with only DQ0–DQ7 used. Address lines remain unchanged, and all operations retain byte/word alignment per JEDEC specification.
How does hardware ECC function during read operations?
Hardware ECC runs transparently during every read cycle: the device calculates a Hamming code on-the-fly, detects single-bit errors in the retrieved data word, and corrects them before presenting data to the bus. No host intervention or additional timing overhead is required, and corrected data appears identical to uncorrupted reads.
Can sector protection be configured dynamically during runtime?
Yes, advanced sector protection (ASP) supports both volatile (cleared on power cycle) and non-volatile (persistent) locking per sector. Volatile protection is set via Status Register bits and is ideal for temporary lockdown during firmware updates; non-volatile protection requires specific unlock/lock command sequences and persists through resets and power cycles.
S29GL01GT11DHB010 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL01GT11DHB010 FAQ
1.How can I place an order for S29GL01GT11DHB010 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GT11DHB010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GT11DHB010 reliable?
The price and inventory of S29GL01GT11DHB010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GT11DHB010 is usually 5 days.
3.What payment methods are accepted for S29GL01GT11DHB010?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GT11DHB010 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GT11DHB010?
S29GL01GT11DHB010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GT11DHB010 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GT11DHB010?
For technical support, including S29GL01GT11DHB010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GT11DHB010 requirements.
6.How does Aetrix verify that S29GL01GT11DHB010 is sourced from the original manufacturer or authorized distributors?
All S29GL01GT11DHB010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GT11DHB010 meets industry standards.
7.What is the process for return or replacement of S29GL01GT11DHB010?
All S29GL01GT11DHB010 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GT11DHB010, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GT11DHB010 part is unused and in its original packaging.
Return procedure for S29GL01GT11DHB010:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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