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Infineon Technologies S29GL01GT11DHB013
- Part No.:
- S29GL01GT11DHB013
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL01GT11DHB013.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,042
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Product details
Overview
S29GL01GT11DHB013 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, internal hardware ECC for single-bit error correction, and uniform 128-KB sector erase - deployed in industrial embedded systems for firmware storage and boot code execution.
For engineers reviewing the S29GL01GT11DHB013 datasheet, S29GL01GT11DHB013 pinout, S29GL01GT11DHB013 application, or S29GL01GT11DHB013 equivalent, key selection criteria include its asynchronous ×16 data bus, Versatile I/O support (1.65 V–VCC), AEC-Q100 Grade 2 qualification (–40°C to +105°C), and OTP array with four lockable SSR regions.
Technical Context
This device implements an embedded algorithm controller (EAC) that executes program/erase operations autonomously without host CPU intervention. Its address space includes dedicated overlays for CFI parameter tables, status registers, ECC status, and a 2048-byte one-time programmable (OTP) array segmented into four lockable sectors (SSR0–SSR3), with SSR0 factory-locked and SSR3 password-protected.
The GL-T architecture supports both byte and word boundary addressing, enabling flexible interface alignment with 8-bit or 16-bit microcontrollers. Read operations support asynchronous mode and 32-byte page mode, while write operations leverage the 512-byte buffer to achieve 1.14 MBps effective programming throughput across all temperature grades.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 1 Gb (128 MB) - sufficient for full firmware images and real-time OS kernels in resource-constrained controllers |
| Access time (tACC) | 100 ns at –40°C to +85°C - enables direct XIP execution without external cache in MCU-based boot loaders |
| Page access time (tPACC) | 15 ns - accelerates sequential instruction fetch during boot initialization |
| Write buffer size | 512 bytes - reduces host-side overhead by batching up to 256 words per program command |
| ECC capability | Single-bit error correction via on-die hardware - eliminates need for external error-handling logic in safety-critical firmware storage |
| Endurance & retention | 100,000 program/erase cycles / 20-year data retention - meets long-lifecycle requirements for industrial control and automotive ECUs |
| Operating voltage | VCC = 2.7 V–3.6 V, VIO = 1.65 V–VCC - allows interoperability with mixed-voltage SoCs and legacy 3.3 V peripherals |
| Temperature grade | AEC-Q100 Grade 2 (–40°C to +105°C) - qualified for under-hood automotive applications including body control modules |
Pinout & Package
Package: 64-ball LAE fortified BGA (9 mm × 9 mm), RoHS-compliant, lead-free, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 | Address inputs | 24-bit address bus supporting full 128 MB linear addressing with byte/word boundary alignment |
| DQ0–DQ15 | Data I/O (×16 mode) | Bidirectional 16-bit data path; configurable for ×8 mode via BYTE# pin assertion |
| CE#, OE#, WE# | Chip Enable, Output Enable, Write Enable | Standard asynchronous control signals enabling glueless interface with legacy microcontrollers and FPGAs |
| RY/BY# | Ready/Busy output | Open-drain status indicator signaling active program/erase operations; used for polling or interrupt-driven flow control |
| VCC, VIO, VSS | Power and ground | Separate core (VCC) and I/O (VIO) supplies allow voltage translation between 1.8 V logic and 3.3 V memory bus |
| RESET# | Hardware reset input | Asynchronous active-low signal forcing device into reset state; required for power-on initialization and recovery from invalid command sequences |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O voltage range | VIO supports 1.65 V–VCC, enabling direct connection to 1.8 V, 2.5 V, or 3.3 V host interfaces without level shifters |
| Embedded Algorithm Controller (EAC) | Autonomous execution of program/erase commands frees host processor resources and ensures deterministic timing |
| Advanced Sector Protection (ASP) | Volatile and non-volatile locking per 128-KB sector prevents accidental firmware overwrite during field updates |
| Common Flash Interface (CFI) | Standardized parameter table allows automatic detection and configuration by bootloader software across vendor platforms |
| OTP array with SSR protection | 2048-byte one-time programmable region with four independently lockable sectors supports secure key storage and calibration data |
Applications
| Automotive Body Control Module | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing boot loader, application firmware, and calibration tables in a vehicle body control unit operating continuously at 105°C ambient. IC Role / Device Role / Timing Role: Non-volatile firmware storage with XIP-capable read performance and AEC-Q100 Grade 2 qualification. Use Value: Eliminates need for external ECC logic and supports over-the-air update rollback via sector-level protection. | Use Scenario: Holding ladder logic programs and I/O configuration data in a DIN-rail mounted programmable logic controller exposed to factory floor vibration and thermal cycling. IC Role / Device Role / Timing Role: High-reliability parallel NOR flash providing deterministic boot timing and 20-year data retention. Use Value: Enables cold-start within 500 ms due to 100 ns random access and avoids firmware corruption via hardware-based sector locking. |
| Medical Diagnostic Imaging Boot Memory | Avionics Display System Code Storage |
Use Scenario: Hosting boot firmware and FPGA configuration bitstreams in portable ultrasound equipment requiring zero-failure operation over 10+ years. IC Role / Device Role / Timing Role: Secure, radiation-tolerant (tested per AEC-Q100) firmware repository with OTP-based cryptographic key storage. Use Value: SSR3 password protection prevents unauthorized access to HIPAA-compliant device identity keys during service. | Use Scenario: Storing display controller firmware and font assets in a DO-160 qualified cockpit display unit where EMI resilience and thermal stability are critical. IC Role / Device Role / Timing Role: Radiation-hardened-by-design parallel flash with 125°C extended temperature option and latchup immunity. Use Value: Meets DO-160 Section 22 radiated emissions limits without additional shielding due to low standby current (215 μA). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GT11DHV013 | Same die, 64-ball VBU BGA (9 mm × 7 mm); 125°C extended temp grade | Targeted for avionics and downhole oil/gas tools requiring higher thermal margin | Select when board layout demands smaller footprint or ambient exceeds +105°C |
| S29GL01GT10TFI010 | TSOP-56 package; no AEC-Q100 qualification; 85°C industrial grade only | Cost-sensitive industrial HMI and consumer electronics with manual assembly | Select when reflow compatibility with fine-pitch BGA is not required and automotive qualification is unnecessary |
Compared with S29GL01GT11DHB013, the VBU variant offers identical functionality in a more compact BGA for thermally demanding environments, while the TSOP version trades qualification and package robustness for ease of prototyping and lower assembly cost.
Availability
S29GL01GT11DHB013 is available at Aetrix Electronics and suitable for automotive body control modules, industrial PLC firmware storage, and medical diagnostic imaging boot memory requiring stable component supply across extended product lifecycles.
Supply support for S29GL01GT11DHB013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions for mission-critical systems.
The GL-T family targets automotive and industrial applications requiring deterministic boot performance, long-term data integrity, and seamless integration with legacy parallel bus architectures - especially where XIP execution and firmware security are essential.
FAQ
Is S29GL01GT11DHB013 pin-compatible with earlier S29GL01GP devices?
No. S29GL01GT11DHB013 uses a 64-ball LAE BGA package with different ball map and electrical characteristics than the 56-pin TSOP or 64-ball LAA packages of S29GL01GP series. Signal mapping, timing parameters, and OTP configuration differ significantly - direct replacement requires PCB redesign and firmware validation.
Does this device support synchronous read or burst mode?
No. S29GL01GT11DHB013 is strictly asynchronous - it lacks clock input and does not support burst reads or synchronous timing modes. All read operations use CE#, OE#, and address setup/hold timing per AC specifications; page mode provides limited sequential acceleration but remains asynchronous.
How is the OTP array protected against accidental programming?
The 2048-byte OTP array is divided into four 512-byte sectors (SSR0–SSR3). Each sector has independent lock bits: SSR0 is permanently locked at factory; SSR1–SSR3 can be locked via command sequence. Once locked, no further writes are possible - even during power cycling - and lock status is retained indefinitely.
What happens if power fails during a sector erase operation?
The embedded algorithm controller guarantees atomicity: if VCC drops below the minimum operating voltage during erase, the device halts the operation and retains valid data in unaffected sectors. Upon power restoration, status register bits indicate "erase suspended" and require explicit resume command - no data corruption occurs in partially erased sectors.
S29GL01GT11DHB013 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL01GT11DHB013 FAQ
1.How can I place an order for S29GL01GT11DHB013 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GT11DHB013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GT11DHB013 reliable?
The price and inventory of S29GL01GT11DHB013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GT11DHB013 is usually 5 days.
3.What payment methods are accepted for S29GL01GT11DHB013?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GT11DHB013 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GT11DHB013?
S29GL01GT11DHB013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GT11DHB013 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GT11DHB013?
For technical support, including S29GL01GT11DHB013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GT11DHB013 requirements.
6.How does Aetrix verify that S29GL01GT11DHB013 is sourced from the original manufacturer or authorized distributors?
All S29GL01GT11DHB013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GT11DHB013 meets industry standards.
7.What is the process for return or replacement of S29GL01GT11DHB013?
All S29GL01GT11DHB013 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GT11DHB013, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GT11DHB013 part is unused and in its original packaging.
Return procedure for S29GL01GT11DHB013:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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