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Infineon Technologies S29GL01GT11DHB020
- Part No.:
- S29GL01GT11DHB020
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL01GT11DHB020.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:210
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Product details
Overview
S29GL01GT11DHB020 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, hardware ECC for single-bit correction, uniform 128-KB sectors, and supports industrial temperature range (–40°C to +85°C). It is used in boot code storage for network routers requiring fast XIP execution and reliable firmware retention.
For engineers reviewing the S29GL01GT11DHB020 datasheet, S29GL01GT11DHB020 pinout, S29GL01GT11DHB020 application, or S29GL01GT11DHB020 equivalent, key selection criteria include asynchronous parallel interface timing, sector protection granularity, OTP array configuration, and AEC-Q100 grade compatibility for embedded control systems.
Technical Context
This device implements an asynchronous parallel interface with ×8/×16 data bus support and byte/word boundary addressing. Its embedded algorithm controller (EAC) handles program, erase, and suspend/resume operations autonomously without external timing control.
The internal hardware ECC engine corrects single-bit errors on-the-fly during read operations, while the status register and RY/BY# pin provide real-time operation status. Sector protection uses both volatile (via status register) and non-volatile (via ASP bits) methods per 128-KB sector.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 1 Gb (128 MB) - sufficient for full boot image + firmware + parameter storage in edge gateway applications |
| Access Time (tACC) | 100 ns at –40°C to +85°C - enables direct XIP execution from flash without CPU cache penalty |
| Page Access Time (tPACC) | 15 ns - accelerates sequential instruction fetch in burst-mode boot sequences |
| Write Buffer Size | 512 bytes - reduces effective programming time by batching up to 256 words per command |
| ECC Support | Internal single-bit error correction - eliminates need for external ECC logic in safety-critical boot paths |
| Endurance | 100,000 program/erase cycles - supports field firmware updates over 10+ years of deployment |
| Data Retention | 20 years - ensures long-term reliability in unpowered storage for industrial controllers |
Pinout & Package
Package: 56-pin TSOP (Type I, 14 mm × 20 mm, 0.55 mm pitch), RoHS-compliant, lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 | Address Inputs | 24-bit address bus supporting full 128 MB linear space; A0 selects byte/word mode when x16 configured |
| DQ0–DQ15 | Data I/O (x16) | Bidirectional 16-bit data bus; operates as DQ0–DQ7 in x8 mode with BYTE# control |
| CE# | Chip Enable | Active-low chip select; tCE = 100 ns max - defines minimum enable-to-access window for multi-device bus arbitration |
| OE# | Output Enable | Active-low read strobe; tOE = 25 ns max - controls data valid window relative to address setup |
| WE# | Write Enable | Active-low write strobe; initiates program/erase commands when combined with address/data sequences |
| RY/BY# | Ready/Busy Output | Open-drain status indicator; low during embedded operations - enables polling without interrupt overhead |
| VCC | Core Supply | 2.7–3.6 V single supply - simplifies power design vs. dual-rail flash; supports wide I/O voltage (VIO = 1.65–VCC) |
| RESET# | Hardware Reset | Active-low asynchronous reset - forces device into known state after power-up or brownout recovery |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O (VIO) | Supports 1.65 V to VCC I/O voltage - allows direct interfacing with 1.8 V, 2.5 V, or 3.3 V host processors without level shifters |
| OTP Array | 2048-byte one-time-programmable region with four lockable sectors (SSR0–SSR3) - enables secure bootloader key storage and device identity binding |
| Suspend/Resume | Interrupts active program/erase to service high-priority reads - maintains system responsiveness during firmware update |
| Common Flash Interface (CFI) | Standardized parameter table accessible via read commands - enables OS-agnostic flash driver auto-detection and configuration |
| Advanced Sector Protection (ASP) | Volatile and non-volatile locking per 128-KB sector - supports hierarchical firmware partitioning (bootloader, app, config) with independent write locks |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot firmware and runtime configuration in programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable instruction fetch with deterministic 100 ns access latency. Use Value: Eliminates external SRAM requirement for boot code caching; 20-year data retention ensures firmware integrity across equipment lifecycle. | Use Scenario: Holding certified boot loader and sensor calibration data in automotive camera ECU meeting AEC-Q100 Grade 2 (–40°C to +105°C). IC Role / Device Role / Timing Role: Safety-critical boot memory with hardware ECC and sector-level write protection to prevent unauthorized firmware modification. Use Value: Internal single-bit ECC satisfies ISO 26262 ASIL-B requirements without software overhead; OTP array secures cryptographic keys. |
| Network Router Boot Image | Medical Imaging System Parameter Storage |
Use Scenario: Hosting compressed Linux kernel and initramfs in enterprise-grade Layer 3 switches requiring rapid cold boot (<500 ms). IC Role / Device Role / Timing Role: High-speed parallel NOR flash enabling direct CPU instruction fetch with 15 ns page access for burst-mode boot sequences. Use Value: 512-byte write buffer cuts firmware update time by >40% vs. standard byte programming; CFI support simplifies driver porting across SoC platforms. | Use Scenario: Retaining calibrated sensor offsets and DICOM metadata templates in portable ultrasound devices operating in clinical environments. IC Role / Device Role / Timing Role: Reliable parameter storage with 100,000-cycle endurance to support frequent recalibration and regulatory audit logging. Use Value: Uniform 128-KB sector erase enables atomic parameter bank switching; industrial temperature rating ensures stability during sterilization cycles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GT10TFI020 | Same density and core specs, but 64-ball LAE BGA (9 mm × 9 mm) package instead of 56-pin TSOP | Targeted at space-constrained PCB layouts where board area is prioritized over manual rework accessibility | Select for high-density routing and automated assembly; requires different footprint and thermal pad design |
| S29GL512T10TFI020 | 512 Mb density, identical 45-nm process, timing, and feature set except reduced capacity and smaller OTP array (1024 bytes) | Suitable for cost-sensitive applications where 64 MB firmware image size is sufficient | Select when firmware footprint fits within 64 MB and BOM cost reduction is critical; shares same driver stack |
Compared with S29GL01GT11DHB020, the TSOP-packaged variant offers superior serviceability and thermal dissipation for industrial control panels, while the BGA alternative trades repairability for miniaturization, and the 512 Mb version reduces cost and power at the expense of firmware headroom.
Availability
S29GL01GT11DHB020 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and network router boot image applications requiring stable component supply across extended product lifecycles.
Supply support for S29GL01GT11DHB020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and non-volatile memory solutions for industrial and automotive markets.
The GL-T family was designed specifically for embedded systems requiring XIP-capable, high-reliability parallel NOR flash with integrated ECC and flexible sector protection - targeting boot code, firmware, and configuration storage in safety-critical applications.
FAQ
What is the function of the SSR0–SSR3 regions in the OTP array?
SSR0–SSR3 are four independently lockable 512-byte sectors within the 2048-byte OTP array. SSR0 is factory-locked and reserved for Infineon use; SSR3 supports password-based read protection. These regions store immutable data such as cryptographic keys, device serial numbers, or calibration constants that must survive field updates and resist tampering.
Does S29GL01GT11DHB020 support both x8 and x16 data bus configurations?
Yes, it supports configurable ×8 or ×16 operation via the BYTE# pin. When BYTE# is high, the device operates in ×16 mode using DQ0–DQ15; when low, it operates in ×8 mode using DQ0–DQ7 only. Address lines remain unchanged, and A0 determines word vs. byte addressing in ×16 mode.
How does the Versatile I/O (VIO) feature impact system-level design?
VIO allows VIO supply to range from 1.65 V to VCC, enabling direct connection to 1.8 V, 2.5 V, or 3.3 V host processors without external level shifters. This reduces BOM count, PCB area, and signal integrity risk while maintaining full timing compliance across mixed-voltage system architectures.
Can the device perform background operations while servicing read requests?
Yes, the suspend/resume functionality allows active program or erase operations to be paused for high-priority read access. After the read completes, the suspended operation resumes automatically. This ensures deterministic response time for real-time systems without requiring full operation cancellation and restart.
S29GL01GT11DHB020 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL01GT11DHB020 FAQ
1.How can I place an order for S29GL01GT11DHB020 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GT11DHB020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GT11DHB020 reliable?
The price and inventory of S29GL01GT11DHB020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GT11DHB020 is usually 5 days.
3.What payment methods are accepted for S29GL01GT11DHB020?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GT11DHB020 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GT11DHB020?
S29GL01GT11DHB020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GT11DHB020 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GT11DHB020?
For technical support, including S29GL01GT11DHB020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GT11DHB020 requirements.
6.How does Aetrix verify that S29GL01GT11DHB020 is sourced from the original manufacturer or authorized distributors?
All S29GL01GT11DHB020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GT11DHB020 meets industry standards.
7.What is the process for return or replacement of S29GL01GT11DHB020?
All S29GL01GT11DHB020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GT11DHB020, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GT11DHB020 part is unused and in its original packaging.
Return procedure for S29GL01GT11DHB020:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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