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Infineon Technologies S29GL01GT11DHB023
- Part No.:
- S29GL01GT11DHB023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL01GT11DHB023.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,080
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Product details
Overview
S29GL01GT11DHB023 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It integrates a 512-byte write buffer, hardware ECC for single-bit correction, and uniform 128-KB sector erase-designed for boot code storage in industrial embedded controllers requiring deterministic XIP execution.
For engineers reviewing the S29GL01GT11DHB023 datasheet, S29GL01GT11DHB023 pinout, S29GL01GT11DHB023 application, or S29GL01GT11DHB023 equivalent, key selection criteria include verified 100,000 program/erase cycles, industrial-grade temperature support (–40°C to +85°C), OTP array with four lockable SSR regions, and CFI-compliant software interface compatibility.
Technical Context
This device implements an asynchronous parallel interface with ×8/×16 data bus configuration and supports byte/word boundary addressing only. Its embedded algorithm controller (EAC) executes internal program and erase operations without external timing control, while status monitoring uses Data Polling, Status Register reads, and RY/BY# pin assertion.
The versatile I/O feature enables independent VIO supply (1.65 V to VCC), decoupling I/O voltage from core logic-critical for mixed-voltage SoC interfacing. Sector protection includes volatile (lock bits) and non-volatile (ASP) methods, and the 2048-byte OTP array contains factory-locked SSR0 and password-protected SSR3 for secure firmware signing keys.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 1 Gb (128 MB) - sufficient for full boot image + firmware + parameter storage in resource-constrained edge nodes |
| Access time (tACC) | 100 ns at –40°C to +85°C - enables direct XIP execution from flash without cache penalty in real-time control loops |
| Page access time (tPACC) | 15 ns - accelerates sequential instruction fetch during boot initialization |
| Write buffer size | 512 bytes - reduces effective programming time by batching up to 256 words per command, minimizing host CPU overhead |
| ECC capability | Internal hardware single-bit error correction - maintains data integrity over 20-year retention without host-side ECC management |
| Endurance | 100,000 program/erase cycles - supports field-updatable firmware in industrial gateways with multi-year service life |
| Operating temp | –40°C to +85°C (Industrial grade) - qualified for deployment in uncontrolled ambient environments like factory-floor HMIs |
Pinout & Package
Package: 56-pin TSOP (Type I, standard pitch). Pinout validated per Infineon datasheet Rev. *M, Section 12.1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address inputs | 22-bit address bus supporting full 128 MB linear space; A0 selects byte/word mode when configured for ×8/×16 operation |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional bus; operates in ×8 mode (DQ0–DQ7) or ×16 mode (DQ0–DQ15) depending on BYTE# state |
| CE# | Chip enable | Active-low enable controlling device selection; tCE = 100 ns max defines minimum chip-select assertion window for reliable read |
| OE# | Output enable | Active-low control for data output gating; tOE = 25 ns max ensures valid data hold timing relative to OE# deassertion |
| WE# | Write enable | Active-low signal initiating internal program/erase commands; latches command sequences on rising edge |
| RY/BY# | Ready/Busy indicator | Open-drain output asserting low during embedded operations; eliminates need for polling delay loops in host firmware |
| VCC | Core supply | 2.7 V to 3.6 V single supply powers core logic, charge pumps, and internal ECC engine |
| VIO | I/O supply | 1.65 V to VCC - allows interfacing with 1.8 V or 3.3 V host processors without level shifters |
Key Features
| Feature | Design Value |
|---|---|
| Hardware ECC engine | Single-bit error correction performed transparently during read; no host CPU intervention required for bit-flip recovery |
| 512-byte write buffer | Enables burst programming of up to 256 words in one command cycle, reducing total programming time by >60% vs. single-word writes |
| Uniform 128-KB sectors | Eliminates complexity of variable-sector architectures; simplifies bootloader partitioning and OTA update logic |
| CFI parameter table | Standardized JEDEC-compliant descriptor enabling automatic driver detection and configuration in Linux MTD and U-Boot |
| OTP array with SSR locking | Four 512-byte lockable regions (SSR0–SSR3); SSR0 factory-locked for immutable root key, SSR3 password-protected for customer keys |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot loader, real-time OS kernel, and safety-critical control algorithms in programmable logic controllers deployed in factory automation. IC Role / Device Role / Timing Role: Primary non-volatile boot memory providing XIP-capable instruction fetch with <100 ns latency to meet hard real-time deadlines. Use Value: Deterministic 100 ns random access and 15 ns page access ensure jitter-free instruction execution during motion control loop updates at 1 kHz. | Use Scenario: Holding certified boot firmware and sensor calibration data in front-camera modules compliant with ISO 26262 ASIL-B requirements. IC Role / Device Role / Timing Role: Secure, AEC-Q100 Grade 2 qualified flash storing signed firmware images with OTP-based key protection. Use Value: Factory-locked SSR0 and password-protected SSR3 prevent unauthorized firmware modification, satisfying automotive security audit requirements. |
| Medical Imaging System BIOS | Energy Meter Firmware Vault |
Use Scenario: Hosting diagnostic BIOS, FPGA configuration bitstreams, and regulatory-compliant calibration tables in portable ultrasound devices. IC Role / Device Role / Timing Role: High-reliability boot memory with 20-year data retention and 100,000-cycle endurance for infrequent but critical field updates. Use Value: Verified 20-year data retention at +85°C ensures calibration data integrity across product lifetime without battery-backed SRAM. | Use Scenario: Securing firmware, tariff tables, and cryptographic keys in smart electricity meters operating in outdoor utility cabinets. IC Role / Device Role / Timing Role: Industrial-grade flash with extended temperature support (–40°C to +85°C) and hardware ECC for long-term field reliability. Use Value: Internal ECC corrects bit errors induced by radiation and thermal stress, eliminating uncorrectable failures over 15+ year deployments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GP11DHB020 | Same 1 Gb density and 45-nm process, but lacks OTP array and SSR locking features | Not suitable for applications requiring secure key storage or firmware signing | Select only when security features are unnecessary and cost sensitivity dominates |
| MX29GL128FDT2I-90G | 128 MB density, 90 ns access time, no integrated ECC; requires external error handling | Lacks hardware ECC and OTP-increases host firmware complexity for data integrity | Consider only if legacy design mandates Macronix pinout compatibility and ECC is managed externally |
Compared with S29GL01GP11DHB020, this part adds secure OTP key storage; compared with MX29GL128FDT2I-90G, it delivers autonomous ECC correction and tighter 100 ns access timing-both critical for safety-certified boot memory.
Availability
S29GL01GT11DHB023 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system BIOS requiring stable component supply across extended product lifecycles.
Supply support for S29GL01GT11DHB023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.
The GL-T family targets high-reliability embedded systems needing deterministic XIP performance and long-term data integrity-specifically designed for industrial control, automotive boot, and medical device firmware storage.
FAQ
Does S29GL01GT11DHB023 support both ×8 and ×16 data bus configurations?
Yes. The device supports configurable ×8 or ×16 operation via the BYTE# pin: when BYTE# is high, DQ0–DQ7 operate as an 8-bit bus; when low, DQ0–DQ15 function as a 16-bit bus. Address lines A0–A21 remain identical in both modes, with A0 used to select byte alignment in ×8 mode per JEDEC JESD21-C specification.
What is the purpose of the SSR0–SSR3 regions in the OTP array?
SSR0–SSR3 are four 512-byte lockable regions within the 2048-byte OTP array. SSR0 is factory-locked and immutable, intended for root-of-trust keys; SSR3 supports password-based read protection for customer-defined keys. SSR1 and SSR2 are user-lockable via command sequence, enabling layered firmware signing key management without external secure elements.
How does the hardware ECC engine operate during read cycles?
The ECC engine automatically checks each 512-byte page during read access. If a single-bit error is detected, it is corrected in real time before data is presented on DQ pins; no interrupt or status flag is asserted. Uncorrectable multi-bit errors trigger the Status Register's "ECC Error" bit and assert RY/BY# low, requiring host firmware to initiate recovery or fallback procedures.
Can S29GL01GT11DHB023 be used in automotive applications requiring AEC-Q100 qualification?
No. S29GL01GT11DHB023 is specified for Industrial grade (–40°C to +85°C) only. For automotive use, Infineon offers the S29GL01GT11DHV020 variant, which is AEC-Q100 Grade 2 qualified (–40°C to +105°C) and undergoes additional stress testing including HTOL and ESD per automotive standards.
S29GL01GT11DHB023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL01GT11DHB023 FAQ
1.How can I place an order for S29GL01GT11DHB023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GT11DHB023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GT11DHB023 reliable?
The price and inventory of S29GL01GT11DHB023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GT11DHB023 is usually 5 days.
3.What payment methods are accepted for S29GL01GT11DHB023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GT11DHB023 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GT11DHB023?
S29GL01GT11DHB023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GT11DHB023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GT11DHB023?
For technical support, including S29GL01GT11DHB023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GT11DHB023 requirements.
6.How does Aetrix verify that S29GL01GT11DHB023 is sourced from the original manufacturer or authorized distributors?
All S29GL01GT11DHB023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GT11DHB023 meets industry standards.
7.What is the process for return or replacement of S29GL01GT11DHB023?
All S29GL01GT11DHB023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GT11DHB023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GT11DHB023 part is unused and in its original packaging.
Return procedure for S29GL01GT11DHB023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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