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Infineon Technologies S29GL01GT11DHIV23
- Part No.:
- S29GL01GT11DHIV23
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL01GT11DHIV23.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,617
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Product details
Overview
S29GL01GT11DHIV23 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC with MIRRORBIT™ technology, designed for embedded code storage and XIP execution in industrial and automotive systems. It operates from 2.7 V to 3.6 V, delivers 100 ns random access time and 15 ns page access time, features 512-byte write buffer, internal single-bit ECC, and supports uniform 128-KB sector erase.
For engineers reviewing the S29GL01GT11DHIV23 datasheet, S29GL01GT11DHIV23 pinout, S29GL01GT11DHIV23 application, or S29GL01GT11DHIV23 equivalent, key selection criteria include parallel ×16 bus interface, industrial-plus temperature grade (–40°C to +105°C), OTP array with four lockable SSR regions, and CFI-compliant command set for firmware update reliability.
Technical Context
This device implements an asynchronous parallel interface with byte/word boundary addressing and supports both 8-bit and 16-bit data bus configurations. Its embedded algorithm controller (EAC) manages program, erase, and suspend/resume operations autonomously, while hardware-based ECC corrects single-bit errors during read cycles without CPU intervention.
The GL-T architecture integrates Common Flash Interface (CFI) parameter tables for host software identification and configuration, and uses advanced sector protection (ASP) with volatile/non-volatile locking per sector. The 2048-byte OTP array includes factory-locked SSR0 and password-protected SSR3 for secure boot code storage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 1 Gb (128 MB) - sufficient for full firmware images and dual-bank OTA updates in industrial controllers |
| Access time (tACC) | 100 ns at –40°C to +85°C - enables direct XIP execution without external cache in real-time systems |
| Page access time (tPACC) | 15 ns - accelerates sequential instruction fetch in boot ROM applications |
| Write buffer size | 512 bytes - reduces effective programming time by 4× vs. single-word writes in field firmware updates |
| ECC capability | Single-bit correction per 512-byte sector - maintains data integrity over 20-year retention without software overhead |
| Endurance | 100,000 program/erase cycles - supports frequent field reprogramming in test equipment and gateway devices |
| Operating temp | –40°C to +105°C (Industrial Plus) - qualified for under-hood automotive ECUs and industrial PLCs |
Pinout & Package
Package: 64-ball LAE fortified BGA (9 mm × 9 mm), RoHS-compliant, lead-free, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 | Address inputs | 24-bit address bus supporting full 128-MB linear space; A0 selects byte/word mode when configured |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional bus; supports ×8 or ×16 operation via BYTE# pin control |
| CE#, OE#, WE# | Chip/Output/Write enable | Asynchronous control signals; CE# gating enables low-power standby when inactive |
| RY/BY# | Ready/Busy output | Open-drain status indicator; asserts low during embedded program/erase to prevent bus contention |
| VCC, VIO | Power supplies | Separate core (2.7–3.6 V) and I/O (1.65–VCC) rails - allows interfacing with 1.8 V or 3.3 V controllers |
| RESET# | Hardware reset | Asynchronous active-low input that forces device into known state and clears status registers |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O voltage range | VIO supports 1.65 V to VCC - eliminates level shifters when connecting to mixed-voltage SoCs |
| 512-byte programming buffer | Enables burst programming of up to 512 bytes per command - cuts firmware update time by >70% vs. legacy flash |
| Hardware ECC engine | Corrects single-bit errors on-the-fly during read - removes need for software CRC layers in safety-critical boot paths |
| Four-lock OTP array (SSR0–SSR3) | SSR0 factory-locked + SSR3 password-protected - secures bootloader and cryptographic keys against unauthorized overwrite |
| CFI parameter table | Standardized JEDEC-compliant descriptor - enables automatic driver initialization in Linux U-Boot and RTOS BSPs |
Applications
| Automotive Engine Control Unit (ECU) | Industrial Programmable Logic Controller (PLC) |
|---|---|
Use Scenario: Storing calibrated engine maps and diagnostic firmware in AEC-Q100 Grade 2 qualified ECU. IC Role / Device Role / Timing Role: Primary non-volatile code storage with XIP support for real-time instruction fetch during combustion cycle timing. Use Value: 100 ns random access ensures deterministic interrupt latency; OTP SSR regions protect calibration data from accidental corruption. | Use Scenario: Hosting ladder logic runtime and field-upgradable I/O configuration in DIN-rail mounted PLC. IC Role / Device Role / Timing Role: Dual-bank flash for safe firmware swap during runtime; sector erase enables partial update without full reboot. Use Value: 128-KB uniform sectors simplify partitioning; 100,000-cycle endurance supports daily firmware revisions in manufacturing test cells. |
| Medical Imaging System Boot ROM | Telecom Base Station FPGA Configuration |
Use Scenario: Secure boot image storage for FDA-cleared MRI subsystem with tamper-resistant firmware validation. IC Role / Device Role / Timing Role: Trusted boot source verified via hardware ECC and locked OTP region containing public key hash. Use Value: Internal ECC guarantees bit-level integrity over 20-year product lifecycle; SSR3 password protection prevents unauthorized key replacement. | Use Scenario: Storing partial reconfiguration bitstreams for Xilinx Kintex FPGAs in 5G remote radio units. IC Role / Device Role / Timing Role: High-speed parallel interface delivers 1.14 MBps buffer programming - reduces FPGA reload time after RF calibration. Use Value: 15 ns page access accelerates bitstream streaming; Versatile I/O allows direct connection to 1.8 V FPGA configuration pins. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GT10DHIV23 | Same die, but Industrial grade (–40°C to +85°C); no +105°C qualification | Lacks extended thermal margin for under-hood or high-ambient industrial enclosures | Select when cost-sensitive designs operate within standard industrial temperature range |
| MX29GL128FPTI-90G | 128-MB density (1/8 capacity); 90 ns tACC; no OTP array or SSR protection | Insufficient for full firmware + OTA staging partitions; lacks secure boot primitives | Choose only for legacy board replacements where footprint and timing match but security is not required |
Compared with S29GL01GT10DHIV23, this part adds +105°C operation and retains identical timing and feature set; versus MX29GL128FPTI-90G, it provides 8× density, OTP security, and ECC - critical for next-gen firmware integrity requirements.
Availability
S29GL01GT11DHIV23 is available at Aetrix Electronics and suitable for automotive ECU development, industrial PLC firmware storage, and medical imaging boot ROM applications requiring stable component supply across long production lifecycles.
Supply support for S29GL01GT11DHIV23 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and non-volatile memory solutions for mission-critical systems.
The GL-T family targets high-reliability embedded applications demanding XIP-capable flash with robust data integrity, extended temperature operation, and secure firmware storage - especially in automotive and industrial automation.
FAQ
What is the purpose of the SSR0–SSR3 regions in the OTP array?
SSR0–SSR3 are four 512-byte lockable sectors within the 2048-byte OTP array. SSR0 is permanently locked at factory and typically holds immutable boot code; SSR3 supports password-based read protection for sensitive keys. SSR1 and SSR2 are user-configurable for firmware version stamps or calibration data, enabling hierarchical security without external crypto elements.
Does S29GL01GT11DHIV23 support both ×8 and ×16 data bus modes?
Yes - the device automatically detects bus width via the BYTE# pin: pulled high for ×16 mode (DQ0–DQ15 active), pulled low for ×8 mode (DQ0–DQ7 active). Address lines remain unchanged in both configurations, and all commands function identically, simplifying PCB layout reuse across 8-bit and 16-bit host interfaces.
How does the hardware ECC interact with the status register during read operations?
During each read, hardware ECC checks every 512-byte sector. If a single-bit error is detected, it is corrected transparently and the ECC Status Register (bit 4) is set. No CPU intervention is needed, and corrected data appears on DQ lines. Multi-bit errors trigger uncorrectable status (bit 5), halting further reads until cleared via command sequence - ensuring deterministic fault handling in safety systems.
Can the device be used in hot-swap or dynamic voltage scaling environments?
Yes - the separate VCC (core) and VIO (I/O) supplies allow independent voltage sequencing. VIO may be ramped before VCC during power-up, and the device remains functional down to 1.65 V on VIO while VCC stabilizes. This supports hot-swap backplane designs and adaptive power domains in multi-rail systems without external supervisors.
S29GL01GT11DHIV23 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL01GT11DHIV23 FAQ
1.How can I place an order for S29GL01GT11DHIV23 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GT11DHIV23 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GT11DHIV23 reliable?
The price and inventory of S29GL01GT11DHIV23 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GT11DHIV23 is usually 5 days.
3.What payment methods are accepted for S29GL01GT11DHIV23?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GT11DHIV23 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GT11DHIV23?
S29GL01GT11DHIV23 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GT11DHIV23 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GT11DHIV23?
For technical support, including S29GL01GT11DHIV23 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GT11DHIV23 requirements.
6.How does Aetrix verify that S29GL01GT11DHIV23 is sourced from the original manufacturer or authorized distributors?
All S29GL01GT11DHIV23 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GT11DHIV23 meets industry standards.
7.What is the process for return or replacement of S29GL01GT11DHIV23?
All S29GL01GT11DHIV23 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GT11DHIV23, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GT11DHIV23 part is unused and in its original packaging.
Return procedure for S29GL01GT11DHIV23:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL01GT11DHIV23 Tags
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M24C02-WMN6TP
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