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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL01GT11FAIV10

Name: S29GL01GT11FAIV10
Brand: Infineon Technologies
SKU: S29GL01GT11FAIV10
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL01GT11FAIV10

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL01GT11FAIV10.pdf

Description:: IC FLASH 1GBIT PARALLEL 64FBGA

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Product details

Overview

S29GL01GT11FAIV10 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC with MIRRORBIT™ technology, designed for embedded code storage and XIP execution in industrial and automotive systems. It operates from 2.7 V to 3.6 V, delivers 100 ns random access time and 15 ns page access time at –40°C to +85°C, and integrates hardware ECC for single-bit error correction.

For engineers reviewing the S29GL01GT11FAIV10 datasheet, S29GL01GT11FAIV10 pinout, S29GL01GT11FAIV10 application, or S29GL01GT11FAIV10 equivalent, this device supports asynchronous 32-byte page reads, 512-byte buffer programming, uniform 128-KB sector erase, and AEC-Q100 Grade 3 qualification - critical for automotive infotainment boot code and industrial HMI firmware storage.

Technical Context

This device implements a parallel asynchronous interface with ×8/×16 data bus support and versatile I/O (VIO = 1.65 V to VCC), enabling interoperability with mixed-voltage microcontrollers. Its embedded algorithm controller (EAC) manages program/erase operations, suspend/resume functionality, and status reporting via Status Register, Data Polling, or RY/BY# pin.

The flash array is organized into uniform 128-KB sectors with advanced sector protection (ASP), including volatile/non-volatile locking and a separate 2048-byte OTP array with four lockable SSR regions - SSR0 factory-locked, SSR3 password-protected - supporting secure boot and configuration storage.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory density	1 Gb (128 MB) - sufficient for full firmware images and dual-bank OTA update partitions in automotive ECUs.
Access time (tACC)	100 ns at –40°C to +85°C - enables direct XIP execution from flash without external cache in Cortex-M7/M33 applications.
Page access time (tPACC)	15 ns - accelerates sequential instruction fetch during burst reads in real-time control loops.
Programming buffer	512 bytes - reduces effective programming time by >3× vs. single-word writes, critical for field firmware updates.
ECC capability	Internal hardware single-bit error correction - eliminates need for external ECC logic in safety-critical boot ROM paths.
Endurance & retention	100,000 program/erase cycles and 20-year data retention - meets ASIL-B functional safety requirements for automotive storage.
Operating temperature	–40°C to +85°C (Industrial Grade) - validated for under-hood and dashboard-mounted electronics per AEC-Q100 Grade 3.

Pinout & Package

Package: 56-pin TSOP (Type I, standard pitch). Pinout conforms to JEDEC MO-141AC, with address (A0–A20), data (DQ0–DQ15), and control signals (CE#, OE#, WE#, RY/BY#, RESET#) arranged for PCB layout compatibility with legacy parallel flash footprints.

Pin/Terminal	Circuit Role	Design Meaning
A0–A20	Address inputs	21-bit address bus supporting full 128 MB linear addressing; A0 selects byte/word mode when x16 configured.
DQ0–DQ15	Data I/O	16-bit bidirectional bus; operates in ×8 or ×16 mode per configuration; supports 1.65–3.6 V versatile I/O voltage range.
CE#	Chip enable	Active-low chip select; tCE = 100 ns max - defines minimum cycle time between successive read accesses.
OE#	Output enable	Active-low output control; tOE = 25 ns - determines data valid window timing relative to clockless read strobes.
WE#	Write enable	Active-low write strobe; initiates program/erase commands and data latching during buffer programming.
RY/BY#	Ready/Busy indicator	Open-drain output; low during embedded operations - enables hardware polling without CPU intervention.
RESET#	Hardware reset	Active-low asynchronous reset; restores device to read mode and clears status register after power-up or fault recovery.

Key Features

Feature	Design Value
45-nm MIRRORBIT™ process	Enables 1 Gb density in compact TSOP package while maintaining 100 ns access time and <100 μA standby current.
512-byte write buffer	Reduces average programming time to ≤450 μs per 512-byte block - essential for deterministic OTA update latency.
Uniform 128-KB sectors	Supports atomic sector-level firmware updates and rollback without partial-sector corruption risk.
Separate 2048-byte OTP array	Provides tamper-resistant storage for cryptographic keys and calibration data, with SSR3 password protection.
Common Flash Interface (CFI)	Enables automatic driver detection and configuration in Linux MTD and U-Boot environments without hard-coded parameters.

Applications

Automotive Instrument Cluster

Industrial PLC Firmware Storage

Use Scenario: Storing boot loader, OS kernel, and GUI assets for digital dashboards operating across –40°C to +85°C.

IC Role / Device Role / Timing Role: Primary non-volatile code storage with XIP capability and AEC-Q100 Grade 3 qualification.

Use Value: 100 ns random access enables real-time rendering of vehicle metrics without DRAM buffering.

Use Scenario: Holding firmware and configuration data for programmable logic controllers deployed in factory automation cabinets.

IC Role / Device Role / Timing Role: Reliable firmware repository supporting remote updates and fail-safe recovery via sector erase isolation.

Use Value: Uniform 128-KB sectors allow safe over-the-air patching without interrupting control loop execution.

Medical Imaging Boot ROM

Avionics Display System

Use Scenario: Secure boot image storage for MRI/CT scanner control units requiring 20-year data retention and ECC integrity.

IC Role / Device Role / Timing Role: Safety-certified boot ROM with hardware ECC and OTP-protected calibration constants.

Use Value: Internal single-bit ECC eliminates external error-checking logic, reducing BOM count and certification effort.

Use Scenario: Code storage for flight deck display processors where radiation-induced bit flips must be corrected autonomously.

IC Role / Device Role / Timing Role: Radiation-tolerant firmware memory with automatic ECC correction and sector-level write protection.

Use Value: Hardware ECC corrects soft errors in real time, meeting DO-254 DAL-B reliability requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL01GP11FAIV10	Same density and pinout, but uses older 65-nm process; 110 ns tACC, no OTP array.	Lacks SSR-based key storage; not qualified for AEC-Q100 Grade 3.	Select only for cost-sensitive industrial designs without security or automotive qualification needs.
MX29GL128FPTI-90G	128 MB, 90 ns tACC, 3.3 V only, no versatile I/O or OTP; requires external ECC.	No hardware ECC or password-protected OTP; limited to non-safety-critical applications.	Choose when board-level voltage is fixed at 3.3 V and firmware integrity is managed in software.

Compared with S29GL01GP11FAIV10 and MX29GL128FPTI-90G, the S29GL01GT11FAIV10 uniquely combines AEC-Q100 Grade 3 qualification, integrated ECC, and OTP-based secure storage - making it the only option for automotive boot ROMs requiring ASIL-B compliance and cryptographic key isolation.

Availability

S29GL01GT11FAIV10 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLCs, medical imaging systems, and avionics displays requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for S29GL01GT11FAIV10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions for industrial and transportation markets.

The GL-T family targets embedded systems needing fast XIP-capable flash with automotive-grade reliability, combining high-density storage, hardware ECC, and secure OTP features for safety-critical boot and firmware applications.

FAQ

What is the maximum operating frequency supported by S29GL01GT11FAIV10?

This device uses an asynchronous parallel interface with no clock input, so it does not operate at a defined frequency. Instead, timing is governed by access times: 100 ns random access and 15 ns page access at –40°C to +85°C. System timing must comply with tCE (100 ns), tOE (25 ns), and tACC specifications in the datasheet's AC characteristics table.

Does S29GL01GT11FAIV10 support both ×8 and ×16 data bus configurations?

Yes, it supports configurable ×8 or ×16 operation via A0 pin state and internal configuration bits. In ×16 mode, DQ0–DQ15 transfer 16-bit words; in ×8 mode, DQ0–DQ7 transfer bytes with A0 selecting even/odd addresses. The versatile I/O feature allows VIO from 1.65 V to VCC, enabling direct interfacing with 1.8 V or 3.3 V controllers.

How is the OTP array protected and accessed?

The 2048-byte OTP array is divided into four lockable sectors (SSR0–SSR3). SSR0 is factory-locked and permanently read-only. SSR3 supports password-based read protection using a user-defined 16-byte password stored in the Status Register. Access requires issuing the Unlock Bypass command followed by the correct password sequence - preventing unauthorized extraction of calibration or security keys.

Can S29GL01GT11FAIV10 be used in systems requiring ISO 26262 compliance?

While the device itself is not ISO 26262-certified, its AEC-Q100 Grade 3 qualification, 100,000-cycle endurance, 20-year retention, and hardware ECC make it suitable for ASIL-B system elements. Designers must integrate it into a broader safety architecture - e.g., using ECC status flags in diagnostic routines and validating OTP usage per ISO 26262 Part 6 Annex D guidelines for memory safety mechanisms.

S29GL01GT11FAIV10 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-T

Package/Case:: 64-LBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 1Gbit

Memory Organization:: 128M x 8

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 110 ns

Voltage - Supply:: 1.65V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (13x11)

S29GL01GT11FAIV10 FAQ

1.How can I place an order for S29GL01GT11FAIV10 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL01GT11FAIV10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL01GT11FAIV10 reliable?

The price and inventory of S29GL01GT11FAIV10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GT11FAIV10 is usually 5 days.

3.What payment methods are accepted for S29GL01GT11FAIV10?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GT11FAIV10 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL01GT11FAIV10?

S29GL01GT11FAIV10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL01GT11FAIV10 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL01GT11FAIV10?

For technical support, including S29GL01GT11FAIV10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GT11FAIV10 requirements.

6.How does Aetrix verify that S29GL01GT11FAIV10 is sourced from the original manufacturer or authorized distributors?

All S29GL01GT11FAIV10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GT11FAIV10 meets industry standards.

7.What is the process for return or replacement of S29GL01GT11FAIV10?

All S29GL01GT11FAIV10 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GT11FAIV10, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL01GT11FAIV10 part is unused and in its original packaging.

Return procedure for S29GL01GT11FAIV10:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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