Infineon Technologies S29GL01GT11FAIV13
- Part No.:
- S29GL01GT11FAIV13
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL01GT11FAIV13.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 64FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,268
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S29GL01GT11FAIV13 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It integrates hardware ECC for single-bit error correction, supports 512-byte buffer programming, and features uniform 128-KB sector erase - deployed in industrial-grade embedded boot code storage for microcontroller-based systems.
For engineers reviewing the S29GL01GT11FAIV13 datasheet, S29GL01GT11FAIV13 pinout, S29GL01GT11FAIV13 application, or S29GL01GT11FAIV13 equivalent, key selection criteria include verified 128-KB uniform sector architecture, OTP array with four lockable SSR regions, and support for Versatile I/O (1.65 V to VCC) in TSOP and fortified BGA packages.
Technical Context
This device implements an asynchronous parallel interface with ×8/×16 data bus configuration and byte/word boundary addressing. Its embedded algorithm controller (EAC) manages program, erase, suspend/resume, and automatic ECC operations without host intervention.
The status register, data polling, and RY/BY# pin provide three independent methods to monitor operation completion. Sector protection includes volatile (lock bits) and non-volatile (ASP) modes, plus a dedicated 2048-byte OTP array with factory-locked SSR0 and password-protected SSR3.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 1 Gb (128 MB) - sufficient for full firmware image + parameter storage in industrial controllers |
| Access time (tACC) | 100 ns at –40°C to +85°C - enables direct XIP execution from flash without external cache |
| Page access time (tPACC) | 15 ns - accelerates sequential instruction fetch during boot or interrupt handling |
| Programming buffer | 512 bytes - reduces average programming time by >3× vs. single-word writes |
| ECC capability | Single-bit correction via on-die hardware - eliminates need for external ECC logic in safety-critical designs |
| Endurance | 100,000 program/erase cycles - supports field firmware updates over 10+ years of operation |
| Data retention | 20 years at +85°C - ensures long-term reliability in unattended embedded deployments |
Pinout & Package
Package: 56-pin TSOP (Type I, standard thickness), RoHS-compliant, industrial temperature grade (–40°C to +85°C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 | Address inputs | 24-bit address bus supporting full 128 MB linear space; A0 selects byte/word mode when configured |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional bus; operates in ×8 or ×16 mode per configuration; supports Versatile I/O voltage (1.65 V to VCC) |
| CE# | Chip enable | Active-low chip select; tCE = 100 ns max - defines minimum cycle time in multi-device bus systems |
| OE# | Output enable | Active-low read strobe; tOE = 25 ns max - controls data valid window timing relative to address setup |
| WE# | Write enable | Active-low write strobe; initiates command latching or data loading into internal buffers |
| RY/BY# | Ready/Busy output | Open-drain status indicator; low during embedded operations - enables polling-free interrupt-driven firmware flow |
| RESET# | Hardware reset | Active-low asynchronous reset; forces device into reading state and clears internal state machines |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O voltage range | 1.65 V to VCC - allows direct interfacing with mixed-voltage SoCs (e.g., 1.8 V I/O, 3.3 V core) without level shifters |
| Uniform 128-KB sectors | 1024 sectors total - simplifies firmware partitioning (bootloader, app, config, OTA) with deterministic erase boundaries |
| OTP array with SSR locking | 2048-byte one-time programmable region with four independently lockable sub-regions - secures cryptographic keys and calibration data |
| CFI parameter table | Standardized JEDEC CFI v1.4 compliance - enables auto-detection and driver initialization in Linux U-Boot and RTOS BSPs |
| Suspend/Resume capability | Interruptible program/erase - allows high-priority read access during background writes, critical for real-time HMI response |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot loader, real-time OS kernel, and motion control firmware in programmable logic controllers with no external RAM caching. IC Role / Device Role / Timing Role: Primary non-volatile XIP-capable code storage; provides deterministic 100 ns instruction fetch latency to meet <100 μs task jitter requirements. Use Value: Eliminates need for SRAM shadow copy and reduces BOM cost while maintaining hard real-time determinism via fast random access. | Use Scenario: Holding boot code and sensor fusion algorithms for radar/Ethernet ECUs requiring AEC-Q100 Grade 2 qualification (–40°C to +105°C). IC Role / Device Role / Timing Role: Certified automotive-grade parallel NOR flash; delivers guaranteed 110 ns access at +105°C for cold-start boot within 500 ms. Use Value: Meets ASIL-B functional safety prerequisites through on-die ECC and 100K-cycle endurance under thermal cycling stress. |
| Medical Imaging System Configuration | Energy Meter Secure Parameter Storage |
Use Scenario: Retaining calibration tables, DICOM metadata templates, and regulatory audit logs across power cycles in portable ultrasound devices. IC Role / Device Role / Timing Role: Non-volatile parameter archive with OTP-secured calibration constants; accessed asynchronously during system initialization. Use Value: Ensures FDA 21 CFR Part 11 compliance via tamper-evident SSR locking and 20-year data retention at +40°C ambient. | Use Scenario: Storing tariff schedules, metering keys, and firmware signature certificates in ANSI C12.22-compliant smart electricity meters. IC Role / Device Role / Timing Role: Secure storage element with password-protected SSR3 region; used during secure boot and OTA update verification. Use Value: Prevents unauthorized firmware modification via hardware-enforced OTP lockdown, satisfying IEC 62056-21 security requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GP11FAIV13 | Same density and package, but lacks Versatile I/O (VIO fixed to VCC); no 1.65 V–VCC flexibility | Requires matched I/O voltage domain; unsuitable for mixed-voltage SoC interfaces | Select only when system uses single 3.3 V rail and does not require low-voltage I/O compatibility |
| MX29GL128FPTI-90G | 128 MB density, 90 ns tACC, no on-die ECC; requires external error management | Lacks hardware ECC and OTP array - increases firmware complexity for safety-critical use | Consider only for cost-sensitive, non-safety applications where ECC is handled in software or omitted |
Compared with S29GL01GP11FAIV13 and MX29GL128FPTI-90G, the S29GL01GT11FAIV13 uniquely combines Versatile I/O, on-die ECC, and OTP-based security in a single industrial-grade parallel NOR device - reducing system-level validation effort and enabling certified functional safety architectures.
Availability
S29GL01GT11FAIV13 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system configuration requiring stable component supply across extended lifecycle programs.
Supply support for S29GL01GT11FAIV13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and non-volatile memory solutions for industrial and automotive markets.
The GL-T family targets high-reliability embedded systems needing XIP-capable flash with robust data integrity - designed specifically for boot code storage, firmware updates, and secure parameter retention in harsh environments.
FAQ
What is the maximum operating temperature range certified for S29GL01GT11FAIV13?
This part is specified for the industrial temperature range of –40°C to +85°C, with full performance compliance including 100 ns random access time and 100,000 program/erase cycles. It does not carry AEC-Q100 automotive qualification; for +105°C operation, the S29GL01GT11FHIV13 variant must be selected.
Does S29GL01GT11FAIV13 support both ×8 and ×16 data bus configurations?
Yes, it supports configurable ×8 (byte) or ×16 (word) operation via A0 pin state at power-up. In ×16 mode, DQ15–DQ0 transfer 16-bit words; in ×8 mode, DQ7–DQ0 transfer bytes with DQ15–DQ8 unused. Address lines remain identical in both modes.
How is the OTP array protected against accidental overwrite?
The 2048-byte OTP array is divided into four lockable SSR regions (SSR0–SSR3). SSR0 is factory-locked and permanently read-only. SSR3 supports password-based read protection. Locking is irreversible and performed via dedicated CFI commands - no hardware fuse blowing required.
Can S29GL01GT11FAIV13 be used in systems with 1.8 V I/O voltage?
Yes, its Versatile I/O feature supports VIO from 1.65 V to VCC (max 3.6 V). When VCC = 3.3 V, the device accepts 1.8 V input levels on DQ, CE#, OE#, WE#, and RY/BY# pins and drives compatible 1.8 V logic levels - eliminating external level shifters in mixed-voltage designs.
S29GL01GT11FAIV13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL01GT11FAIV13 FAQ
1.How can I place an order for S29GL01GT11FAIV13 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GT11FAIV13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GT11FAIV13 reliable?
The price and inventory of S29GL01GT11FAIV13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GT11FAIV13 is usually 5 days.
3.What payment methods are accepted for S29GL01GT11FAIV13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GT11FAIV13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GT11FAIV13?
S29GL01GT11FAIV13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GT11FAIV13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GT11FAIV13?
For technical support, including S29GL01GT11FAIV13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GT11FAIV13 requirements.
6.How does Aetrix verify that S29GL01GT11FAIV13 is sourced from the original manufacturer or authorized distributors?
All S29GL01GT11FAIV13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GT11FAIV13 meets industry standards.
7.What is the process for return or replacement of S29GL01GT11FAIV13?
All S29GL01GT11FAIV13 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GT11FAIV13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GT11FAIV13 part is unused and in its original packaging.
Return procedure for S29GL01GT11FAIV13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL01GT11FAIV13 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…
Electronic devices and circuits guide covering passive components, semiconductors, analog and digital circuits, circuit theory, practical calculations, troubleshooting, datasheet selection, and learnin…

