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Infineon Technologies S29GL01GT11FHB023
- Part No.:
- S29GL01GT11FHB023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL01GT11FHB023.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,273
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Product details
Overview
S29GL01GT11FHB023 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, internal hardware ECC for single-bit correction, and uniform 128-KB sector erase - deployed in industrial-grade embedded boot code storage for microcontroller-based systems requiring XIP capability and long-term data retention.
For engineers reviewing the S29GL01GT11FHB023 datasheet, S29GL01GT11FHB023 pinout, S29GL01GT11FHB023 application, or S29GL01GT11FHB023 equivalent, key selection criteria include verified 100,000 program/erase cycles, –40°C to +85°C industrial temperature grade, TSOP-56 or FBGA packaging options, and CFI-compliant software interface compatibility with legacy boot loaders.
Technical Context
This device implements an asynchronous parallel interface with ×8/×16 data bus support and byte/word boundary addressing. Its embedded algorithm controller (EAC) manages autonomous program and sector erase operations, while status monitoring uses Data Polling, Ready/Busy# pin, and Status Register reads.
The versatile I/O feature enables independent VIO supply (1.65 V to VCC), decoupling I/O voltage from core logic. Internal hardware ECC operates transparently during read cycles, correcting single-bit errors without software intervention and reporting uncorrectable multi-bit errors via status flags.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 1 Gb (128 MB) - supports full firmware image storage for mid-range MCUs with XIP execution |
| Access time (tACC) | 100 ns at –40°C to +85°C - enables direct CPU read without wait states in 20–25 MHz bus systems |
| Page access time (tPACC) | 15 ns - accelerates sequential instruction fetch in page-mode read operations |
| Write buffer size | 512 bytes - reduces effective programming time by batching up to 256 words per command |
| ECC capability | Single-bit error correction with detection of multi-bit errors - ensures boot code integrity without external error-handling logic |
| Endurance & retention | 100,000 program/erase cycles / 20-year data retention - meets industrial lifecycle requirements for field-deployed equipment |
| Operating voltage | VCC = 2.7 V to 3.6 V, VIO = 1.65 V to VCC - supports mixed-voltage system integration with 1.8 V or 3.3 V I/O domains |
Pinout & Package
Package: 56-pin TSOP (Type I, standard thickness), compliant with JEDEC MO-142AB. Pinout validated per Infineon datasheet Rev. *M, Section 12.1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address inputs | 22-bit address bus supporting full 128 MB linear space; A0 selects byte/word mode when x16 configured |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; operates in ×8 or ×16 mode per configuration pins (BYTE#) |
| CE# | Chip enable | Active-low chip select; controls device power state and enables read/write access timing windows |
| OE# | Output enable | Active-low control for data bus output drivers; used to gate read data onto shared system data bus |
| WE# | Write enable | Active-low signal initiating internal program/erase commands or data latching during write cycles |
| RY/BY# | Ready/Busy indicator | Open-drain output signaling active embedded operation (low) or completion (high) |
| RESET# | Hardware reset | Active-low input forcing device into reset state, clearing status registers and aborting ongoing operations |
| BYTE# | Bus width select | Configures ×8 (high) or ×16 (low) data bus operation; determines DQ0–DQ7 vs. DQ0–DQ15 usage |
Key Features
| Feature | Design Value |
|---|---|
| Asynchronous page read | 32-byte page mode with 15 ns access - improves instruction throughput over standard random reads |
| Suspend/Resume | Interrupts active program or erase to service high-priority read requests - essential for real-time OS environments |
| Advanced sector protection (ASP) | Volatile and non-volatile lock bits per 128-KB sector - prevents accidental firmware overwrite during field updates |
| One-time programmable (OTP) array | 2048-byte region with four lockable SSRs (SSR0 factory-locked, SSR3 password-protected) - stores secure keys or calibration data |
| Common Flash Interface (CFI) | Standardized parameter table accessible via address/command sequence - enables generic flash driver reuse across platforms |
Applications
| Industrial Control PLC Firmware Storage | Automotive Instrument Cluster Boot Memory |
|---|---|
Use Scenario: Storing boot firmware and runtime configuration for programmable logic controllers in factory automation cabinets. IC Role / Device Role / Timing Role: Non-volatile boot code storage with XIP capability, accessed directly by ARM Cortex-M7 MCU at power-on. Use Value: 100 ns random access eliminates wait states; 100,000-cycle endurance supports decades of field firmware updates. | Use Scenario: Holding calibrated display graphics and safety-critical boot loader in automotive digital instrument clusters. IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 (–40°C to +105°C) parallel NOR flash providing deterministic boot timing under thermal stress. Use Value: Internal ECC ensures pixel map integrity; sector protection prevents corruption during OTA update interruptions. |
| Medical Imaging System Configuration | Networking Equipment Boot ROM |
Use Scenario: Retaining calibration tables, sensor profiles, and regulatory compliance settings in portable ultrasound devices. IC Role / Device Role / Timing Role: Secure, long-retention storage for critical configuration data accessed during cold start and diagnostics. Use Value: OTP array (SSR3 password-protected) stores HIPAA-compliant calibration keys; 20-year retention meets FDA design life requirements. | Use Scenario: Hosting U-Boot SPL and primary bootloader in enterprise switches and routers with dual-image failover. IC Role / Device Role / Timing Role: Primary boot ROM mapped to CPU's reset vector address space, enabling fast, deterministic initialization. Use Value: CFI interface allows identical driver stack across multiple flash vendors; suspend/resume enables concurrent diagnostics during boot. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GP11FHJ023 | Same 1 Gb density and 45-nm process, but with 105°C industrial plus grade and LAE BGA (9 mm × 9 mm) package | Requires PCB redesign for BGA layout; higher thermal rating suits enclosed fanless networking gear | Select when extended temperature operation and space-constrained layout outweigh TSOP rework cost |
| MX29GL128FPTI-90G | 128 MB density, 90 ns max tACC, no internal ECC, supports only ×16 bus, no OTP array | Lacks hardware ECC and secure OTP - requires external error handling and key management | Choose for cost-sensitive designs where firmware integrity is managed in software and board space permits larger TSOP footprint |
Compared with S29GL01GT11FHB023, the Infineon GP variant offers higher thermal margin in compact BGA, while Macronix MX29GL128F lacks ECC and OTP - making the original optimal for safety-critical, long-lifecycle industrial boot storage.
Availability
S29GL01GT11FHB023 is available at Aetrix Electronics and suitable for industrial control PLC firmware storage, automotive instrument cluster boot memory, and medical imaging system configuration requiring stable component supply across multi-year production programs.
Supply support for S29GL01GT11FHB023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensing, connectivity, and memory solutions for industrial, automotive, and IoT applications.
The GL-T family targets high-reliability embedded systems needing deterministic boot performance, long data retention, and robust firmware protection - bridging XIP speed and data storage density in a single parallel flash architecture.
FAQ
Does S29GL01GT11FHB023 support both ×8 and ×16 data bus configurations?
Yes. The BYTE# pin configures bus width: high for ×8 (DQ0–DQ7 active), low for ×16 (DQ0–DQ15 active). Address lines A0–A21 remain fully decoded in both modes, with A0 determining byte alignment in ×16 mode. This dual-mode flexibility simplifies migration between 8-bit and 16-bit host interfaces without changing firmware address mapping logic.
What is the function of the SSR OTP array and how is it secured?
The 2048-byte SSR (Secure Sector Register) array contains four lockable regions (SSR0–SSR3). SSR0 is factory-locked and immutable; SSR3 supports password-based read protection enforced by on-chip logic. Writes to SSR regions require specific unlock sequences and are irreversible once locked - enabling secure storage of cryptographic keys or calibration constants without external security ICs.
How does automatic ECC operate during read cycles?
Internal hardware ECC runs transparently on every read: single-bit errors are corrected in real time and data delivered error-free; multi-bit errors trigger the ECC Error bit in the Status Register and hold RY/BY# low until cleared. No software overhead or interrupt latency is introduced - correction occurs within the standard read access timing window (tACC).
Can S29GL01GT11FHB023 be used in automotive applications?
Yes - this specific part number is qualified to AEC-Q100 Grade 2 (–40°C to +105°C) and supports automotive instrument clusters and body control modules. It includes enhanced ESD tolerance, extended temperature validation, and lot-level traceability. However, automotive use requires adherence to Infineon's automotive qualification documentation and change notification protocols for production release.
S29GL01GT11FHB023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL01GT11FHB023 FAQ
1.How can I place an order for S29GL01GT11FHB023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GT11FHB023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GT11FHB023 reliable?
The price and inventory of S29GL01GT11FHB023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GT11FHB023 is usually 5 days.
3.What payment methods are accepted for S29GL01GT11FHB023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GT11FHB023 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GT11FHB023?
S29GL01GT11FHB023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GT11FHB023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GT11FHB023?
For technical support, including S29GL01GT11FHB023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GT11FHB023 requirements.
6.How does Aetrix verify that S29GL01GT11FHB023 is sourced from the original manufacturer or authorized distributors?
All S29GL01GT11FHB023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GT11FHB023 meets industry standards.
7.What is the process for return or replacement of S29GL01GT11FHB023?
All S29GL01GT11FHB023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GT11FHB023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GT11FHB023 part is unused and in its original packaging.
Return procedure for S29GL01GT11FHB023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL01GT11FHB023 Tags
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