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Infineon Technologies S29GL01GT11FHIV10
- Part No.:
- S29GL01GT11FHIV10
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL01GT11FHIV10.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:326
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Product details
Overview
S29GL01GT11FHIV10 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory with MIRRORBIT™ technology, designed for embedded code storage and XIP execution in industrial and automotive systems. It operates from 2.7 V to 3.6 V, delivers 100 ns random access time (–40°C to +85°C), supports ×8/×16 data bus, and integrates hardware ECC for single-bit error correction.
For engineers reviewing the S29GL01GT11FHIV10 datasheet, S29GL01GT11FHIV10 pinout, S29GL01GT11FHIV10 application, or S29GL01GT11FHIV10 equivalent, key selection criteria include sector erase granularity (128 KB), OTP array configuration (2048-byte, four lockable regions), temperature grade (Industrial Plus, –40°C to +105°C), and 100,000 program/erase cycles.
Technical Context
This device implements an asynchronous parallel interface with byte/word boundary addressing and supports both standard and page-mode reads. Its embedded algorithm controller (EAC) manages program, erase, suspend/resume, and status reporting via Status Register, Data Polling, or RY/BY# pin.
The integrated hardware ECC performs real-time single-bit correction during read operations without software intervention, while the versatile I/O feature enables VIO operation from 1.65 V to VCC-critical for mixed-voltage SoC interfacing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 1 Gb (128 MB) - sufficient for full firmware images and boot code in resource-constrained embedded controllers |
| Random access time | 100 ns at –40°C to +85°C - enables deterministic XIP execution latency in real-time applications |
| Page access time | 15 ns - accelerates sequential instruction fetch within cache line boundaries |
| Programming buffer | 512 bytes - reduces effective programming time by batching writes without host-side buffering overhead |
| ECC capability | Single-bit error correction - ensures data integrity during long-term storage without external error-handling logic |
| Sector size | 128 KB uniform sectors - simplifies firmware update partitioning and wear-leveling implementation |
| Operating temperature | –40°C to +105°C (Industrial Plus) - qualified for under-hood automotive ECUs and industrial HMIs |
| Data retention | 20 years - meets long-lifecycle requirements for infrastructure and medical devices |
Pinout & Package
Package: 64-ball LAE fortified BGA (9 mm × 9 mm), RoHS-compliant, lead-free, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 | Address inputs | 24-bit address bus supporting full 128 MB linear addressing with byte/word alignment |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; configurable as ×8 or ×16 via BYTE# pin |
| CE# | Chip enable | Active-low chip select enabling device participation in bus transactions |
| OE# | Output enable | Controls output drivers during read cycles; decouples read timing from CE# assertion |
| WE# | Write enable | Initiates write/program/erase commands when asserted with valid address/data |
| RY/BY# | Ready/Busy indicator | Open-drain status pin signaling active embedded operations (program/erase) |
| VCC | Core supply | 2.7–3.6 V single supply powering core logic, memory array, and EAC |
| VIO | I/O supply | 1.65–VCC versatile I/O voltage - allows direct interfacing with 1.8 V, 2.5 V, or 3.3 V controllers |
| RESET# | Hardware reset | Asynchronous reset clearing internal state and aborting ongoing operations |
Key Features
| Feature | Design Value |
|---|---|
| Hardware ECC | On-the-fly single-bit error correction during read - eliminates need for external ECC logic or software overhead |
| 512-byte programming buffer | Enables burst programming of up to 512 bytes per command - cuts typical firmware update time by >4× vs. single-word writes |
| Uniform 128-KB sectors | Consistent sector sizing simplifies bootloader design and OTA update partitioning across memory map |
| OTP array (2048 B) | Four lockable SSR regions (SSR0 factory-locked, SSR3 password-protected) - secures calibration data, keys, and device identity |
| Suspend/Resume | Pauses active program/erase to service high-priority reads - essential for real-time interrupt response in XIP mode |
Applications
| Automotive Engine Control Unit (ECU) | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing calibrated engine maps, diagnostic routines, and boot firmware in AEC-Q100 Grade 2 (–40°C to +105°C) environment. IC Role / Device Role / Timing Role: Non-volatile code storage with XIP capability and hardware ECC ensuring reliable boot under thermal stress. Use Value: Eliminates external error-correction circuitry and supports field firmware updates via 128 KB sector erase without disrupting runtime execution. | Use Scenario: Holding ladder logic programs, I/O configuration tables, and safety-critical firmware in industrial automation controllers. IC Role / Device Role / Timing Role: High-reliability parallel flash providing deterministic read latency (<100 ns) for real-time control loop execution. Use Value: 20-year data retention and 100,000 erase cycles ensure multi-decade deployment without memory degradation concerns. |
| Medical Imaging System Boot Memory | Avionics Display Processor Code Storage |
Use Scenario: Hosting boot ROM and FPGA configuration bitstreams in Class II medical devices requiring long-term data integrity. IC Role / Device Role / Timing Role: Secure, radiation-tolerant (tested per JEDEC JESD22-A117) non-volatile memory with OTP-protected calibration constants. Use Value: Factory-locked SSR0 and password-protected SSR3 prevent unauthorized modification of critical imaging parameters. | Use Scenario: Storing display firmware and graphics assets in DO-254-compliant avionics displays operating at extended temperature range. IC Role / Device Role / Timing Role: Parallel NOR flash delivering guaranteed 110 ns random access at –40°C to +105°C for deterministic GUI rendering startup. Use Value: Versatile I/O (1.65–3.6 V) enables direct connection to 2.5 V display processor buses without level-shifting components. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GT11TFIV10 | Same die, TSOP-56 package (vs. LAE BGA); no VIO flexibility - fixed 3.3 V I/O | Limited to PCBs with legacy TSOP footprints; unsuitable for space-constrained or mixed-voltage designs | Select only when board layout prohibits BGA or requires through-hole compatibility |
| MX29GL128FPTI-90G | 128 MB (1 Gb), 90 ns max tACC, no hardware ECC, 1.8 V core (dual VCC/VIO) | Lacks on-die ECC and OTP security features; requires external error handling and key management | Choose for cost-sensitive, non-safety-critical applications where ECC and secure storage are not required |
Compared with S29GL01GT11TFIV10 and MX29GL128FPTI-90G, the S29GL01GT11FHIV10 uniquely combines BGA miniaturization, versatile I/O voltage support, hardware ECC, and factory-secured OTP - making it optimal for next-generation automotive and industrial controllers demanding reliability, security, and footprint efficiency.
Availability
S29GL01GT11FHIV10 is available at Aetrix Electronics and suitable for automotive ECU development, industrial PLC firmware updates, and medical imaging system boot memory requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for S29GL01GT11FHIV10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global manufacturing and quality certification to ISO/TS 16949 and AEC-Q100.
The GL-T family targets high-reliability embedded systems needing fast XIP-capable flash with robust data integrity - specifically engineered for automotive, industrial, and medical applications demanding extended temperature operation and long-term firmware stability.
FAQ
What is the maximum operating frequency supported by S29GL01GT11FHIV10?
This device uses an asynchronous parallel interface with no clock input; timing is governed by access time specifications rather than frequency. Its 100 ns random access time (tACC) at –40°C to +85°C corresponds to a theoretical maximum sustained read rate of ~10 MHz, but actual throughput depends on bus protocol overhead and controller wait-state configuration.
Does S29GL01GT11FHIV10 support quad SPI or other serial interfaces?
No. S29GL01GT11FHIV10 is a parallel NOR flash with ×8/×16 data bus and dedicated control pins (CE#, OE#, WE#). It does not implement SPI, QSPI, or any serial interface protocol - it requires a parallel memory bus with address and control lines as defined in the Infineon datasheet section 8.
How is the OTP array protected against accidental overwrite?
The 2048-byte OTP array contains four lockable sectors (SSR0–SSR3). SSR0 is permanently locked at factory; SSR1–SSR3 can be individually locked via software command. SSR3 supports password-based read protection, requiring a 16-bit password match before data access - preventing unauthorized reading even after locking.
Can S29GL01GT11FHIV10 be used in place of older S29GLxxxT devices?
Yes, with verification of pin compatibility and timing margins. The S29GL01GT11FHIV10 shares the same command set and CFI structure as prior GL-T generation devices, but its LAE BGA package and enhanced ECC behavior require validation of PCB layout, signal integrity, and firmware driver initialization sequences per Infineon Application Note AN229427.
S29GL01GT11FHIV10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL01GT11FHIV10 FAQ
1.How can I place an order for S29GL01GT11FHIV10 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GT11FHIV10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GT11FHIV10 reliable?
The price and inventory of S29GL01GT11FHIV10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GT11FHIV10 is usually 5 days.
3.What payment methods are accepted for S29GL01GT11FHIV10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GT11FHIV10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GT11FHIV10?
S29GL01GT11FHIV10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GT11FHIV10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GT11FHIV10?
For technical support, including S29GL01GT11FHIV10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GT11FHIV10 requirements.
6.How does Aetrix verify that S29GL01GT11FHIV10 is sourced from the original manufacturer or authorized distributors?
All S29GL01GT11FHIV10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GT11FHIV10 meets industry standards.
7.What is the process for return or replacement of S29GL01GT11FHIV10?
All S29GL01GT11FHIV10 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GT11FHIV10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GT11FHIV10 part is unused and in its original packaging.
Return procedure for S29GL01GT11FHIV10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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