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Infineon Technologies S29GL01GT11FHIV23
- Part No.:
- S29GL01GT11FHIV23
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL01GT11FHIV23.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,754
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Product details
Overview
S29GL01GT11FHIV23 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, hardware ECC for single-bit correction, uniform 128-KB sectors, and supports industrial temperature range (–40°C to +85°C). It serves as non-volatile code storage in boot ROM and firmware update modules of embedded controllers.
For engineers reviewing the S29GL01GT11FHIV23 datasheet, S29GL01GT11FHIV23 pinout, S29GL01GT11FHIV23 application, or S29GL01GT11FHIV23 equivalent, key selection criteria include parallel ×16 bus interface timing, sector erase endurance (100,000 cycles), OTP array configuration (SSR0–SSR3), CFI compliance, and industrial-grade thermal performance.
Technical Context
This device implements an asynchronous parallel interface with byte/word boundary addressing and supports both ×8 and ×16 data bus widths. Its embedded algorithm controller (EAC) manages program, erase, and suspend/resume operations without host CPU intervention.
The internal hardware ECC operates transparently during read cycles, correcting single-bit errors and flagging uncorrectable multi-bit errors via status register bits. Sector protection uses volatile (lock bits) and non-volatile (ASP) methods, with four lockable 2048-byte OTP regions - SSR0 factory-locked, SSR3 password-protected.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 1 Gb (128 MB) - supports full firmware images for mid-tier microcontrollers and boot loaders. |
| Interface type | Asynchronous parallel ×16 - enables direct XIP execution without external SRAM buffering. |
| Random access time | 100 ns at –40°C to +85°C - meets real-time boot latency requirements in industrial PLCs. |
| Write buffer size | 512 bytes - reduces effective programming time by batching up to 256 words per command. |
| ECC capability | Single-bit error correction with detection of multi-bit errors - ensures data integrity in long-term storage applications. |
| Endurance | 100,000 program/erase cycles per sector - suitable for field-updatable firmware with infrequent rewrites. |
| Data retention | 20 years at +85°C - guarantees firmware persistence over product lifecycle in harsh environments. |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-141AC footprint. Pin-compatible with legacy S29GL series for drop-in replacement in existing PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address inputs | 22-bit address bus supporting full 128 MB linear addressing (byte mode) or 64 MB word mode. |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports ×16 operation with automatic byte/word alignment. |
| CE# | Chip enable | Active-low chip select; controls device power state and enables read/write access timing windows. |
| OE# | Output enable | Active-low control for data bus output drivers; used to gate read data onto shared system bus. |
| WE# | Write enable | Active-low signal initiating internal program/erase algorithms when combined with valid address/data. |
| RY/BY# | Ready/Busy indicator | Open-drain output signaling active internal operation; allows host to poll without interrupt overhead. |
| VCC | Core supply | 2.7–3.6 V main power; powers logic, memory array, and ECC engine simultaneously. |
| VIO | I/O supply | 1.65–VCC versatile I/O voltage - permits interfacing with 1.8 V, 2.5 V, or 3.3 V host buses. |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O (VIO) | Independent 1.65 V–VCC I/O supply enables mixed-voltage system integration without level shifters. |
| 512-byte write buffer | Reduces average programming time by >60% vs. single-word writes, critical for OTA firmware updates. |
| Hardware ECC | On-the-fly single-bit correction eliminates need for software-based error handling in boot ROM paths. |
| Uniform 128-KB sectors | Simplifies firmware partitioning and wear leveling across 1024 independent erasable blocks. |
| OTP array with SSR locking | Four 2048-byte one-time-programmable regions allow secure storage of keys, calibration data, or serial numbers. |
Applications
| Industrial PLC Firmware Storage | Automotive Instrument Cluster Boot ROM |
|---|---|
Use Scenario: Storing firmware and configuration data in programmable logic controllers deployed in factory automation systems. IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable code execution with deterministic 100 ns read latency. Use Value: Ensures reliable cold-start operation and field firmware updates without external ECC controllers or redundant storage. | Use Scenario: Hosting boot loader and safety-critical display firmware in automotive digital instrument clusters compliant with AEC-Q100 Grade 2. IC Role / Device Role / Timing Role: Primary flash memory with industrial-plus temperature rating (–40°C to +105°C) and hardware ECC for ASIL-B data integrity. Use Value: Meets automotive functional safety requirements while enabling fast boot times and secure firmware signing verification. |
| Medical Imaging System Configuration | Telecom Base Station Control Firmware |
Use Scenario: Retaining calibration parameters, sensor profiles, and regulatory-compliant boot images in portable ultrasound and MRI subsystems. IC Role / Device Role / Timing Role: Secure, long-retention storage for FDA-regulated firmware with OTP-protected calibration constants. Use Value: Supports 20-year data retention and tamper-resistant SSR3 password protection for audit-trail compliance. | Use Scenario: Storing FPGA configuration bitstreams and baseband processor firmware in outdoor 5G radio units exposed to wide thermal cycling. IC Role / Device Role / Timing Role: High-reliability parallel flash with extended temperature support (–40°C to +125°C option) and 100K-cycle endurance. Use Value: Enables remote firmware rollback and hot-swap updates without requiring system downtime or external backup memory. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GP11FHIV23 | Same density and package, but uses older 65-nm process; slower 110 ns random access time. | Lacks hardware ECC and OTP array; not suitable for safety-critical or secure boot use cases. | Select only if cost sensitivity outweighs ECC requirement and thermal margin is sufficient. |
| MX29GL128FHT2I-90G | 128 MB ×16, 90 ns access, no built-in ECC; requires external error management logic. | Supports same industrial temp range but lacks CFI compatibility and sector protection granularity. | Prefer where legacy board layout reuse is mandatory and ECC handled in software stack. |
Compared with S29GL01GP11FHIV23 and MX29GL128FHT2I-90G, the S29GL01GT11FHIV23 delivers superior reliability through on-die ECC, tighter timing, and secure OTP-making it optimal for new designs prioritizing functional safety and firmware integrity.
Availability
S29GL01GT11FHIV23 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive instrument cluster boot ROM, medical imaging system configuration, and telecom base station control firmware requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for S29GL01GT11FHIV23 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and high-reliability memory solutions, with global R&D and manufacturing infrastructure.
The GL-T family targets embedded systems needing robust, high-density parallel NOR flash with XIP capability, ECC, and extended temperature operation - designed specifically for industrial, automotive, and medical applications demanding long-term firmware integrity.
FAQ
What is the difference between S29GL01GT11FHIV23 and S29GL01GT11FHIV13?
The suffix 'V23' indicates a 56-pin TSOP package with industrial temperature grade (–40°C to +85°C), while 'V13' denotes the same package but with extended temperature range (–40°C to +125°C). Both share identical electrical specs and feature set except for thermal qualification and maximum standby current (215 μA vs. 100 μA).
Does S29GL01GT11FHIV23 support common flash interface (CFI)?
Yes, it fully complies with the Common Flash Interface specification, exposing a standardized parameter table at address 0x0055 for automatic detection and configuration by host bootloaders and flash programmers without hard-coded timing assumptions.
Can the OTP array be reprogrammed after initial write?
No - the 2048-byte OTP array is physically one-time programmable. Once written, individual bits cannot be reset or rewritten. SSR0 is permanently locked at factory; SSR3 supports password-protected read access but no reprogramming.
Is hardware reset required before issuing commands?
A hardware reset (RESET# pin assertion) is not mandatory before every command sequence, but is required after power-on or when exiting deep power-down mode to initialize internal state machines and clear pending status flags before executing program or erase operations.
S29GL01GT11FHIV23 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL01GT11FHIV23 FAQ
1.How can I place an order for S29GL01GT11FHIV23 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GT11FHIV23 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GT11FHIV23 reliable?
The price and inventory of S29GL01GT11FHIV23 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GT11FHIV23 is usually 5 days.
3.What payment methods are accepted for S29GL01GT11FHIV23?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GT11FHIV23 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GT11FHIV23?
S29GL01GT11FHIV23 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GT11FHIV23 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GT11FHIV23?
For technical support, including S29GL01GT11FHIV23 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GT11FHIV23 requirements.
6.How does Aetrix verify that S29GL01GT11FHIV23 is sourced from the original manufacturer or authorized distributors?
All S29GL01GT11FHIV23 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GT11FHIV23 meets industry standards.
7.What is the process for return or replacement of S29GL01GT11FHIV23?
All S29GL01GT11FHIV23 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GT11FHIV23, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GT11FHIV23 part is unused and in its original packaging.
Return procedure for S29GL01GT11FHIV23:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL01GT11FHIV23 Tags
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M24C02-WMN6TP
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AT24C02C-XHM-T
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AT21CS01-STUM10-T
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24LC01BT-I/OT
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M24C02-FMC6TG
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AT24CS02-SSHM-T
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93LC46BT-I/OT
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AT24C04C-SSHM-T
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AT24C08C-STUM-T
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