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Infineon Technologies S29GL01GT11FHV010
- Part No.:
- S29GL01GT11FHV010
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL01GT11FHV010.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:360
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Product details
Overview
S29GL01GT11FHV010 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It integrates hardware ECC for single-bit error correction, supports 128-KB uniform sector erase, and includes a 512-byte programming buffer for accelerated write throughput. It is deployed in automotive infotainment boot code storage where deterministic XIP execution, data integrity, and AEC-Q100 Grade 2 qualification (–40°C to +105°C) are required.
For engineers reviewing the S29GL01GT11FHV010 datasheet, S29GL01GT11FHV010 pinout, S29GL01GT11FHV010 application, or S29GL01GT11FHV010 equivalent, key selection criteria include verified 128-KB sector architecture, OTP array with SSR lockability, CFI-compliant interface, and industrial-plus temperature operation with hardware reset support.
Technical Context
This device implements an asynchronous parallel interface with ×8/×16 data bus configuration and byte/word boundary addressing. Its embedded algorithm controller (EAC) manages program, erase, suspend/resume, and status reporting via Status Register, Data Polling, and RY/BY# pin.
The flash array is organized into uniform 128-KB sectors, each independently erasable. The integrated ECC engine operates transparently during read cycles, correcting single-bit errors without software intervention and flagging uncorrectable multi-bit errors via the ECC status address space overlay (ASO).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 1 Gb (128 MB) - supports full firmware image storage for mid-tier automotive ECUs |
| Random access time (tACC) | 100 ns at –40°C to +85°C - enables sub-10 MHz XIP execution without wait states |
| Page access time (tPACC) | 15 ns - accelerates sequential instruction fetch in boot ROM mode |
| Programming buffer size | 512 bytes - reduces average programming time by batching up to 256 words per command |
| ECC capability | Single-bit correction, multi-bit detection - ensures data integrity over 20-year retention without external scrubbing |
| Endurance | 100,000 program/erase cycles - qualifies for frequent OTA update partitions in telematics modules |
| Operating temperature | –40°C to +105°C (AEC-Q100 Grade 2) - validated for under-hood ECU deployment |
Pinout & Package
Package: 64-ball LAE fortified BGA (9 mm × 9 mm), RoHS-compliant, lead-free, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 | Address inputs | 24-bit address bus supporting full 128-MB linear addressing with byte/word alignment |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional bus; configurable as ×8 or ×16 via BYTE# pin |
| CE#, OE#, WE# | Chip Enable, Output Enable, Write Enable | Asynchronous control signals enabling standard SRAM-like read/write timing |
| RY/BY# | Ready/Busy output | Open-drain status indicator for embedded program/erase completion monitoring |
| VCC, VIO | Core and I/O supplies | Separate 2.7–3.6 V VCC and 1.65–VCC VIO allow interfacing with 1.8 V or 3.3 V controllers |
| RESET# | Hardware reset input | Asynchronous active-low signal forcing device into reset state with power-on reset recovery |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O voltage range | VIO supports 1.65 V to VCC - eliminates level shifters when interfacing with mixed-voltage SoCs |
| OTP array with SSR locking | 2048-byte one-time-programmable region with four lockable sectors (SSR0–SSR3), including factory-locked SSR0 and password-protected SSR3 - secures bootloader keys and calibration data |
| Advanced sector protection (ASP) | Volatile and non-volatile lock bits per 128-KB sector - enables runtime firmware partitioning and field-update safety |
| CFI parameter table | Standardized JEDEC JESD68-compliant interface - enables automatic driver detection and configuration in U-Boot/Linux MTD stacks |
| Suspend/resume capability | Interrupts ongoing program or erase to service high-priority reads - maintains real-time responsiveness in multitasked ECU firmware |
Applications
| Automotive Instrument Cluster | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing calibrated gauge graphics, driver profile settings, and diagnostic logs in a CAN-connected digital cluster. IC Role / Device Role / Timing Role: Non-volatile boot and configuration memory with XIP-capable read performance and AEC-Q100 Grade 2 thermal compliance. Use Value: 100 ns random access enables direct CPU instruction fetch; 128-KB sector granularity allows safe over-the-air updates of UI assets without corrupting core firmware. | Use Scenario: Holding ladder logic firmware, I/O mapping tables, and firmware rollback images in modular automation controllers. IC Role / Device Role / Timing Role: High-reliability parallel flash for deterministic boot and field-upgradable application code. Use Value: Hardware ECC prevents silent corruption in long-life deployments; OTP SSR3 stores encrypted signature keys for secure firmware validation. |
| Telematics Control Unit (TCU) | Medical Imaging Boot Memory |
Use Scenario: Hosting LTE modem firmware, GNSS stack, and secure boot loader in vehicle-to-cloud communication modules. IC Role / Device Role / Timing Role: Dual-supply flash with independent VIO for interfacing to 1.8 V application processors and 3.3 V RF subsystems. Use Value: 512-byte buffer programming achieves 1.14 MBps write speed - cuts OTA firmware patch time by >40% vs. legacy 64-byte buffers. | Use Scenario: Storing certified boot firmware and DICOM protocol stack in FDA-cleared portable ultrasound devices. IC Role / Device Role / Timing Role: Radiation-tolerant, long-retention flash with 20-year data retention and AEC-Q100-equivalent reliability testing. Use Value: Sector erase isolation prevents accidental overwrite of regulatory-certified code partitions during service-mode updates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GT11FHVS010 | Same die, TSOP-56 package instead of LAE BGA; no VBU or LAA variants available | Limited board space flexibility; higher inductance on CE#/OE# lines affects >40 MHz timing margins | Select only when legacy PCB layout prohibits BGA rework or thermal cycling constraints favor plastic TSOP |
| MX29GL128FPTI-90G | 128-MB (1 Gb), 90 ns tACC, no integrated ECC, requires external error management | Lower cost but increases firmware complexity for error handling and reduces field reliability in high-radiation environments | Prefer only in cost-sensitive industrial controls where ECC is managed in software and lifetime < 5 years |
Compared with S29GL01GT11FHV010, the TSOP variant trades package robustness for legacy compatibility, while the Macronix part omits hardware ECC-requiring additional MCU resources and reducing confidence in long-term data integrity for safety-critical firmware.
Availability
S29GL01GT11FHV010 is available at Aetrix Electronics and suitable for automotive infotainment systems, industrial programmable logic controllers, and medical imaging equipment requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S29GL01GT11FHV010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and non-volatile memory solutions for mission-critical applications.
The GL-T family targets high-reliability embedded systems needing XIP-capable flash with integrated ECC, sector-level protection, and AEC-Q100 qualification - specifically designed for automotive, industrial, and medical firmware storage where data integrity and long-term stability are non-negotiable.
FAQ
What is the function of the SSR array in S29GL01GT11FHV010?
The SSR (Sector-Specific Register) array is a 2048-byte one-time-programmable (OTP) region divided into four lockable sectors (SSR0–SSR3). SSR0 is factory-locked and used for permanent device identification; SSR3 supports password-based read protection for storing cryptographic keys or calibration data. Each sector can be individually locked via dedicated commands, preventing overwrite or readout after programming.
Does S29GL01GT11FHV010 support both ×8 and ×16 data bus configurations?
Yes. The device supports configurable ×8 or ×16 operation via the BYTE# pin. When BYTE# is low, DQ0–DQ7 operate as an 8-bit data bus; when high, DQ0–DQ15 function as a 16-bit bus. Address lines A0–A23 remain identical in both modes, with word-aligned addressing enforced internally - no external address line remapping is required.
How does the hardware ECC engine operate during read cycles?
The ECC engine performs automatic single-bit error correction on every read access without CPU intervention. Correctable errors are fixed transparently; uncorrectable multi-bit errors trigger the ECC status bit in the Status Register ASO and assert RY/BY# low. No firmware overhead is required for basic correction, though drivers may poll the ECC status register to log error frequency for predictive maintenance.
What packaging options are available for S29GL01GT11FHV010 besides the LAE BGA?
In addition to the 64-ball LAE fortified BGA (9 mm × 9 mm) used in S29GL01GT11FHV010, Infineon offers this part in 56-pin TSOP, 64-ball LAA fortified BGA (13 mm × 11 mm), and 56-ball VBU fortified BGA (9 mm × 7 mm). All variants share identical electrical specifications and feature sets, differing only in mechanical footprint, thermal resistance, and board-level routing constraints.
S29GL01GT11FHV010 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL01GT11FHV010 FAQ
1.How can I place an order for S29GL01GT11FHV010 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GT11FHV010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GT11FHV010 reliable?
The price and inventory of S29GL01GT11FHV010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GT11FHV010 is usually 5 days.
3.What payment methods are accepted for S29GL01GT11FHV010?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GT11FHV010 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GT11FHV010?
S29GL01GT11FHV010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GT11FHV010 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GT11FHV010?
For technical support, including S29GL01GT11FHV010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GT11FHV010 requirements.
6.How does Aetrix verify that S29GL01GT11FHV010 is sourced from the original manufacturer or authorized distributors?
All S29GL01GT11FHV010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GT11FHV010 meets industry standards.
7.What is the process for return or replacement of S29GL01GT11FHV010?
All S29GL01GT11FHV010 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GT11FHV010, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GT11FHV010 part is unused and in its original packaging.
Return procedure for S29GL01GT11FHV010:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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