Infineon Technologies S29GL01GT11FHV020
- Part No.:
- S29GL01GT11FHV020
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL01GT11FHV020.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 64FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,607
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Product details
Overview
S29GL01GT11FHV020 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC with MIRRORBIT™ technology, designed for embedded code storage and XIP execution in industrial and automotive systems. It operates from 2.7 V to 3.6 V, delivers 100 ns random access time and 15 ns page access time at –40°C to +85°C, and integrates hardware ECC for single-bit error correction.
For engineers reviewing the S29GL01GT11FHV020 datasheet, S29GL01GT11FHV020 pinout, S29GL01GT11FHV020 application, or S29GL01GT11FHV020 equivalent, key selection factors include its 512-byte programming buffer, uniform 128-KB sector erase architecture, OTP array with four lockable SSR regions, and AEC-Q100 Grade 2 qualification (–40°C to +105°C).
Technical Context
This device implements an asynchronous parallel interface with ×8/×16 data bus support and byte/word boundary addressing. Its embedded algorithm controller (EAC) manages program, erase, and suspend/resume operations without external microcontroller intervention.
The internal hardware ECC engine corrects single-bit errors on-the-fly during read cycles, while the Common Flash Interface (CFI) table enables host software to auto-detect device geometry and command set. Sector protection uses both volatile (lock bits) and non-volatile (ASP) methods per 128-KB sector.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 1 Gb (128 MB) - supports full firmware images for mid-tier microcontrollers and boot code storage in safety-critical systems |
| Random access time | 100 ns at –40°C to +85°C - enables deterministic XIP execution with minimal CPU wait states |
| Page access time | 15 ns - accelerates sequential instruction fetch from cached pages |
| Programming buffer | 512 bytes - reduces effective programming time by batching up to 256 words per operation |
| ECC capability | Single-bit error correction - ensures data integrity without software overhead or external ECC logic |
| Endurance | 100,000 program/erase cycles - suitable for field-upgradable firmware with frequent OTA updates |
| Data retention | 20 years - guarantees long-term reliability in unpowered automotive ECUs and industrial controllers |
Pinout & Package
Package: 64-ball LAE fortified BGA (9 mm × 9 mm), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 | Address inputs | 24-bit address bus supporting full 128-MB linear addressing with byte/word alignment |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; configurable as ×8 or ×16 via BYTE# signal |
| CE#, OE#, WE# | Chip Enable, Output Enable, Write Enable | Standard asynchronous control signals enabling direct connection to ARM Cortex-M or RISC-V MCU memory buses |
| RY/BY# | Ready/Busy output | Open-drain status indicator for polling-based operation during program/erase cycles |
| VCC, VIO | Core and I/O supplies | Separate 2.7–3.6 V core supply and 1.65–VCC I/O supply - supports mixed-voltage system interfacing |
| RESET# | Hardware reset input | Asynchronous active-low reset that forces device into standby mode and clears internal state |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O voltage range | VIO = 1.65 V to VCC - eliminates level shifters when interfacing with 1.8 V or 3.3 V MCUs |
| OTP array with SSR locking | 2048-byte one-time programmable region with four password-protected sectors (SSR0–SSR3) - secures bootloader keys and calibration data |
| Suspend/resume capability | Interrupts ongoing program or erase to service high-priority reads - maintains real-time responsiveness in multitasked firmware |
| Advanced sector protection | Volatile and non-volatile lock bits per 128-KB sector - enables flexible firmware partitioning (e.g., separate boot, app, config regions) |
| CFI parameter table | Standardized JEDEC CFI v1.3 implementation - allows automatic driver initialization across multiple flash vendors |
Applications
| Automotive Instrument Cluster | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing calibrated gauge graphics, firmware updates, and vehicle configuration data in digital dashboards. IC Role / Device Role / Timing Role: Non-volatile code and data storage with AEC-Q100 Grade 2 qualification and 20-year retention. Use Value: Enables secure over-the-air updates and guaranteed boot integrity across 15+ year vehicle lifecycles. | Use Scenario: Holding ladder logic programs, I/O mapping tables, and safety-critical runtime parameters in programmable logic controllers. IC Role / Device Role / Timing Role: XIP-capable parallel flash providing deterministic instruction fetch latency under RTOS scheduling. Use Value: Eliminates external SRAM caching and reduces BOM count while meeting IEC 61131-3 scan cycle timing budgets. |
| Medical Imaging Bootloader | Avionics Data Logger |
Use Scenario: Securing primary bootloader and cryptographic keys in FDA-cleared imaging equipment with tamper-resistant update paths. IC Role / Device Role / Timing Role: OTP-protected boot ROM with hardware ECC and factory-locked SSR0 region. Use Value: Meets IEC 62304 Class C software safety requirements through immutable root-of-trust storage. | Use Scenario: Recording flight sensor telemetry and maintenance logs in DO-178C-certified airborne systems with extended temperature operation. IC Role / Device Role / Timing Role: High-reliability flash with –40°C to +125°C extended grade and 100,000-cycle endurance. Use Value: Supports 10+ years of continuous logging without degradation in harsh thermal environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GT11FHIV10 | Same die, 56-pin TSOP package - no BGA solder joint reliability concerns but larger footprint | Limited to industrial grade (–40°C to +85°C); lacks AEC-Q100 qualification | Select for cost-sensitive industrial designs where board space permits TSOP and automotive compliance is unnecessary |
| N25Q064A13ESE40F | 64 Mb Quad SPI flash - serial interface, lower density, no XIP capability, no OTP array | Requires SPI-to-parallel bridge or MCU with QSPI XIP support; unsuitable for legacy parallel bus systems | Choose only when migrating to modern low-pin-count architectures and accepting trade-offs in latency and security features |
Compared with S29GL01GT11FHIV10, this part adds automotive qualification and BGA packaging for thermal performance; versus N25Q064A13ESE40F, it provides deterministic parallel timing, higher density, and hardware-secured OTP-critical for legacy and safety-critical platforms.
Availability
S29GL01GT11FHV020 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLC firmware storage, medical imaging bootloaders, and avionics data loggers requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S29GL01GT11FHV020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global manufacturing and quality certification to ISO/TS 16949 and AEC-Q200.
The GL-T family targets high-reliability embedded systems needing fast XIP execution, robust data retention, and hardware-enforced security - especially in automotive, industrial, and medical applications where firmware integrity is mission-critical.
FAQ
Is S29GL01GT11FHV020 pin-compatible with earlier S29GL01GP or S29GL01GS variants?
No. S29GL01GT11FHV020 uses a 64-ball LAE BGA package with specific ball pitch and signal mapping defined in Infineon's datasheet section 12.2. Earlier GP/GS versions used 56-pin TSOP or different BGA footprints and lack the Versatile I/O feature and updated CFI structure. PCB redesign is required for migration.
Does this device support true execute-in-place (XIP) operation without external buffering?
Yes. The 100 ns random access time and asynchronous parallel interface allow direct CPU instruction fetch from flash memory without intermediate SRAM caching. Verified XIP compatibility exists with ARM Cortex-M7, Renesas RX600, and NXP S32K series MCUs using standard memory-mapped bus configurations.
What is the function of the SSR3 region and how is password protection implemented?
SSR3 is the fourth 512-byte sector in the 2048-byte OTP array, protected by a 16-byte password stored in dedicated registers. Access requires issuing the Unlock SSR3 command followed by the correct password sequence via the command interface. Once locked, only hardware reset restores access - preventing accidental or unauthorized modification of critical calibration or security data.
Can the Ready/Busy# pin be used for interrupt-driven programming instead of polling?
Yes. RY/BY# is an open-drain output that transitions low during active program or erase operations and returns high upon completion. It can be connected directly to an MCU's external interrupt pin (e.g., GPIO interrupt on STM32 or NVIC line on Kinetis), eliminating CPU polling overhead and enabling concurrent background tasks during flash operations.
S29GL01GT11FHV020 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL01GT11FHV020 FAQ
1.How can I place an order for S29GL01GT11FHV020 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GT11FHV020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GT11FHV020 reliable?
The price and inventory of S29GL01GT11FHV020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GT11FHV020 is usually 5 days.
3.What payment methods are accepted for S29GL01GT11FHV020?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GT11FHV020 transactions.
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4.How is shipping managed for S29GL01GT11FHV020?
S29GL01GT11FHV020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GT11FHV020 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GT11FHV020?
For technical support, including S29GL01GT11FHV020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GT11FHV020 requirements.
6.How does Aetrix verify that S29GL01GT11FHV020 is sourced from the original manufacturer or authorized distributors?
All S29GL01GT11FHV020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GT11FHV020 meets industry standards.
7.What is the process for return or replacement of S29GL01GT11FHV020?
All S29GL01GT11FHV020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GT11FHV020, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GT11FHV020 part is unused and in its original packaging.
Return procedure for S29GL01GT11FHV020:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL01GT11FHV020 Tags

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