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Infineon Technologies S29GL01GT11TFB020
- Part No.:
- S29GL01GT11TFB020
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL01GT11TFB020.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:2,810
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Product details
Overview
S29GL01GT11TFB020 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, hardware ECC for single-bit correction, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C) in a 64-ball LAE fortified BGA (9 mm × 9 mm) package. Used in boot code storage for industrial controllers requiring deterministic XIP execution.
For engineers reviewing the S29GL01GT11TFB020 datasheet, S29GL01GT11TFB020 pinout, S29GL01GT11TFB020 application, or S29GL01GT11TFB020 equivalent, key selection criteria include verified 100,000 program/erase cycles, 20-year data retention, CFI-compliant interface, OTP array with four lockable SSR regions, and support for suspend/resume during embedded operations.
Technical Context
This device implements an asynchronous parallel interface with ×8/×16 configurable data bus, supporting byte/word boundary addressing only. Its embedded algorithm controller (EAC) manages all program/erase operations-including buffer programming up to 512 bytes-and integrates automatic ECC generation and checking on every read/write cycle.
The architecture includes dedicated address space overlays (ASOs) for Status Register, Data Polling, Sector Protection Control, and ECC status, enabling real-time monitoring without host CPU intervention. The versatile I/O feature allows VIO independently set from 1.65 V to VCC, ensuring compatibility with mixed-voltage system designs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 1 Gb (128 MB) - fixed capacity for full boot image storage in resource-constrained embedded systems |
| Interface | Asynchronous parallel ×8/×16 - enables direct connection to legacy microcontroller buses without protocol translation |
| Access Time | 100 ns random / 15 ns page - meets hard real-time XIP requirements for interrupt latency-critical firmware |
| Write Buffer | 512-byte - reduces effective programming time by 4× vs. single-word writes in firmware update scenarios |
| ECC | Internal hardware single-bit correction - eliminates need for external error-handling logic in safety-aware applications |
| Endurance | 100,000 program/erase cycles - supports field firmware updates over 10+ years of industrial deployment |
| Data Retention | 20 years at +85°C - guarantees integrity of stored configuration and calibration data across product lifecycle |
Pinout & Package
Package: 64-ball LAE fortified BGA (9 mm × 9 mm), RoHS-compliant, with 0.8 mm ball pitch and standard JEDEC MO-276AB footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 | Address inputs | 24-bit address bus supporting full 128 MB linear addressing with byte/word boundary alignment only |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; operates in ×8 mode when DQ15 is used as BYTE# control |
| CE# | Chip enable | Active-low chip select enabling device participation in bus transactions; tCE = 100 ns max |
| OE# | Output enable | Active-low control for data output drivers; tOE = 25 ns max ensures timing compliance with 5 MHz read clocks |
| WE# | Write enable | Active-low signal initiating internal program/erase algorithms; latches command sequences on rising edge |
| RY/BY# | Ready/Busy indicator | Open-drain output signaling active embedded operation; allows host to poll status without reading status register |
| VCC | Core supply | 2.7–3.6 V single supply powering core logic, memory array, and EAC-no auxiliary voltage required |
| VIO | I/O supply | 1.65–VCC independent I/O rail enabling interoperability with 1.8 V, 2.5 V, or 3.3 V controllers |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O (VIO) | Independent 1.65 V–VCC I/O supply allows seamless integration into mixed-voltage SoC interfaces without level shifters |
| 512-byte write buffer | Enables burst programming of up to 512 bytes per command, reducing firmware update time by >75% vs. single-word writes |
| Hardware ECC | On-the-fly single-bit error correction eliminates uncorrectable read failures and removes software ECC overhead |
| OTP array with SSRs | 2048-byte one-time-programmable region with four lockable sectors (SSR0–SSR3), including factory-locked SSR0 and password-protected SSR3 |
| Suspend/Resume | Allows interruption of long erase or program operations to service high-priority reads, preserving system responsiveness |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot loader and real-time OS kernel in programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Primary non-volatile boot memory providing XIP-capable instruction fetch with ≤100 ns latency to meet deterministic scan-cycle deadlines. Use Value: 20-year data retention and 100,000-cycle endurance ensure firmware integrity across 15+ year equipment lifecycles without field replacement. | Use Scenario: Holding certified boot code and sensor calibration data in automotive camera ECUs compliant with AEC-Q100 Grade 2 (–40°C to +105°C). IC Role / Device Role / Timing Role: Safety-critical boot memory with hardware ECC and OTP-secured calibration parameters, accessed during cold-start sequence. Use Value: Factory-locked SSR0 and password-protected SSR3 prevent unauthorized modification of safety-critical calibration data. |
| Medical Imaging System Configuration | Avionics Data Logger |
Use Scenario: Storing FPGA configuration bitstreams and device-specific calibration tables in portable ultrasound machines. IC Role / Device Role / Timing Role: High-reliability configuration store interfaced directly to FPGA configuration engine via parallel bus. Use Value: Uniform 128-KB sector erase enables atomic reprogramming of calibration tables without disrupting operational firmware partitions. | Use Scenario: Recording flight-critical telemetry metadata in black-box recorders requiring guaranteed write completion under power interruption. IC Role / Device Role / Timing Role: Non-volatile metadata archive with suspend/resume capability to preserve partial writes during emergency power loss. Use Value: RY/BY# pin and data polling allow host to detect and recover from incomplete erase/program operations after brownout recovery. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GT10TFI020 | Same density and core specs, but TSOP-56 package (not BGA); lacks VIO versatility (VIO = VCC only) | Suitable for cost-sensitive board-level designs with space for through-hole or surface-mount TSOP, not compact BGA layouts | Select when PCB layout constraints favor TSOP and I/O voltage matching is guaranteed |
| MX29GL128FPTI-90G | 128 MB density, 90 ns access, no hardware ECC, no OTP array, supports only ×16 bus | Used in legacy telecom line cards where ECC is handled externally and firmware size fits 128 MB | Select only if existing design already uses Macronix parallel flash and ECC is implemented in host firmware |
Compared with S29GL01GT11TFB020, the TSOP variant trades BGA miniaturization and VIO flexibility for lower assembly cost, while the Macronix part omits hardware ECC and OTP security-making it unsuitable for safety- or security-critical deployments.
Availability
S29GL01GT11TFB020 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system configuration requiring stable component supply across extended product lifecycles.
Supply support for S29GL01GT11TFB020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions, with global manufacturing and quality certification to ISO/TS 16949 and AEC-Q100.
The GL-T family targets embedded systems needing deterministic XIP performance and robust data integrity, combining fast random access with high-density storage and integrated ECC-designed specifically for industrial, automotive, and medical applications demanding long-term reliability.
FAQ
Does S29GL01GT11TFB020 support both ×8 and ×16 data bus modes?
Yes. The device supports configurable ×8/×16 operation via the BYTE# function assigned to DQ15. In ×16 mode, DQ0–DQ15 transfer 16-bit words; in ×8 mode, DQ0–DQ7 carry data while DQ15 controls byte selection. Addressing remains word-aligned in both modes, and all commands execute identically regardless of bus width.
What is the purpose of the SSR0–SSR3 regions in the OTP array?
SSR0–SSR3 are four 512-byte lockable sectors within the 2048-byte OTP array. SSR0 is permanently locked at factory and typically holds device ID or secure keys; SSR3 supports password-based read protection for sensitive calibration or cryptographic data. SSR1 and SSR2 are user-lockable for custom firmware signatures or configuration flags.
How does the suspend/resume feature improve system responsiveness?
Suspend/resume allows halting an ongoing sector erase or buffer program operation upon receipt of a high-priority read request. After servicing the read, the device resumes the suspended operation from its exact state-preserving progress and avoiding timeout-induced failures. This ensures deterministic latency for time-critical interrupts without sacrificing flash endurance.
Is VIO required to match VCC, or can it be independently set?
VIO may be independently set from 1.65 V to VCC, enabling direct interfacing with 1.8 V or 2.5 V microcontrollers while maintaining full 3.0 V core functionality. This eliminates external level shifters in mixed-voltage designs. When VIO = VCC, the device operates in "full VCC" mode with optimized timing (e.g., 100 ns tACC); at lower VIO, timing degrades slightly (e.g., 110 ns tACC).
S29GL01GT11TFB020 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL01GT11TFB020 FAQ
1.How can I place an order for S29GL01GT11TFB020 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GT11TFB020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GT11TFB020 reliable?
The price and inventory of S29GL01GT11TFB020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GT11TFB020 is usually 5 days.
3.What payment methods are accepted for S29GL01GT11TFB020?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GT11TFB020 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GT11TFB020?
S29GL01GT11TFB020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GT11TFB020 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GT11TFB020?
For technical support, including S29GL01GT11TFB020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GT11TFB020 requirements.
6.How does Aetrix verify that S29GL01GT11TFB020 is sourced from the original manufacturer or authorized distributors?
All S29GL01GT11TFB020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GT11TFB020 meets industry standards.
7.What is the process for return or replacement of S29GL01GT11TFB020?
All S29GL01GT11TFB020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GT11TFB020, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GT11TFB020 part is unused and in its original packaging.
Return procedure for S29GL01GT11TFB020:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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