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Infineon Technologies S29GL01GT11TFIV10
- Part No.:
- S29GL01GT11TFIV10
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL01GT11TFIV10.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:552
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Product details
Overview
S29GL01GT11TFIV10 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, hardware ECC for single-bit correction, uniform 128-KB sectors, and supports industrial temperature range (–40°C to +85°C) in TSOP-56 package - used for boot code storage and firmware execution in embedded controllers.
For engineers reviewing the S29GL01GT11TFIV10 datasheet, S29GL01GT11TFIV10 pinout, S29GL01GT11TFIV10 application, or S29GL01GT11TFIV10 equivalent, key selection criteria include parallel ×16 bus interface, asynchronous read timing, sector erase granularity, OTP array configuration, and AEC-Q100 grade compatibility for automotive control modules.
Technical Context
This device implements an embedded algorithm controller (EAC) that executes internal program/erase operations without host CPU intervention. It supports three status monitoring methods: Status Register reads, Data Polling on DQ7, and RY/BY# pin assertion - enabling deterministic timing control in real-time systems.
The CFI-compliant interface provides standardized parameter tables for automatic software detection, while the Versatile I/O feature allows independent VIO supply (1.65 V to VCC), supporting mixed-voltage system integration with 1.8 V or 3.3 V logic interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 1 Gb (128 MB) - sufficient for full firmware images including bootloader, RTOS, and application binaries in industrial gateways |
| Bus width | ×16 - enables 16-bit data transfers per cycle, reducing address strobes and improving XIP efficiency over ×8 mode |
| Random access time | 100 ns at –40°C to +85°C - meets timing budget for 10 MHz CPU bus interfaces without wait states |
| Page access time | 15 ns - accelerates sequential instruction fetch during cache line fills or burst reads |
| Erase endurance | 100,000 cycles per sector - supports field firmware updates over 10+ years in deployed edge devices |
| Data retention | 20 years at +85°C - ensures long-term reliability in unattended infrastructure equipment |
| OTP array | 2048 bytes with four lockable regions (SSR0–SSR3), SSR0 factory-locked - secures cryptographic keys and calibration data |
Pinout & Package
Package: 56-pin Thin Small Outline Package (TSOP-I, Type I), 20.0 mm × 10.16 mm × 1.2 mm body, JEDEC MO-141AC compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A20 | Address inputs | 21-bit address bus supporting full 128 MB linear addressing (A0 = LSB, A20 = MSB) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; operates in byte (DQ0–DQ7) or word mode per control signals |
| CE# | Chip enable | Active-low chip select; controls device power state and command latching timing window |
| OE# | Output enable | Active-low read strobe; gates output drivers during asynchronous read cycles |
| WE# | Write enable | Active-low write strobe; initiates command sequences and data loading into internal registers |
| RY/BY# | Ready/Busy indicator | Open-drain output signaling active program/erase operation; used for polling or interrupt-driven flow control |
| VCC | Core supply | 2.7 V to 3.6 V single supply powering core logic, memory array, and EAC |
| VIO | I/O supply | 1.65 V to VCC - decouples I/O voltage from core, enabling interoperability with 1.8 V microcontrollers |
Key Features
| Feature | Design Value |
|---|---|
| Hardware ECC engine | On-the-fly single-bit error correction with no software overhead - maintains data integrity during extended read cycles in noisy environments |
| Suspend/Resume capability | Interrupts ongoing erase or program operations to service high-priority reads - essential for real-time OS task scheduling |
| Advanced sector protection (ASP) | Volatile and non-volatile locking per 128-KB sector - prevents accidental overwrite of critical boot sectors during field updates |
| CFI parameter table | Standardized JEDEC JESD68-compliant descriptor block - enables auto-configuration by bootloader without hard-coded timing parameters |
| OTP lockable regions | Four 512-byte SSR zones with factory-locked SSR0 and password-protected SSR3 - isolates secure keys from firmware update paths |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot loader and safety-critical firmware in programmable logic controllers with periodic field updates. IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable instruction fetch with deterministic 100 ns access latency. Use Value: Sector-level erase and ASP prevent corruption during partial reflash; 20-year retention ensures lifecycle alignment with industrial hardware. | Use Scenario: Hosting boot code and sensor fusion algorithms in camera-based driver assistance ECUs requiring AEC-Q100 Grade 2 compliance. IC Role / Device Role / Timing Role: Parallel NOR flash delivering fast random reads for real-time initialization and fault-tolerant recovery sequences. Use Value: Hardware ECC and suspend/resume support safe concurrent operation during CAN message handling and firmware validation. |
| Medical Imaging System BIOS | Telecom Base Station Configuration |
Use Scenario: Holding diagnostic firmware and calibration data in portable ultrasound units subject to thermal cycling and ESD events. IC Role / Device Role / Timing Role: Secure, high-reliability storage with OTP-protected calibration coefficients and tamper-resistant SSR locking. Use Value: Factory-locked SSR0 preserves factory calibration; 125°C extended grade option supports convection-cooled enclosures. | Use Scenario: Storing FPGA configuration bitstreams and protocol stack binaries in 5G remote radio units with remote firmware upgrades. IC Role / Device Role / Timing Role: High-density parallel flash enabling rapid bitstream reload and dual-bank update schemes via sector protection. Use Value: 512-byte programming buffer reduces upgrade time by >4× vs. byte-wise programming; CFI simplifies BSP porting across platforms. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GP11TFIV10 | Same density and package, but uses older 65-nm process; 110 ns random access, no Versatile I/O (VIO = VCC only) | Lacks independent VIO support - unsuitable for mixed-voltage designs with 1.8 V controllers | Select when cost sensitivity outweighs need for voltage flexibility and tighter timing |
| MX29GL128FPTI-90G | 128 MB ×16, 90 ns access, 48-pin TSOP; no hardware ECC, no OTP array, no CFI support | Requires external error management and lacks secure key storage - increases BOM and firmware complexity | Choose only for legacy designs where ECC and OTP are handled externally |
Compared with S29GL01GP11TFIV10 and MX29GL128FPTI-90G, the S29GL01GT11TFIV10 delivers superior voltage flexibility, built-in ECC, and secure OTP - reducing system-level validation effort and enabling robust field updates in safety-critical applications.
Availability
S29GL01GT11TFIV10 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system BIOS requiring stable component supply across multi-year production cycles.
Supply support for S29GL01GT11TFIV10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global manufacturing and R&D centers.
The GL-T family targets high-reliability embedded systems needing fast XIP execution and robust firmware storage - designed specifically for automotive, industrial, and medical applications demanding AEC-Q100 qualification and long-term data integrity.
FAQ
Does S29GL01GT11TFIV10 support both ×8 and ×16 data bus configurations?
Yes, it supports configurable ×8 or ×16 operation via hardware pin strapping (BYTE# input). When BYTE# is low, the device operates in ×16 mode with DQ0–DQ15 active; when high, it operates in ×8 mode with DQ0–DQ7 only. Address mapping and command set remain consistent across modes.
What is the function of the SSR (Secure Silicon Region) and how is it protected?
The SSR is a 2048-byte OTP array divided into four 512-byte regions (SSR0–SSR3). SSR0 is permanently locked at factory; SSR3 supports password-based read protection. Locking is irreversible and performed via dedicated CFI commands - preventing runtime modification of stored keys or calibration data.
How does the Versatile I/O (VIO) feature impact system design?
VIO allows independent supply voltage (1.65 V to VCC) for I/O buffers, decoupling logic interface voltage from core VCC. This enables direct connection to 1.8 V microcontrollers without level shifters while maintaining full 3.3 V core performance - reducing board area and signal integrity risk.
Can S29GL01GT11TFIV10 be used in AEC-Q100 Grade 2 automotive applications?
Yes - this specific part number (S29GL01GT11TFIV10) is qualified for Industrial temperature range (–40°C to +85°C), which satisfies AEC-Q100 Grade 3 requirements. For Grade 2 (–40°C to +105°C), Infineon offers variant S29GL01GT11TFIV20 with identical pinout and functionality but extended thermal rating.
S29GL01GT11TFIV10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL01GT11TFIV10 FAQ
1.How can I place an order for S29GL01GT11TFIV10 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GT11TFIV10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GT11TFIV10 reliable?
The price and inventory of S29GL01GT11TFIV10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GT11TFIV10 is usually 5 days.
3.What payment methods are accepted for S29GL01GT11TFIV10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GT11TFIV10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GT11TFIV10?
S29GL01GT11TFIV10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GT11TFIV10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GT11TFIV10?
For technical support, including S29GL01GT11TFIV10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GT11TFIV10 requirements.
6.How does Aetrix verify that S29GL01GT11TFIV10 is sourced from the original manufacturer or authorized distributors?
All S29GL01GT11TFIV10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GT11TFIV10 meets industry standards.
7.What is the process for return or replacement of S29GL01GT11TFIV10?
All S29GL01GT11TFIV10 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GT11TFIV10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GT11TFIV10 part is unused and in its original packaging.
Return procedure for S29GL01GT11TFIV10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL01GT11TFIV10 Tags
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