Infineon Technologies S29GL01GT11TFIV20
- Part No.:
- S29GL01GT11TFIV20
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL01GT11TFIV20.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 56TSOP
- Quantity:
- Payment:

- Shipping:

Inventory:1,097
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S29GL01GT11TFIV20 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory with MIRRORBIT™ technology, operating at 3.0 V core supply and supporting 16-bit data bus width. It delivers 100 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. Designed for embedded boot code storage in industrial control systems requiring reliable non-volatile program execution.
For engineers reviewing the S29GL01GT11TFIV20 datasheet, S29GL01GT11TFIV20 pinout, S29GL01GT11TFIV20 application, or S29GL01GT11TFIV20 equivalent, key selection criteria include uniform 128-KB sector erase granularity, 512-byte programming buffer throughput (1.14 MBps), OTP array with four lockable SSR regions, and AEC-Q100 Grade 2 qualification (–40°C to +105°C).
Technical Context
This device implements an asynchronous parallel interface with byte/word boundary addressing and supports both ×8 and ×16 data bus configurations. Its embedded algorithm controller (EAC) manages program, erase, suspend/resume, and automatic ECC operations without host CPU intervention.
The flash array is organized into uniform 128-KB sectors and includes a dedicated 2048-byte one-time programmable (OTP) array partitioned into four lockable sectors (SSR0–SSR3), with SSR0 factory-locked and SSR3 password-protected. CFI-compliant parameter tables enable runtime configuration detection by host firmware.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 1 Gb (128 MB) - sufficient for full boot image + firmware + configuration storage in resource-constrained embedded hosts |
| Access Time (tACC) | 100 ns (–40°C to +85°C) - enables direct XIP execution from flash without external cache penalty |
| Page Access Time (tPACC) | 15 ns - accelerates sequential instruction fetch during boot or interrupt vector load |
| Programming Buffer | 512 bytes - reduces effective programming time by batching writes, critical for field firmware updates |
| ECC Support | Internal hardware single-bit correction - eliminates need for external ECC logic in safety-critical applications |
| Endurance | 100,000 program/erase cycles - supports frequent OTA update cycles over 10+ year product lifetime |
| Data Retention | 20 years - ensures long-term reliability in unpowered storage scenarios (e.g., automotive ECU backup) |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-141AC footprint with 0.5 mm pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 | Address Inputs | 24-bit address bus supporting full 128 MB linear space; A0 selects LSB for ×16 mode |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; operates in ×16 mode per datasheet ordering code "T" |
| CE# | Chip Enable | Active-low chip select; tCE = 100 ns max - defines minimum cycle time for burst reads |
| OE# | Output Enable | Active-low output control; tOE = 25 ns max - determines data valid window timing |
| WE# | Write Enable | Active-low write strobe; initiates command sequences and data latching for program/erase |
| RY/BY# | Ready/Busy Output | Open-drain status indicator; low during embedded operations - enables polling-free operation |
| VCC | Core Supply | 3.0 V ±10% supply for read/program/erase - single-rail simplifies power design |
| VIO | I/O Supply | 1.65 V to VCC - supports mixed-voltage host interfaces (e.g., 1.8 V FPGA + 3.3 V flash) |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O (VIO) | Independent 1.65 V–3.6 V I/O supply allows interoperability with 1.8 V, 2.5 V, or 3.3 V controllers without level shifters |
| Uniform 128-KB Sectors | Enables deterministic erase scheduling and wear leveling across full memory map - essential for robust firmware update schemes |
| OTP Array with SSR Locking | Four 512-byte lockable sectors (SSR0–SSR3); SSR0 factory-locked for secure boot keys, SSR3 password-protected for customer secrets |
| CFI Compliance | Standardized parameter table accessible via read commands - enables auto-detection and driver portability across flash vendors |
| Suspend/Resume | Allows background erase to pause during high-priority read access - guarantees real-time response in hard real-time systems |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot loader, real-time OS kernel, and motion control algorithms in programmable logic controllers with no external RAM cache. IC Role / Device Role / Timing Role: Primary XIP-capable boot memory providing deterministic 100 ns instruction fetch latency to ARM Cortex-M7 MCU. Use Value: Eliminates need for external SRAM shadow copy; 20-year data retention ensures firmware integrity across 15+ year plant lifecycle. | Use Scenario: Holding certified boot firmware and sensor calibration data in front-camera ECU operating at –40°C to +105°C. IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 qualified non-volatile memory enabling cold-start boot within 100 ms after power-on reset. Use Value: Hardware ECC and 100K-cycle endurance support 500+ field firmware updates over vehicle lifetime without corruption risk. |
| Medical Imaging System Configuration | Energy Meter Secure Parameter Storage |
Use Scenario: Storing DICOM protocol stacks, image processing LUTs, and regulatory compliance certificates in portable ultrasound devices. IC Role / Device Role / Timing Role: High-reliability configuration store with OTP-locked security registers preventing unauthorized firmware modification. Use Value: SSR3 password protection and factory-locked SSR0 meet IEC 62304 software safety requirements for Class C medical devices. | Use Scenario: Retaining tariff tables, cryptographic keys, and tamper logs in ANSI C12.22-compliant smart meters deployed in outdoor substations. IC Role / Device Role / Timing Role: Extended temperature (–40°C to +125°C) flash memory with 128-KB sector erase enabling secure field updates under thermal stress. Use Value: 130 ns tACC at +125°C ensures functional operation during summer peak-load conditions without timing violation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GP11TFIV20 | Same density and package, but lacks OTP array and SSR locking features | Not suitable for secure boot or cryptographic key storage | Select when cost sensitivity outweighs security requirements and no OTP functionality is needed |
| MX29GL128FPTI-90G | 128 MB, 90 ns tACC, no built-in ECC, no OTP array, different command set | Requires external ECC logic and custom driver adaptation | Choose only if legacy system compatibility mandates Macronix command set and ECC is handled in software |
Compared with S29GL01GP11TFIV20 and MX29GL128FPTI-90G, the S29GL01GT11TFIV20 uniquely integrates hardware ECC, OTP-based secure storage, and CFI compliance - making it the only option among the three that satisfies ISO 26262 ASIL-B boot integrity requirements without external components.
Availability
S29GL01GT11TFIV20 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system configuration requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for S29GL01GT11TFIV20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and non-volatile memory solutions for industrial and automotive markets.
The GL-T family targets high-reliability embedded systems requiring XIP-capable flash with integrated data integrity features - specifically designed for automotive ECUs, industrial HMIs, and medical devices demanding AEC-Q100 qualification and 20-year data retention.
FAQ
What temperature grades are supported by S29GL01GT11TFIV20?
This part is specified for Industrial Plus grade (–40°C to +105°C), confirmed by the "I" in the ordering code suffix and validated in Table 1 of the datasheet. It meets AEC-Q100 Grade 2 requirements and is not rated for the Extended (–40°C to +125°C) or Automotive Grade 3 temperature ranges.
Does S29GL01GT11TFIV20 support both ×8 and ×16 data bus modes?
Yes - the device supports configurable ×8/×16 operation via the BYTE# pin. When BYTE# is low, it operates in ×16 mode (16-bit DQ0–DQ15 active); when high, it operates in ×8 mode (DQ0–DQ7 only). This dual-mode capability is documented in Section 8.3 of the datasheet.
How is the OTP array structured and protected?
The 2048-byte OTP array is divided into four 512-byte sectors (SSR0–SSR3). SSR0 is permanently locked at factory; SSR1 and SSR2 are volatile-lockable; SSR3 supports password-based read protection. Protection states are controlled via specific command sequences defined in Section 3.3 of the datasheet.
Can S29GL01GT11TFIV20 be used in place of older S29GL01GT10TFIV20 parts?
Yes - the "11" revision replaces "10" with improved AC timing (100 ns tACC vs. 110 ns) and enhanced ECC reliability. Pinout, command set, and package are identical. Migration requires no hardware change and is validated in Infineon's revision migration notice 002-00247 Rev. *M.
S29GL01GT11TFIV20 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL01GT11TFIV20 FAQ
1.How can I place an order for S29GL01GT11TFIV20 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GT11TFIV20 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GT11TFIV20 reliable?
The price and inventory of S29GL01GT11TFIV20 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GT11TFIV20 is usually 5 days.
3.What payment methods are accepted for S29GL01GT11TFIV20?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GT11TFIV20 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GT11TFIV20?
S29GL01GT11TFIV20 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GT11TFIV20 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GT11TFIV20?
For technical support, including S29GL01GT11TFIV20 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GT11TFIV20 requirements.
6.How does Aetrix verify that S29GL01GT11TFIV20 is sourced from the original manufacturer or authorized distributors?
All S29GL01GT11TFIV20 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GT11TFIV20 meets industry standards.
7.What is the process for return or replacement of S29GL01GT11TFIV20?
All S29GL01GT11TFIV20 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GT11TFIV20, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GT11TFIV20 part is unused and in its original packaging.
Return procedure for S29GL01GT11TFIV20:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL01GT11TFIV20 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

