Infineon Technologies S29GL01GT11TFIV33
- Part No.:
- S29GL01GT11TFIV33
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL01GT11TFIV33.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 56TSOP
- Quantity:
- Payment:

- Shipping:

Inventory:4,910
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Product details
Overview
S29GL01GT11TFIV33 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, hardware ECC for single-bit correction, uniform 128-KB sectors, and supports industrial temperature range (–40°C to +85°C). It is used in boot code storage for network routers requiring fast XIP execution and reliable non-volatile firmware retention.
For engineers reviewing the S29GL01GT11TFIV33 datasheet, S29GL01GT11TFIV33 pinout, S29GL01GT11TFIV33 application, or S29GL01GT11TFIV33 equivalent, key selection factors include parallel ×16 bus interface timing compliance, sector erase endurance (100,000 cycles), OTP array configuration (SSR0–SSR3), ASP protection granularity, and CFI-compliant software interface support.
Technical Context
This device implements an asynchronous parallel interface with byte/word boundary addressing and supports both 8-bit and 16-bit data bus configurations. Its embedded algorithm controller (EAC) manages program, erase, and suspend/resume operations autonomously without external intervention.
The internal hardware ECC engine performs real-time single-bit error correction during read operations and reports multi-bit errors via status register flags. Sector protection uses volatile (lock bits) and non-volatile (ASP) methods, with four lockable 2048-byte OTP regions - SSR0 factory-locked, SSR3 password-read-protected.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 1 Gb (128 MB) organized as 8M × 16-bit or 16M × 8-bit |
| Supply Voltage | VCC = 2.7 V to 3.6 V; VIO = 1.65 V to VCC for versatile I/O compatibility |
| Access Time | tACC = 100 ns (–40°C to +85°C), enabling fast CPU boot code fetch |
| Write Buffer Size | 512 bytes per operation, reducing effective programming time vs. single-word writes |
| Erase Endurance | 100,000 program/erase cycles per sector, validated for firmware update longevity |
| Data Retention | 20 years at +85°C, ensuring long-term reliability in unpowered storage |
| Operating Temp | Industrial grade: –40°C to +85°C, qualified per JEDEC JESD22-A108 |
Pinout & Package
Package: 56-pin TSOP (Type I, 14 mm × 20 mm, 0.55 mm pitch), RoHS-compliant, lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A22 | Address Inputs | 23-bit address bus supporting full 128 MB address space (byte/word aligned) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; operates in ×8 or ×16 mode per configuration |
| CE# | Chip Enable | Active-low enable controlling device selection in multi-chip memory systems |
| OE# | Output Enable | Active-low control for data bus output gating during read operations |
| WE# | Write Enable | Active-low signal initiating internal program/erase command execution |
| RY/BY# | Ready/Busy Output | Open-drain status indicator: low = busy, high = ready for next command |
| RESET# | Hardware Reset | Active-low input forcing device into reset state, clearing internal registers |
Key Features
| Feature | Design Value |
|---|---|
| 45-nm MIRRORBIT™ Process | Enables higher density and lower power vs. older 65-nm NOR flash, reducing die size and active current |
| Asynchronous Page Read | 32-byte burst capability improves sequential instruction fetch speed in XIP applications |
| Internal Hardware ECC | Single-bit correction without CPU overhead; multi-bit detection reported via status register flag |
| Advanced Sector Protection | Volatile and non-volatile locking per 128-KB sector prevents accidental firmware overwrite |
| CFI Parameter Table | Standardized software interface allows OS/driver auto-detection and configuration without hard-coded parameters |
Applications
| Boot Code Storage | Firmware Update Storage |
|---|---|
Use Scenario: Storing primary bootloader and kernel images in network infrastructure equipment such as enterprise switches. IC Role / Device Role / Timing Role: Non-volatile parallel NOR flash providing eXecute-in-Place (XIP) capability for direct CPU instruction fetch. Use Value: 100 ns random access enables sub-microsecond instruction latency; 128 MB capacity accommodates signed secure boot images and recovery partitions. | Use Scenario: Holding field-upgradable firmware images in industrial PLCs with dual-bank update schemes. IC Role / Device Role / Timing Role: High-endurance flash memory supporting repeated sector-level erase/program cycles during over-the-air updates. Use Value: 100,000 erase cycles and hardware ECC ensure integrity across 10+ years of scheduled firmware revisions. |
| Secure Configuration Storage | Automotive ECU Boot Memory |
Use Scenario: Storing calibrated sensor parameters and cryptographic keys in medical imaging devices requiring traceable configuration history. IC Role / Device Role / Timing Role: OTP-protected flash region (SSR3) with password read protection for sensitive calibration data. Use Value: Four lockable 2048-byte OTP regions allow hierarchical access control; SSR0 factory-locked for immutable root keys. | Use Scenario: Boot memory for automotive ADAS domain controllers meeting AEC-Q100 Grade 2 requirements (–40°C to +105°C). IC Role / Device Role / Timing Role: Industrial Plus grade variant used as primary boot device with extended temperature qualification. Use Value: Validated 110 ns tACC at +105°C ensures deterministic boot timing under under-hood thermal stress. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GP11TFIV33 | Same density and package, but lacks Versatile I/O (VIO fixed to VCC); no 1.65 V–VCC range support | Not suitable for mixed-voltage SoC interfaces requiring independent VIO rail | Select only if host system uses single 3.3 V supply for both core and I/O |
| MX29GL128FPTI-90G | 128 MB ×16, 90 ns tACC, no integrated ECC; requires external error management | Higher risk of silent data corruption in long-life deployments without ECC | Prefer only when cost sensitivity outweighs data integrity requirements and external ECC logic exists |
Compared with S29GL01GP11TFIV33 and MX29GL128FPTI-90G, the S29GL01GT11TFIV33 uniquely combines Versatile I/O voltage flexibility, on-die ECC, and CFI compliance-making it optimal for new designs requiring robustness, mixed-voltage compatibility, and standardized driver support.
Availability
S29GL01GT11TFIV33 is available at Aetrix Electronics and suitable for boot code storage, firmware update storage, secure configuration storage, and automotive ECU boot memory requiring stable component supply across extended product lifecycles.
Supply support for S29GL01GT11TFIV33 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and non-volatile memory solutions with global manufacturing and quality certification.
The GL-T family targets high-reliability embedded systems requiring fast XIP performance, long data retention, and robust firmware protection-designed specifically for networking, industrial automation, and automotive control units.
FAQ
Does S29GL01GT11TFIV33 support both ×8 and ×16 data bus modes?
Yes, it supports configurable ×8 or ×16 operation via hardware pin strapping (BYTE# signal). When BYTE# is low, the device operates in ×16 mode with DQ0–DQ15 active; when high, it operates in ×8 mode with DQ0–DQ7 only. This allows flexible integration with 8-bit or 16-bit microcontroller buses without external glue logic.
What is the function of the SSR0–SSR3 OTP regions?
SSR0–SSR3 are four 2048-byte one-time-programmable arrays. SSR0 is factory-locked and contains immutable security keys; SSR1–SSR2 are user-lockable for calibration data; SSR3 supports password-based read protection. Once programmed and locked, contents cannot be erased or rewritten, ensuring tamper-resistant storage of critical parameters.
How does the Ready/Busy# (RY/BY#) pin behave during erase operations?
RY/BY# goes low at the start of any embedded operation (program or erase) and remains low until completion. During sector erase, it stays asserted for up to 1.5 seconds (typical), signaling active internal state machine execution. The pin is open-drain and requires an external pull-up resistor; its transition to high confirms readiness for the next command without polling.
Is CFI support mandatory for driver compatibility?
CFI support is not mandatory but strongly recommended: it provides standardized register maps for automatic identification of geometry, command sets, and timing parameters. Without CFI, drivers must be hardcoded for this specific part, increasing porting effort and limiting reuse across flash families. All GL-T devices implement full CFI v1.3 compliance per JEDEC JESD68.
S29GL01GT11TFIV33 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL01GT11TFIV33 FAQ
1.How can I place an order for S29GL01GT11TFIV33 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GT11TFIV33 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GT11TFIV33 reliable?
The price and inventory of S29GL01GT11TFIV33 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GT11TFIV33 is usually 5 days.
3.What payment methods are accepted for S29GL01GT11TFIV33?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GT11TFIV33 transactions.
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4.How is shipping managed for S29GL01GT11TFIV33?
S29GL01GT11TFIV33 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GT11TFIV33 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GT11TFIV33?
For technical support, including S29GL01GT11TFIV33 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GT11TFIV33 requirements.
6.How does Aetrix verify that S29GL01GT11TFIV33 is sourced from the original manufacturer or authorized distributors?
All S29GL01GT11TFIV33 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GT11TFIV33 meets industry standards.
7.What is the process for return or replacement of S29GL01GT11TFIV33?
All S29GL01GT11TFIV33 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GT11TFIV33, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GT11TFIV33 part is unused and in its original packaging.
Return procedure for S29GL01GT11TFIV33:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL01GT11TFIV33 Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology

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AT21CS01-STUM10-T
Microchip Technology

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24LC01BT-I/OT
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M24C02-FMC6TG
STMicroelectronics

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AT24CS02-SSHM-T
Microchip Technology

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93LC46BT-I/OT
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AT24C04C-SSHM-T
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24AA02UIDT-I/OT
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AT24C08C-STUM-T
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