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Infineon Technologies S29GL01GT11TFV030
- Part No.:
- S29GL01GT11TFV030
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL01GT11TFV030.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:2,110
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Product details
Overview
S29GL01GT11TFV030 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, hardware ECC for single-bit correction, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C). It is used in boot code storage for industrial controllers requiring fast XIP execution and reliable non-volatile program retention.
For engineers reviewing the S29GL01GT11TFV030 datasheet, S29GL01GT11TFV030 pinout, S29GL01GT11TFV030 application, or S29GL01GT11TFV030 equivalent, key selection criteria include parallel ×16 bus interface, Versatile I/O support (1.65 V to VCC), CFI-compliant command set, OTP array with four lockable SSR regions, and AEC-Q100 grade 3 qualification for automotive control modules.
Technical Context
This device implements an asynchronous parallel interface with byte/word boundary addressing and supports both 8-bit and 16-bit data bus configurations. Its embedded algorithm controller (EAC) manages program, erase, suspend/resume, and automatic ECC operations without host intervention.
The flash array is organized into uniform 128-KB sectors, each independently erasable, and includes dedicated status register, data polling, and RY/BY# signaling for real-time operation monitoring. The SSR (One-Time Programmable) array contains four 2048-byte lockable regions-SSR0 factory-locked, SSR3 password-protected-for secure configuration storage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 1 Gb (128 MB) - sufficient for full firmware images and parameter tables in industrial HMI and gateway applications |
| Interface Type | Parallel ×16 - enables direct connection to microcontroller external memory buses without glue logic |
| Random Access Time | 100 ns at –40°C to +85°C - meets timing requirements for 10 MHz CPU bus read cycles in real-time control systems |
| Write Buffer Size | 512 bytes - reduces effective programming time by up to 4× versus single-word writes in firmware update routines |
| ECC Support | Internal hardware single-bit error correction - eliminates need for external ECC logic in safety-critical boot memory paths |
| Endurance & Retention | 100,000 program/erase cycles / 20-year data retention - validated for long-life deployments in unattended infrastructure equipment |
| Operating Voltage | VCC = 2.7 V to 3.6 V, VIO = 1.65 V to VCC - allows interoperability with mixed-voltage SoCs and legacy 3.3 V logic families |
| Temperature Grade | Industrial (–40°C to +85°C) - qualified per JEDEC JESD22-A108 for continuous operation in factory automation environments |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard pitch 0.5 mm - compatible with high-volume PCB assembly and rework-friendly footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address Inputs | 22-bit address bus supporting full 128 MB linear addressing with byte/word boundary alignment |
| DQ0–DQ15 | Data I/O (×16) | Bidirectional 16-bit data path; supports byte-wide access via BHE#/BLE# control |
| CE# | Chip Enable | Active-low enable controlling device selection; tCE ≤ 100 ns ensures tight timing margin in multiplexed memory maps |
| OE# | Output Enable | Active-low read strobe; tOE ≤ 25 ns enables fast data sampling on microcontroller data bus |
| WE# | Write Enable | Active-low write strobe; initiates program/erase commands when CE# and OE# are inactive |
| RY/BY# | Ready/Busy Output | Open-drain status indicator; low during embedded operations, enabling interrupt-driven host polling |
| RESET# | Hardware Reset | Active-low asynchronous reset that forces device into standby and clears internal state |
| VCC, VIO, GND | Power Supplies | Separate core (VCC) and I/O (VIO) rails allow voltage translation between 3.3 V core and 1.8 V interface logic |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O Interface | VIO range 1.65 V to VCC enables direct interfacing with 1.8 V, 2.5 V, or 3.3 V microcontrollers without level shifters |
| 512-Byte Programming Buffer | Reduces average programming time to ~445 μs per 512-byte block, accelerating field firmware updates |
| Hardware ECC Engine | Single-bit correction implemented in silicon - no CPU overhead or software driver dependency for error resilience |
| Four Lockable OTP Regions | SSR0–SSR3 provide secure storage for calibration data, MAC addresses, and cryptographic keys with configurable lock states |
| CFI-Compatible Command Set | Enables standardized flash initialization and identification across toolchains and bootloader frameworks (e.g., U-Boot, Coreboot) |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot loader and real-time control firmware in programmable logic controllers deployed in manufacturing lines. IC Role / Device Role / Timing Role: Primary non-volatile boot memory mapped to CPU external bus; provides XIP-capable instruction fetch with ≤100 ns latency. Use Value: 128 MB capacity accommodates dual-image firmware with rollback capability; 100,000-cycle endurance supports over-the-air update cycles for 15+ years. | Use Scenario: Holding certified boot code and sensor calibration data in radar control units meeting AEC-Q100 Grade 2 (–40°C to +105°C). IC Role / Device Role / Timing Role: Secure boot memory with OTP-protected calibration parameters; operates under extended thermal stress without refresh. Use Value: SSR3 password protection prevents unauthorized readout of radar beamforming coefficients; ECC ensures integrity during vehicle power cycling. |
| Medical Imaging System Configuration | Energy Meter Firmware & Logs |
Use Scenario: Storing FPGA configuration bitstreams and DICOM protocol stacks in portable ultrasound devices requiring FDA-compliant data integrity. IC Role / Device Role / Timing Role: Parallel-connected configuration store accessed during cold start; supports deterministic boot within 500 ms. Use Value: Hardware ECC and 20-year data retention meet IEC 62304 Class C software lifecycle requirements for life-critical diagnostics. | Use Scenario: Logging energy consumption history and storing tariff tables in smart meters deployed in utility substations with wide ambient temperature swings. IC Role / Device Role / Timing Role: Non-volatile logging memory with sector-level erase isolation; retains data through 10+ year deployments without battery backup. Use Value: Uniform 128-KB sectors allow wear leveling across 100+ log partitions; standby current <100 μA extends battery life in battery-backed meters. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GP11TFV030 | Same density and package, but lacks Versatile I/O (VIO fixed to VCC); no 1.65 V–2.5 V interface support | Not suitable for mixed-voltage SoC designs requiring independent I/O rail control | Select only if system uses fixed 3.3 V I/O and does not require voltage translation flexibility |
| MX29GL128FPTI-90G | 128 MB ×16, 90 ns access, no hardware ECC, no OTP array, supports only standard sector protection | Lacks secure storage and error resilience features required for safety-certified firmware | Consider for cost-sensitive consumer applications where ECC and OTP are unnecessary |
Compared with S29GL01GP11TFV030 and MX29GL128FPTI-90G, the S29GL01GT11TFV030 uniquely delivers Versatile I/O compatibility, integrated ECC, and four-lockable OTP regions-making it the only choice for industrial and automotive designs demanding secure, mixed-voltage, and error-resilient boot memory.
Availability
S29GL01GT11TFV030 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system configuration requiring stable component supply across multi-year production cycles.
Supply support for S29GL01GT11TFV030 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing infrastructure.
The GL-T family targets high-reliability embedded systems needing fast XIP-capable flash with robust data integrity-designed specifically for industrial control, automotive ECUs, and medical devices where firmware security and longevity are critical.
FAQ
What is the difference between S29GL01GT11TFV030 and S29GL01GT11TFI030?
The suffix 'V' indicates a 56-pin TSOP package with industrial temperature grade (–40°C to +85°C), while 'I' denotes the same package but with extended temperature range (–40°C to +125°C). Electrical specifications differ: tACC increases to 120 ns and standby current rises to 215 μA at +125°C. Both share identical command set, OTP layout, and ECC functionality.
Does S29GL01GT11TFV030 support byte-write operations?
No-it supports only word (16-bit) programming in ×16 mode or byte (8-bit) programming in ×8 mode, selected via hardware configuration pins (BYTE#). Single-word programming is permitted, but individual byte writes within a word require full-word reprogramming after read-modify-write, as the device lacks true byte-level write capability.
How is the OTP array protected against accidental overwrite?
The 2048-byte OTP array is divided into four 512-byte sectors (SSR0–SSR3), each with independent lock bits. SSR0 is permanently locked at factory; SSR1–SSR3 can be locked via software command or hardware fuse. Once locked, no further writes are possible-even during erase cycles-and lock status is readable only via CFI query or status register.
Can S29GL01GT11TFV030 be used with a 1.8 V microcontroller interface?
Yes-its Versatile I/O feature allows VIO to operate down to 1.65 V. When VIO = 1.8 V and VCC = 3.0 V, all input thresholds and output drive levels comply with 1.8 V logic families. No external level shifters are needed, and timing parameters (e.g., tOE = 35 ns) remain valid per datasheet Table 3 for Versatile I/O conditions.
S29GL01GT11TFV030 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL01GT11TFV030 FAQ
1.How can I place an order for S29GL01GT11TFV030 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GT11TFV030 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GT11TFV030 reliable?
The price and inventory of S29GL01GT11TFV030 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GT11TFV030 is usually 5 days.
3.What payment methods are accepted for S29GL01GT11TFV030?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GT11TFV030 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GT11TFV030?
S29GL01GT11TFV030 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GT11TFV030 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GT11TFV030?
For technical support, including S29GL01GT11TFV030 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GT11TFV030 requirements.
6.How does Aetrix verify that S29GL01GT11TFV030 is sourced from the original manufacturer or authorized distributors?
All S29GL01GT11TFV030 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GT11TFV030 meets industry standards.
7.What is the process for return or replacement of S29GL01GT11TFV030?
All S29GL01GT11TFV030 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GT11TFV030, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GT11TFV030 part is unused and in its original packaging.
Return procedure for S29GL01GT11TFV030:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL01GT11TFV030 Tags
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