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Infineon Technologies S29GL01GT12DHM020
- Part No.:
- S29GL01GT12DHM020
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL01GT12DHM020.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,830
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Product details
Overview
S29GL01GT12DHM020 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, hardware ECC for single-bit correction, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C). It is used in boot code storage for network routers requiring fast XIP execution and reliable firmware retention.
For engineers reviewing the S29GL01GT12DHM020 datasheet, S29GL01GT12DHM020 pinout, S29GL01GT12DHM020 application, or S29GL01GT12DHM020 equivalent, key selection factors include verified 100,000 program/erase cycles, OTP array with four lockable SSR regions, CFI-compliant interface, and support for suspend/resume during embedded operations.
Technical Context
This device implements an asynchronous parallel interface with ×8/×16 data bus configuration and byte/word boundary addressing. Its embedded algorithm controller (EAC) manages autonomous program and erase operations, while internal hardware ECC provides real-time single-bit error correction without host intervention.
The versatile I/O feature enables VIO operation from 1.65 V to VCC, decoupling I/O voltage from core supply. Sector protection includes volatile and non-volatile methods per sector, and the 2048-byte OTP array contains four independently lockable SSR regions-SSR0 factory-locked, SSR3 password-read-protected.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 1 Gb (128 MB) - sufficient for full boot image + firmware + parameter storage in edge gateway applications |
| Access time (tACC) | 100 ns at –40°C to +85°C - enables direct XIP execution without external cache in real-time control systems |
| Page access time (tPACC) | 15 ns - accelerates sequential instruction fetch during boot initialization |
| Write buffer size | 512 bytes - reduces effective programming time by up to 4× vs. single-word writes |
| ECC capability | Single-bit correction via on-die hardware - eliminates need for external ECC logic in safety-critical boot paths |
| Endurance & retention | 100,000 program/erase cycles; 20-year data retention - meets long-lifecycle requirements for industrial PLCs |
| Operating temp | –40°C to +85°C (Industrial grade) - qualified for deployment in uncontrolled ambient environments |
Pinout & Package
Package: 56-pin TSOP (Type I, standard pitch), JEDEC MO-142AC compliant, body size 18.4 mm × 10.16 mm × 1.0 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address inputs | 22-bit address bus supporting full 128 MB linear space; A0 selects byte/word mode when x16 configured |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional bus; operates in ×8 or ×16 mode depending on BYTE# state |
| CE# | Chip enable | Active-low enable controlling device selection; tCE = 100 ns max ensures timing margin in multi-chip bus systems |
| OE# | Output enable | Active-low control for data output gating; tOE = 25 ns supports high-speed read burst sequences |
| WE# | Write enable | Active-low signal initiating write/program commands; synchronized with address and data setup/hold |
| RY/BY# | Ready/Busy indicator | Open-drain output signaling active embedded operation; allows host to poll status without command overhead |
| RESET# | Hardware reset | Asynchronous active-low input forcing device into reset state; required before power-up initialization sequence |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O voltage range | VIO = 1.65 V to VCC - enables interoperability with 1.8 V, 2.5 V, or 3.3 V logic families without level shifters |
| Uniform 128-KB sectors | 1024 sectors total - simplifies firmware partitioning (e.g., separate boot loader, kernel, config, OTA update slots) |
| Suspend/Resume capability | Interruptible program/erase - allows high-priority read access during background flash updates in real-time OS environments |
| CFI parameter table | Standardized JEDEC JESD68 query structure - enables automatic driver detection and configuration in U-Boot/Linux MTD stacks |
| OTP array with SSR locking | 2048-byte one-time-programmable space with four lockable regions - secures cryptographic keys and calibration data against overwrite or readout |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot loader, real-time OS kernel, and motion control algorithms in programmable logic controllers deployed in factory automation lines. IC Role / Device Role / Timing Role: Primary non-volatile boot memory providing XIP-capable instruction fetch with deterministic 100 ns latency. Use Value: 20-year data retention and 100,000-cycle endurance ensure firmware integrity over 15+ years of continuous operation without field replacement. | Use Scenario: Holding certified boot code and sensor fusion firmware in automotive camera ECU modules complying with AEC-Q100 Grade 2. IC Role / Device Role / Timing Role: Secure boot memory with OTP-protected calibration data and hardware ECC for ASIL-B functional safety compliance. Use Value: SSR3 password-read protection prevents unauthorized extraction of camera calibration parameters during vehicle service or diagnostics. |
| Network Edge Router Boot Image | Medical Imaging System Configuration |
Use Scenario: Hosting compressed Linux kernel, initramfs, and network stack binaries in carrier-grade edge routers requiring zero-downtime firmware upgrades. IC Role / Device Role / Timing Role: Dual-mode (×8/×16) parallel flash enabling flexible bus width matching to SoC interface constraints. Use Value: 512-byte write buffer cuts OTA update time by >70% compared to legacy single-word programming, reducing service window duration. | Use Scenario: Storing DICOM configuration profiles, gamma correction tables, and regulatory certification metadata in portable ultrasound devices. IC Role / Device Role / Timing Role: Non-volatile parameter store with sector-level protection preventing accidental corruption during power-loss events. Use Value: Industrial temperature rating (–40°C to +85°C) guarantees reliable operation inside sealed, fanless enclosures with internal thermal buildup. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GP12DHM020 | Same density and package, but uses older 65-nm process; 110 ns tACC vs. 100 ns; no OTP array | Lacks SSR-based security features; unsuitable where firmware integrity or key storage is required | Select only if cost sensitivity outweighs need for ECC, OTP, or tighter timing in legacy designs |
| MX29GL128FPTI-90G | 128 MB (1 Gb), 90 ns tACC, no hardware ECC, no OTP, 3.0 V only (no versatile I/O) | No VIO flexibility or embedded security; requires external error handling logic | Consider only for simple, low-cost boot storage where ECC and secure key storage are not mandated |
Compared with S29GL01GP12DHM020 and MX29GL128FPTI-90G, the S29GL01GT12DHM020 delivers superior reliability through on-die ECC and secure firmware protection via OTP/SSR-critical for medical, industrial, and automotive deployments where field failure is unacceptable.
Availability
S29GL01GT12DHM020 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and network edge router boot image applications requiring stable component supply across extended product lifecycles.
Supply support for S29GL01GT12DHM020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and secure non-volatile memory solutions.
The GL-T family targets high-reliability embedded systems requiring fast XIP execution, robust firmware integrity, and long-term data retention-designed specifically for industrial, automotive, and networking equipment where field upgradeability and security are mandatory.
FAQ
Does S29GL01GT12DHM020 support both ×8 and ×16 data bus configurations?
Yes. The device automatically detects bus width via the BYTE# pin: asserted low enables ×16 mode (DQ0–DQ15 active), high enables ×8 mode (DQ0–DQ7 only). This dual-mode capability allows seamless integration with SoCs offering either interface width without redesigning PCB layout or firmware drivers.
What is the function of the SSR regions in the OTP array?
The 2048-byte OTP array contains four lockable Sector Security Registers (SSR0–SSR3). SSR0 is factory-locked and immutable; SSR3 supports password-based read protection. These regions securely store cryptographic keys, calibration constants, or device-specific identifiers that must survive power loss and resist tampering or accidental overwrite.
How does hardware ECC operate during read operations?
Hardware ECC runs transparently on every read access: single-bit errors are corrected in real time by on-die logic, and the corrected data is delivered to the host. No software intervention or additional latency is required. Uncorrectable multi-bit errors trigger status register flags (ECCERR bit) for host exception handling-enabling fail-safe boot verification.
Can S29GL01GT12DHM020 be used in automotive applications requiring AEC-Q100 qualification?
Yes-this specific variant (S29GL01GT12DHM020) is rated for Industrial grade (–40°C to +85°C), but Infineon offers automotive-grade versions (e.g., S29GL01GT12DHM020A) qualified to AEC-Q100 Grade 2 (–40°C to +105°C). Always verify the suffix and ordering code for automotive qualification; the base part number alone does not imply AEC compliance.
S29GL01GT12DHM020 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 120 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL01GT12DHM020 FAQ
1.How can I place an order for S29GL01GT12DHM020 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GT12DHM020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GT12DHM020 reliable?
The price and inventory of S29GL01GT12DHM020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GT12DHM020 is usually 5 days.
3.What payment methods are accepted for S29GL01GT12DHM020?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GT12DHM020 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GT12DHM020?
S29GL01GT12DHM020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GT12DHM020 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GT12DHM020?
For technical support, including S29GL01GT12DHM020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GT12DHM020 requirements.
6.How does Aetrix verify that S29GL01GT12DHM020 is sourced from the original manufacturer or authorized distributors?
All S29GL01GT12DHM020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GT12DHM020 meets industry standards.
7.What is the process for return or replacement of S29GL01GT12DHM020?
All S29GL01GT12DHM020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GT12DHM020, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GT12DHM020 part is unused and in its original packaging.
Return procedure for S29GL01GT12DHM020:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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