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Infineon Technologies S29GL01GT12DHM023

Part No.:
S29GL01GT12DHM023
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
64-LBGA
Datasheet:
AetrixS29GL01GT12DHM023.pdf
Description:
IC FLASH 1GBIT PARALLEL 64FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,171

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Product details

Overview

S29GL01GT12DHM023 from Infineon Technologies is a 1 Gb (128 MB) parallel NOR flash memory IC with MIRRORBIT™ architecture, operating at 3.0 V core supply and supporting ×8/×16 data bus width. It delivers 100 ns random access time, 15 ns page access time, and integrates hardware ECC for single-bit error correction. Designed for embedded boot code storage in industrial control systems requiring high reliability and fast XIP execution.

For engineers reviewing the S29GL01GT12DHM023 datasheet, S29GL01GT12DHM023 pinout, S29GL01GT12DHM023 application, or S29GL01GT12DHM023 equivalent, key selection criteria include sector erase granularity (128 KB), OTP array size (2048 bytes with four lockable regions), and support for Versatile I/O (1.65 V to VCC).

Technical Context

This device implements an asynchronous parallel interface with byte/word boundary addressing and supports both 8-bit and 16-bit data transfers. Its embedded algorithm controller (EAC) manages program, erase, suspend/resume, and automatic ECC operations without host intervention.

The flash array is organized into uniform 128-KB sectors and includes a dedicated 2048-byte one-time programmable (OTP) array with four lockable sectors (SSR0–SSR3), where SSR0 is factory-locked and SSR3 supports password-based read protection.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density1 Gb (128 MB) - sufficient for full firmware images and boot code in resource-constrained embedded hosts
Random Access Time100 ns at –40°C to +85°C - enables real-time XIP execution without CPU stall penalties
Page Access Time15 ns - accelerates sequential instruction fetch during burst reads
Programming Buffer512 bytes - reduces effective programming time by batching up to 256 words per operation
ECC SupportInternal hardware single-bit error correction - maintains data integrity without software overhead
Endurance100,000 program/erase cycles - suitable for field-upgradable firmware with frequent reprogramming
Data Retention20 years - ensures long-term reliability in unpowered storage scenarios

Pinout & Package

Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-142AB footprint.

Pin/TerminalCircuit RoleDesign Meaning
A0–A23Address Inputs24-bit address bus supporting full 128 MB address space with byte/word alignment
DQ0–DQ15Data I/O16-bit bidirectional data bus; operates in ×8 or ×16 mode via BYTE# control
CE#, OE#, WE#Chip Enable, Output Enable, Write EnableStandard asynchronous control signals enabling non-multiplexed parallel interface timing
RY/BY#Ready/Busy OutputOpen-drain status indicator for polling embedded operations (program/erase)
VCC, VIO, GNDPower SuppliesVCC = 2.7–3.6 V core; VIO = 1.65–VCC versatile I/O voltage; separate ground pins reduce noise coupling

Key Features

FeatureDesign Value
Versatile I/O Voltage RangeVIO supports 1.65 V to VCC - simplifies interface to mixed-voltage SoCs without level shifters
Uniform Sector Architecture128-KB sectors - enables deterministic erase scheduling and wear leveling in bootloader partitions
OTP Array with Locking2048-byte OTP with four lockable regions (SSR0–SSR3) - secures calibration data, keys, and device identity
CFI ComplianceCommon Flash Interface parameter table - enables auto-detection and driver portability across flash vendors

Applications

Industrial PLC Firmware StorageAutomotive ADAS Boot Memory

Use Scenario: Storing boot firmware and configuration data in programmable logic controllers deployed in factory automation environments.

IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable instruction fetch with ≤100 ns latency.

Use Value: Enables deterministic boot timing and eliminates external RAM initialization delays during cold start.

Use Scenario: Holding safety-critical boot code and sensor calibration tables in automotive ADAS ECUs certified to AEC-Q100 Grade 2 (–40°C to +105°C).

IC Role / Device Role / Timing Role: Automotive-grade parallel NOR flash with hardware ECC and OTP locking for secure firmware integrity.

Use Value: Meets ISO 26262 ASIL-B requirements through built-in single-bit ECC and locked SSR3 password protection.

Medical Imaging System BIOSTelecom Base Station Configuration

Use Scenario: Hosting BIOS and FPGA configuration bitstreams in portable ultrasound and MRI subsystems requiring 20-year data retention.

IC Role / Device Role / Timing Role: High-reliability boot memory with 20-year retention and 100,000-cycle endurance.

Use Value: Eliminates field replacement due to data corruption over product lifetime in regulated medical devices.

Use Scenario: Storing FPGA configuration, radio stack parameters, and fail-safe recovery images in 5G base station remote radio units (RRUs).

IC Role / Device Role / Timing Role: Parallel flash with suspend/resume capability for background firmware updates without service interruption.

Use Value: Allows seamless in-service updates via sector-by-sector erase while maintaining active RF operation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S29GL01GT12DHM020Same die, identical specs, but rated for Industrial Plus (–40°C to +105°C) temperature rangeSupports higher ambient operating temperatures in enclosed telecom or power electronics enclosuresSelect when thermal margin exceeds +85°C and AEC-Q100 compliance is not required
S29GL01GT12DHM022Same die, identical specs, but packaged in 64-ball LAE fortified BGA (9 mm × 9 mm)Enables PCB area reduction and improved thermal dissipation in space-constrained modulesSelect when board layout requires BGA footprint and mechanical robustness under vibration

Compared with S29GL01GT12DHM020 and S29GL01GT12DHM022, the S29GL01GT12DHM023 offers identical electrical performance and feature set in a 56-pin TSOP package optimized for manual assembly, legacy socket compatibility, and thermal testing accessibility.

Availability

S29GL01GT12DHM023 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system BIOS requiring stable component supply across extended product lifecycles.

Supply support for S29GL01GT12DHM023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and non-volatile memory solutions for industrial and mission-critical applications.

The GL-T family targets high-reliability embedded systems needing fast XIP execution, deterministic erase behavior, and long-term data integrity-especially where firmware security and field upgradeability are essential.

FAQ

What is the purpose of the SSR0–SSR3 OTP regions in S29GL01GT12DHM023?

SSR0–SSR3 are four independent 512-byte sectors within the 2048-byte OTP array. SSR0 is permanently locked at factory; SSR1 and SSR2 support volatile locking; SSR3 adds password-based read protection. They store immutable calibration data, cryptographic keys, and device-specific identifiers without risk of overwrite.

Does S29GL01GT12DHM023 support both ×8 and ×16 data bus modes?

Yes. The device automatically detects bus width via the BYTE# pin state at power-on reset. When BYTE# is low, it operates in ×16 mode using DQ0–DQ15; when high, it operates in ×8 mode using DQ0–DQ7 only. Address lines remain unchanged between modes.

How does the Versatile I/O (VIO) feature benefit system design?

VIO allows independent I/O voltage ranging from 1.65 V to VCC, decoupling interface logic levels from core supply. This eliminates external level shifters when interfacing with 1.8 V or 2.5 V SoCs while maintaining full 3.0 V core performance and reliability.

Can S29GL01GT12DHM023 be used in AEC-Q100 qualified automotive applications?

No. S29GL01GT12DHM023 is specified for Industrial grade (–40°C to +85°C). For automotive use, select variants like S29GL01GT12DHM021 (AEC-Q100 Grade 3) or S29GL01GT12DHM022 (AEC-Q100 Grade 2), which undergo additional qualification testing and include automotive-specific documentation.

S29GL01GT12DHM023 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
GL-T
Package/Case:
64-LBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
1Gbit
Memory Organization:
128M x 8
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
60ns
Access Time:
120 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
64-FBGA (9x9)

S29GL01GT12DHM023 FAQ

1.How can I place an order for S29GL01GT12DHM023 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL01GT12DHM023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL01GT12DHM023 reliable?

The price and inventory of S29GL01GT12DHM023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GT12DHM023 is usually 5 days.

3.What payment methods are accepted for S29GL01GT12DHM023?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GT12DHM023 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL01GT12DHM023?

S29GL01GT12DHM023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL01GT12DHM023 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL01GT12DHM023?

For technical support, including S29GL01GT12DHM023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GT12DHM023 requirements.

6.How does Aetrix verify that S29GL01GT12DHM023 is sourced from the original manufacturer or authorized distributors?

All S29GL01GT12DHM023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GT12DHM023 meets industry standards.

7.What is the process for return or replacement of S29GL01GT12DHM023?

All S29GL01GT12DHM023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GT12DHM023, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL01GT12DHM023 part is unused and in its original packaging.

Return procedure for S29GL01GT12DHM023:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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