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Infineon Technologies S29GL01GT12DHN010
- Part No.:
- S29GL01GT12DHN010
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL01GT12DHN010.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:461
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Product details
Overview
S29GL01GT12DHN010 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, hardware ECC for single-bit correction, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C). It is used in boot code storage for network routers requiring fast XIP execution and reliable firmware retention.
For engineers reviewing the S29GL01GT12DHN010 datasheet, S29GL01GT12DHN010 pinout, S29GL01GT12DHN010 application, or S29GL01GT12DHN010 equivalent, key selection factors include its 100,000 program/erase cycles, OTP array with four lockable SSR regions, CFI-compliant interface, and support for suspend/resume during embedded operations.
Technical Context
This device implements an asynchronous parallel interface with ×8/×16 data bus configuration and byte/word boundary addressing. Its embedded algorithm controller (EAC) manages program, erase, and status monitoring autonomously without host intervention.
The internal hardware ECC operates transparently during read operations, correcting single-bit errors in real time. Sector protection uses both volatile (lock bits) and non-volatile (ASP) methods, while the 2048-byte OTP array includes factory-locked SSR0 and password-protected SSR3 for secure configuration storage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 1 Gb (128 MB) - sufficient for full boot image + firmware + parameter storage in edge gateway applications |
| Access time (tACC) | 100 ns at –40°C to +85°C - enables direct XIP execution from flash without external cache penalty |
| Page access time (tPACC) | 15 ns - accelerates sequential instruction fetch in burst-read scenarios |
| Write buffer size | 512 bytes - reduces average programming time by batching up to 256 words per command |
| ECC capability | Single-bit error correction - ensures data integrity over 20-year retention without software overhead |
| Endurance | 100,000 program/erase cycles - supports field-upgradable firmware with frequent OTA updates |
| Operating voltage | VCC = 2.7 V to 3.6 V, VIO = 1.65 V to VCC - allows interoperability with 1.8 V/3.3 V I/O domains |
Pinout & Package
Package: 56-pin TSOP (Type I, standard thickness), JEDEC MO-141AC compliant, body size 18.4 mm × 10.16 mm × 1.0 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address inputs | 22-bit address bus supporting full 128 MB linear space; A0 selects byte/word mode when configured |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional bus; operates in ×8 or ×16 mode per configuration register setting |
| CE# | Chip enable | Active-low enable controlling device selection; tCE = 100 ns max defines minimum chip select assertion window |
| OE# | Output enable | Active-low control for data output gating; tOE = 25 ns max governs read data hold timing |
| WE# | Write enable | Active-low signal initiating write/program commands; synchronized with address and data setup |
| RY/BY# | Ready/Busy indicator | Open-drain output signaling active embedded operation; used for polling or interrupt-driven status management |
| RESET# | Hardware reset | Active-low input forcing device into reset state; required after power-on or to abort ongoing operations |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O voltage range | VIO supports 1.65 V to VCC - eliminates level shifters when interfacing with mixed-voltage SoCs |
| Asynchronous 32-byte page read | Enables burst instruction fetch without wait states in microcontroller boot loaders |
| Separate 2048-byte OTP array | Four lockable SSR regions allow secure storage of keys, calibration data, and device identity with graded access control |
| Suspend/Resume for program & erase | Permits high-priority read access during long-duration erase operations - critical for real-time systems |
| Common Flash Interface (CFI) | Standardized parameter table enables automatic driver detection and configuration in Linux MTD and U-Boot environments |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot loader, RTOS kernel, and safety-critical application code in programmable logic controllers with extended lifecycle requirements. IC Role / Device Role / Timing Role: Primary non-volatile boot memory providing XIP-capable instruction fetch with deterministic 100 ns latency. Use Value: 20-year data retention and 100,000 erase cycles ensure firmware integrity across 15+ year deployments without replacement. | Use Scenario: Holding certified boot firmware and sensor calibration tables in camera/EPS ECUs requiring AEC-Q100 Grade 2 compliance. IC Role / Device Role / Timing Role: Secure, high-reliability flash memory supporting dual-bank update schemes and hardware ECC for ASIL-B functional safety. Use Value: OTP SSR3 password protection and factory-locked SSR0 prevent unauthorized firmware modification during vehicle service. |
| Network Edge Router Boot Code | Medical Imaging System Configuration |
Use Scenario: Hosting bootloader, Linux kernel, and FPGA configuration bitstreams in carrier-grade edge routers with hot-swap power design. IC Role / Device Role / Timing Role: Parallel NOR flash enabling zero-wait-state CPU boot from reset vector address with CE#/OE# timing optimized for MIPS/ARM bus interfaces. Use Value: 15 ns page access time accelerates initial instruction fetch, reducing boot time by ~18% vs. legacy 110 ns devices. | Use Scenario: Storing DICOM metadata templates, gamma correction LUTs, and regulatory certification flags in FDA-cleared diagnostic imaging equipment. IC Role / Device Role / Timing Role: Trusted configuration store with hardware ECC and sector-level write protection to meet IEC 62304 software safety classification. Use Value: CFI parameter table allows automated validation of memory geometry and command set during manufacturing test and field calibration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GT12DHV10 | Same die, 64-ball LAE BGA (9 mm × 9 mm); no TSOP package | Preferred for space-constrained PCB layouts where board area is limited | Select when footprint reduction outweighs TSOP's ease of rework and thermal performance |
| MX29GL128FPTI-90G | 128 MB (1 Gb), 90 ns tACC, no built-in ECC, no OTP array | Lacks hardware ECC and secure OTP - requires external error handling and key management | Choose only if cost sensitivity dominates reliability and security requirements |
Compared with S29GL01GT12DHN010, the HV10 variant offers identical functionality in smaller BGA packaging but sacrifices TSOP reworkability, while the MX29GL128F lacks integrated ECC and OTP-increasing firmware validation burden and reducing security assurance in regulated systems.
Availability
S29GL01GT12DHN010 is available at Aetrix Electronics and suitable for industrial automation, automotive ECU boot, network infrastructure, and medical device firmware storage requiring stable component supply across multi-year production programs.
Supply support for S29GL01GT12DHN010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global R&D centers and ISO/TS 16949-certified wafer fabs.
The GL-T family targets high-reliability embedded systems needing deterministic boot performance, long-term data retention, and hardware-enforced security - especially where firmware integrity and field upgradeability are mission-critical.
FAQ
Does S29GL01GT12DHN010 support both ×8 and ×16 data bus modes?
Yes. The device automatically detects bus width via A0 pin state at power-on reset: low for ×8 mode (DQ0–DQ7 active), high for ×16 mode (DQ0–DQ15 active). Configuration is latched and remains fixed until next reset; no runtime switching is supported.
What is the function of the SSR0–SSR3 regions in the OTP array?
SSR0–SSR3 are four 512-byte sectors within the 2048-byte OTP array. SSR0 is permanently locked at factory and stores device-specific identifiers. SSR1–SSR2 are user-lockable for calibration data or MAC addresses. SSR3 supports password-based read protection for sensitive keys or certificates.
How does the hardware ECC operate during read cycles?
The ECC logic runs transparently on every read access: syndrome calculation occurs in parallel with data output, and single-bit errors are corrected before data reaches the bus. No software intervention or additional timing overhead is required; uncorrectable multi-bit errors trigger status register flag ERR.
Can S29GL01GT12DHN010 be used in automotive applications requiring AEC-Q100 qualification?
No. S29GL01GT12DHN010 is specified for industrial grade (–40°C to +85°C) only. For automotive use, Infineon offers S29GL01GT12DHV10 (AEC-Q100 Grade 2, –40°C to +105°C) and S29GL01GT12DHI10 (Grade 3), both in BGA packages with identical electrical specs and OTP/ECC features.
S29GL01GT12DHN010 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 120 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL01GT12DHN010 FAQ
1.How can I place an order for S29GL01GT12DHN010 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GT12DHN010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GT12DHN010 reliable?
The price and inventory of S29GL01GT12DHN010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GT12DHN010 is usually 5 days.
3.What payment methods are accepted for S29GL01GT12DHN010?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GT12DHN010 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GT12DHN010?
S29GL01GT12DHN010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GT12DHN010 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GT12DHN010?
For technical support, including S29GL01GT12DHN010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GT12DHN010 requirements.
6.How does Aetrix verify that S29GL01GT12DHN010 is sourced from the original manufacturer or authorized distributors?
All S29GL01GT12DHN010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GT12DHN010 meets industry standards.
7.What is the process for return or replacement of S29GL01GT12DHN010?
All S29GL01GT12DHN010 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GT12DHN010, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GT12DHN010 part is unused and in its original packaging.
Return procedure for S29GL01GT12DHN010:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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