My Inquiry
My Account
Infineon Technologies S29GL01GT12DHN013
- Part No.:
- S29GL01GT12DHN013
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL01GT12DHN013.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,209
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S29GL01GT12DHN013 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC with 45-nm MIRRORBIT™ technology, single 2.7–3.6 V supply, 100 ns random access time, and 15 ns page access time. It integrates hardware ECC for single-bit error correction, supports 512-byte buffer programming, and operates across industrial temperature range (–40°C to +85°C) in a 56-pin TSOP package - used for boot code storage and firmware execution in embedded controllers.
For engineers reviewing the S29GL01GT12DHN013 datasheet, S29GL01GT12DHN013 pinout, S29GL01GT12DHN013 application, or S29GL01GT12DHN013 equivalent, key selection criteria include asynchronous parallel interface timing, sector erase granularity (128 KB), OTP array configuration (SSR0–SSR3), CFI compliance, and industrial-grade thermal performance.
Technical Context
This device implements an asynchronous parallel interface with ×8/×16 data bus support and byte/word boundary addressing. Its embedded algorithm controller (EAC) manages program, erase, suspend/resume, and automatic ECC correction without host intervention.
The memory array is organized into uniform 128-KB sectors with advanced sector protection (ASP), including volatile and non-volatile lock modes per sector. The separate 2048-byte one-time programmable (OTP) array contains four lockable regions (SSR0–SSR3), where SSR0 is factory-locked and SSR3 supports password-based read protection.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 1 Gb (128 MB) - supports full firmware images and multi-application storage in resource-constrained embedded systems |
| Access time (tACC) | 100 ns at –40°C to +85°C - enables fast XIP execution for real-time boot and interrupt response |
| Page access time (tPACC) | 15 ns - accelerates sequential instruction fetch during burst reads |
| Programming buffer | 512 bytes - reduces effective programming time by up to 4× vs. single-word writes |
| ECC capability | Single-bit error correction via internal hardware - eliminates need for external ECC logic in safety-critical designs |
| Endurance & retention | 100,000 program/erase cycles and 20-year data retention - validated for long-lifecycle industrial deployments |
| Operating voltage | VCC = 2.7–3.6 V, VIO = 1.65–VCC - allows interfacing with mixed-voltage SoCs and legacy 3.3 V peripherals |
Pinout & Package
Package: 56-pin Thin Small Outline Package (TSOP), standard JEDEC MO-141, 20.0 mm × 10.16 mm × 1.2 mm body height, lead-free and RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A20 | Address inputs | 21-bit address bus supporting full 128 MB linear space; A0 selects byte/word mode when configured for ×8/×16 operation |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; operates in ×8 mode (DQ0–DQ7) or ×16 mode (DQ0–DQ15) per configuration |
| CE# | Chip enable | Active-low chip select; controls device power state and enables read/write operations only when asserted |
| OE# | Output enable | Active-low control for data bus output drivers; decouples read data timing from address setup |
| WE# | Write enable | Active-low strobe for write cycles; latches command sequences and initiates embedded algorithms |
| RY/BY# | Ready/Busy indicator | Open-drain output signaling active program/erase status; used for polling or interrupt-driven operation |
| RESET# | Hardware reset | Asynchronous active-low input that forces device into reset state, clearing status registers and halting ongoing operations |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O voltage (VIO) | Supports 1.65 V to VCC - enables direct connection to 1.8 V, 2.5 V, or 3.3 V logic without level shifters |
| Uniform 128-KB sectors | Enables fine-grained firmware updates and secure partitioning of boot, kernel, and application code |
| Separate 2048-byte OTP array | Four lockable regions (SSR0–SSR3) allow secure storage of keys, calibration data, and device identity with factory-lock and password protection |
| Common Flash Interface (CFI) | Standardized parameter table accessible via read commands - enables OS-agnostic flash management and field-upgrade compatibility |
| Suspend/Resume for program/erase | Allows host to pause background operations for high-priority reads - critical for real-time interrupt latency control |
Applications
| Industrial PLC Firmware Storage | Automotive Instrument Cluster Boot Memory |
|---|---|
Use Scenario: Storing boot loader, RTOS kernel, and application firmware in programmable logic controllers with field update capability. IC Role / Device Role / Timing Role: Primary non-volatile boot memory providing XIP-capable instruction fetch and deterministic 100 ns read latency. Use Value: Uniform 128-KB sector erase enables atomic firmware patching without runtime corruption risk; OTP array secures device-specific calibration parameters. | Use Scenario: Holding boot code and display graphics assets in automotive digital instrument clusters requiring AEC-Q100 grade 3 compliance. IC Role / Device Role / Timing Role: High-reliability parallel NOR flash operating at –40°C to +85°C with hardware ECC for ASIL-B–aligned data integrity. Use Value: 20-year data retention and 100,000-cycle endurance meet automotive lifecycle requirements; CFI support simplifies bootloader portability across ECU platforms. |
| Medical Imaging System Configuration | Telecom Base Station Control Plane |
Use Scenario: Storing FPGA configuration bitstreams, sensor calibration tables, and regulatory compliance data in portable ultrasound devices. IC Role / Device Role / Timing Role: Secure, tamper-resistant storage element with password-protected SSR3 region for HIPAA-sensitive configuration data. Use Value: Factory-locked SSR0 ensures immutable boot ROM; hardware ECC prevents silent data corruption in radiation-prone environments. | Use Scenario: Hosting control plane firmware and protocol stack binaries in carrier-grade 5G base station radios with hot-swap maintenance capability. IC Role / Device Role / Timing Role: Dual-mode (×8/×16) parallel interface flash enabling high-throughput firmware load during system initialization and field upgrades. Use Value: 512-byte buffer programming cuts firmware update time by >70% vs. legacy NOR; suspend/resume avoids service interruption during critical read requests. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GT12DHV013 | Same die and timing, but packaged in 64-ball LAE BGA (9 mm × 9 mm) instead of 56-pin TSOP | Used where board space is constrained and PCB routing favors BGA over gull-wing leads | Select for compact, high-density layouts; requires rework-capable assembly process |
| S29GL01GT11DHI013 | Identical functionality and package, but rated for industrial-plus temperature (–40°C to +105°C) instead of standard industrial | Deployed in under-hood automotive modules or industrial drives with elevated ambient temperatures | Select when extended thermal margin is required; otherwise identical drop-in replacement |
Compared with S29GL01GT12DHN013, the BGA variant offers footprint reduction at the cost of solder joint reliability verification, while the +105°C version trades no performance loss for broader thermal deployment - both retain identical command set, CFI structure, and OTP layout.
Availability
S29GL01GT12DHN013 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive instrument cluster boot memory, and medical imaging system configuration requiring stable component supply across multi-year production cycles.
Supply support for S29GL01GT12DHN013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and non-volatile memory solutions, with global R&D and manufacturing infrastructure.
The GL-T family targets high-reliability embedded systems needing fast XIP execution and robust firmware storage - designed specifically for industrial automation, automotive infotainment, and telecom infrastructure where data integrity and long-term availability are critical.
FAQ
What is the difference between S29GL01GT12DHN013 and S29GL01GT12DHV013?
S29GL01GT12DHN013 uses a 56-pin TSOP package, while S29GL01GT12DHV013 uses a 64-ball LAE BGA (9 mm × 9 mm). Both share identical electrical specifications, timing, command set, and OTP architecture. The BGA variant reduces PCB area and improves signal integrity at higher frequencies but requires more complex assembly and rework processes.
Does this device support x16 data bus operation?
Yes, S29GL01GT12DHN013 supports both ×8 and ×16 data bus configurations. The mode is selected via hardware pin configuration (BYTE# input) and software command. In ×16 mode, DQ0–DQ15 transfer 16 bits per cycle; in ×8 mode, only DQ0–DQ7 are active with DQ8–DQ15 unused.
How is hardware ECC implemented and verified?
Hardware ECC is fully integrated and automatic: single-bit errors are corrected on-the-fly during read operations using internal syndrome generation and correction logic. No host software intervention is required. Correction status is reported via the Status Register (bit 7 = ECCERR), and uncorrectable multi-bit errors trigger a status flag without data corruption.
Can the OTP array be reprogrammed after initial programming?
No. The 2048-byte OTP array (SSR0–SSR3) is permanently programmable once written. SSR0 is factory-locked and cannot be modified; SSR1 and SSR2 can be locked/unlocked via command; SSR3 supports password-protected read access but remains write-once. All OTP regions are immune to erase commands.
S29GL01GT12DHN013 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 120 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL01GT12DHN013 FAQ
1.How can I place an order for S29GL01GT12DHN013 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GT12DHN013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GT12DHN013 reliable?
The price and inventory of S29GL01GT12DHN013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GT12DHN013 is usually 5 days.
3.What payment methods are accepted for S29GL01GT12DHN013?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GT12DHN013 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GT12DHN013?
S29GL01GT12DHN013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GT12DHN013 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GT12DHN013?
For technical support, including S29GL01GT12DHN013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GT12DHN013 requirements.
6.How does Aetrix verify that S29GL01GT12DHN013 is sourced from the original manufacturer or authorized distributors?
All S29GL01GT12DHN013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GT12DHN013 meets industry standards.
7.What is the process for return or replacement of S29GL01GT12DHN013?
All S29GL01GT12DHN013 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GT12DHN013, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GT12DHN013 part is unused and in its original packaging.
Return procedure for S29GL01GT12DHN013:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL01GT12DHN013 Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
