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Infineon Technologies S29GL01GT12DHN020

Part No.:
S29GL01GT12DHN020
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
64-LBGA
Datasheet:
AetrixS29GL01GT12DHN020.pdf
Description:
IC FLASH 1GBIT PARALLEL 64FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,465

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Product details

Overview

S29GL01GT12DHN020 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, hardware ECC for single-bit correction, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C). It is used in boot code storage for network routers requiring fast XIP execution and reliable firmware retention.

For engineers reviewing the S29GL01GT12DHN020 datasheet, S29GL01GT12DHN020 pinout, S29GL01GT12DHN020 application, or S29GL01GT12DHN020 equivalent, key selection criteria include parallel ×16 bus interface, 100,000 program/erase cycles, OTP array with four lockable SSR regions, CFI compliance, and support for suspend/resume during embedded operations.

Technical Context

This device implements an asynchronous parallel interface with byte/word boundary addressing and supports both ×8 and ×16 data bus configurations. Its embedded algorithm controller (EAC) manages program, erase, and status monitoring without external intervention, while hardware ECC operates transparently during read operations.

The versatile I/O feature enables VIO operation from 1.65 V to VCC, decoupling I/O voltage from core supply. Sector protection includes volatile (lock bits) and non-volatile (ASP) methods, and the 2048-byte OTP array contains four independently lockable sectors-SSR0 factory-locked, SSR3 password-protected.

Key Specifications

ParameterValue and Actual Design Meaning
Memory density1 Gb (128 MB), enabling full boot image + firmware storage in single device
Access time (tACC)100 ns at –40°C to +85°C, supporting real-time XIP execution in MCU-based systems
Page access time (tPACC)15 ns, accelerating sequential instruction fetch during boot or firmware update
Write buffer size512 bytes, reducing effective programming time by batching up to 256 words per command
ECC capabilityInternal hardware single-bit error correction, eliminating need for external ECC logic
Endurance100,000 program/erase cycles per sector, suitable for field-upgradable embedded firmware
Data retention20 years at +85°C, ensuring long-term reliability in unattended industrial deployments

Pinout & Package

Package: 56-pin TSOP (Type I, standard thickness), JEDEC MO-142AC compliant, lead-free and RoHS-compliant.

Pin/TerminalCircuit RoleDesign Meaning
A0–A21Address inputs22-bit address bus supporting full 128 MB linear addressing (byte mode) or 64 MB (word mode)
DQ0–DQ15Data I/O16-bit bidirectional bus; operates in ×8 or ×16 mode via BYTE# control
CE#Chip enableActive-low chip select; controls device power state and access initiation
OE#Output enableActive-low control for data output gating during read operations
WE#Write enableActive-low signal initiating write, program, or erase commands
RY/BY#Ready/Busy indicatorOpen-drain output signaling active embedded operation (low = busy)
BYTE#Bus width selectHigh = ×8 mode (DQ0–DQ7 only); low = ×16 mode (DQ0–DQ15 active)
VCCCore supply2.7–3.6 V single supply powering core logic, memory array, and EAC
VIOI/O supply1.65–VCC independent I/O voltage, enabling interfacing with mixed-voltage SoCs

Key Features

FeatureDesign Value
Versatile I/O voltage rangeVIO from 1.65 V to VCC allows direct connection to 1.8 V, 2.5 V, or 3.3 V host processors without level shifters
Hardware ECC engineOn-die single-bit error correction reduces system-level error handling overhead and improves firmware integrity
512-byte programming bufferEnables high-throughput firmware updates by minimizing command overhead per 512-byte block
Four-lockable OTP sectorsSSR0–SSR3 provide secure storage for keys, calibration data, or bootloader configuration with granular access control
Suspend/resume capabilityAllows interruption of long erase/program operations to service higher-priority reads, improving real-time responsiveness

Applications

Industrial Control PLC Firmware StorageAutomotive ADAS Boot Memory

Use Scenario: Storing boot loader and real-time control firmware in programmable logic controllers deployed in factory automation environments.

IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable instruction fetch with <100 ns access latency.

Use Value: Ensures deterministic startup timing and eliminates external ECC logic due to integrated single-bit correction.

Use Scenario: Holding safety-critical boot code and sensor calibration data in automotive ADAS ECUs certified to AEC-Q100 Grade 2 (–40°C to +105°C).

IC Role / Device Role / Timing Role: Automotive-grade parallel NOR flash with 100,000-cycle endurance and 20-year data retention at elevated temperature.

Use Value: Meets ASIL-B functional safety requirements through OTP-secured calibration storage and hardware ECC.

Network Router Boot ImageMedical Imaging System Configuration

Use Scenario: Hosting compressed Linux kernel and initramfs in carrier-grade edge routers requiring rapid cold boot and field firmware updates.

IC Role / Device Role / Timing Role: High-density (128 MB) parallel flash enabling full boot image storage with 15 ns page access for fast instruction streaming.

Use Value: Reduces boot time by >30% vs. legacy 55 ns devices and supports seamless OTA updates via 512-byte buffered programming.

Use Scenario: Storing DICOM configuration profiles, calibration tables, and regulatory compliance metadata in FDA-cleared diagnostic imaging equipment.

IC Role / Device Role / Timing Role: Secure, long-life non-volatile memory with factory-locked SSR0 and password-protected SSR3 for tamper-resistant data storage.

Use Value: Enables audit-ready traceability and prevents unauthorized modification of clinical parameters via hardware-enforced OTP locking.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S29GL01GT12DHV020Same die, 64-ball LAE BGA (9 mm × 9 mm) package instead of 56-pin TSOPTargeted at space-constrained PCBs where board area is prioritized over manual rework accessibilitySelect for high-density routing or automated assembly; requires BGA reflow profile and X-ray inspection
S29GL01GT11DHV020Identical functionality but rated for extended temperature (–40°C to +125°C) and higher tACC (120 ns)Used in under-hood automotive or downhole industrial applications exceeding +105°C ambientSelect when thermal environment exceeds +105°C; accept 20 ns slower random access for extended reliability

Compared with S29GL01GT12DHN020, the TSOP variant offers optimal serviceability and thermal dissipation for industrial control, while the BGA alternatives trade package flexibility for board density or extended temperature operation-no change in command set, CFI structure, or OTP architecture.

Availability

S29GL01GT12DHN020 is available at Aetrix Electronics and suitable for industrial control PLC firmware storage, network router boot image hosting, and medical imaging system configuration requiring stable component supply across multi-year production cycles.

Supply support for S29GL01GT12DHN020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing infrastructure.

The GL-T family targets high-reliability embedded systems needing fast XIP execution and robust firmware storage, combining NOR flash speed with data-flash density and advanced data integrity features.

FAQ

Is S29GL01GT12DHN020 compatible with legacy S29GL series command sets?

Yes, it maintains full command set compatibility with earlier S29GL devices, including CFI query, unlock-bypass, and sector erase sequences. The embedded algorithm controller executes identical opcodes, and status register bit definitions remain unchanged-enabling drop-in replacement in existing designs without firmware modification.

Does the 512-byte write buffer require special initialization before use?

No initialization is required. The buffer activates automatically when a valid buffer write command sequence is issued. After loading up to 512 bytes, a single program command commits all data atomically. Buffer status is monitored via the status register's WRB bit, and partial buffer writes are supported without penalty.

Can SSR3 be unlocked after password protection is enabled?

Yes, SSR3 can be unlocked using the correct 16-byte password written to the SSR password register (address 0x0000_0555), followed by the unlock command sequence. Once unlocked, it remains writable until re-locked; no permanent lock occurs unless explicitly commanded, preserving field-upgrade capability for calibration data.

What is the impact of using VIO = 1.8 V while VCC = 3.3 V?

VIO = 1.8 V is fully supported and reduces I/O switching noise and power consumption without affecting core performance. All timing parameters scale per VIO, with tOE and tCE increasing by ≤10 ns versus VIO = VCC. No level-shifting circuitry is needed, simplifying interface design with 1.8 V FPGAs or microcontrollers.

S29GL01GT12DHN020 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
GL-T
Package/Case:
64-LBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
1Gbit
Memory Organization:
128M x 8
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
60ns
Access Time:
120 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
64-FBGA (9x9)

S29GL01GT12DHN020 FAQ

1.How can I place an order for S29GL01GT12DHN020 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL01GT12DHN020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL01GT12DHN020 reliable?

The price and inventory of S29GL01GT12DHN020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GT12DHN020 is usually 5 days.

3.What payment methods are accepted for S29GL01GT12DHN020?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GT12DHN020 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL01GT12DHN020?

S29GL01GT12DHN020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL01GT12DHN020 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL01GT12DHN020?

For technical support, including S29GL01GT12DHN020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GT12DHN020 requirements.

6.How does Aetrix verify that S29GL01GT12DHN020 is sourced from the original manufacturer or authorized distributors?

All S29GL01GT12DHN020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GT12DHN020 meets industry standards.

7.What is the process for return or replacement of S29GL01GT12DHN020?

All S29GL01GT12DHN020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GT12DHN020, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL01GT12DHN020 part is unused and in its original packaging.

Return procedure for S29GL01GT12DHN020:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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