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Infineon Technologies S29GL01GT12DHN023
- Part No.:
- S29GL01GT12DHN023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL01GT12DHN023.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,231
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Product details
Overview
S29GL01GT12DHN023 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC with MIRRORBIT™ technology, 45-nm process node, and 3.0 V core supply. It supports ×8/×16 data bus, 128-KB uniform sectors, 512-byte programming buffer, and hardware ECC for single-bit error correction. Used in boot code storage for industrial microcontrollers requiring fast random read (100 ns) and reliable non-volatile retention.
For engineers reviewing the S29GL01GT12DHN023 datasheet, S29GL01GT12DHN023 pinout, S29GL01GT12DHN023 application, or S29GL01GT12DHN023 equivalent, key selection criteria include sector erase granularity, Versatile I/O voltage range (1.65 V to VCC), AEC-Q100 grade 2 qualification (–40°C to +105°C), and CFI-compliant software interface.
Technical Context
This device implements an asynchronous parallel interface with dedicated CE#, OE#, and WE# control lines, supporting byte/word boundary addressing and page-mode read (32-byte pages). Its embedded algorithm controller (EAC) manages program, erase, suspend/resume, and status reporting via Status Register, Data Polling, or RY/BY# pin.
The architecture integrates a 2048-byte one-time programmable (OTP) array with four lockable SSR regions (SSR0–SSR3), where SSR0 is factory-locked and SSR3 supports password-based read protection. Internal hardware ECC operates transparently during read operations without software overhead.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 1 Gb (128 MB) - sufficient for full firmware images and configuration tables in industrial controllers |
| Random access time (tACC) | 100 ns at –40°C to +85°C - enables direct XIP execution from flash without external cache |
| Page access time (tPACC) | 15 ns - accelerates sequential instruction fetch in boot loader routines |
| Programming buffer size | 512 bytes - reduces effective programming time by batching writes per command cycle |
| ECC capability | Single-bit error correction - maintains data integrity over 20-year retention without host-side correction logic |
| Endurance | 100,000 program/erase cycles - supports field firmware updates across product lifecycle |
| Operating temperature | –40°C to +105°C (AEC-Q100 Grade 2) - qualified for under-hood automotive ECUs and industrial HMIs |
Pinout & Package
Package: 64-ball LAE fortified BGA (9 mm × 9 mm, 0.8 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 | Address inputs | 24-bit address bus supporting full 128 MB linear space with byte/word alignment |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional bus; configurable as ×8 or ×16 via BYTE# pin |
| CE# | Chip enable | Active-low chip select; controls device power state and command latching |
| OE# | Output enable | Active-low gate for data bus output; used in read timing control |
| WE# | Write enable | Active-low strobe for write/program/erase command initiation |
| RY/BY# | Ready/Busy indicator | Open-drain output signaling internal operation completion or suspension |
| VCC | Core supply | 3.0 V ±10% supply powering logic and memory array; no separate VPP required |
| VIO | I/O supply | 1.65 V to VCC - enables interface compatibility with 1.8 V or 3.3 V host processors |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O voltage range | VIO supports 1.65 V to VCC - eliminates level shifters when interfacing with mixed-voltage SoCs |
| Hardware ECC engine | On-the-fly single-bit correction - removes need for external ECC logic or software overhead in safety-critical boot paths |
| 2048-byte OTP array | Four lockable SSR regions including factory-locked SSR0 and password-protected SSR3 - secures bootloader keys and calibration data |
| Suspend/Resume commands | Interrupts active program/erase to service high-priority reads - essential for real-time OS environments |
| Common Flash Interface (CFI) | Standardized parameter table accessible via read commands - enables generic flash drivers across toolchains and OSes |
Applications
| Automotive Engine Control Unit (ECU) | Industrial Programmable Logic Controller (PLC) |
|---|---|
Use Scenario: Storing calibrated fuel injection maps and real-time diagnostic firmware in AEC-Q100 Grade 2 ECU modules. IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable instruction storage with deterministic 100 ns read latency. Use Value: Meets automotive thermal requirements (–40°C to +105°C) and supports 100,000-cycle field updates for regulatory compliance patches. | Use Scenario: Holding ladder logic runtime images and I/O configuration tables in DIN-rail mounted PLCs operating in factory environments. IC Role / Device Role / Timing Role: Parallel NOR flash serving as primary firmware repository with sector-level erase isolation for modular updates. Use Value: Uniform 128-KB sectors allow independent update of communication stacks without corrupting control logic partitions. |
| Medical Imaging System Boot ROM | Railway Signaling Controller Firmware Storage |
Use Scenario: Hosting certified boot firmware and DICOM protocol stacks in FDA-regulated MRI subsystem controllers. IC Role / Device Role / Timing Role: CFI-compliant flash enabling validated, vendor-agnostic flash driver integration in safety-certified RTOS. Use Value: Hardware ECC ensures bit-error resilience over 20-year data retention-critical for long-lifecycle medical devices. | Use Scenario: Storing EN 5012x-certified safety firmware and trackside sensor calibration data in wayside signaling cabinets. IC Role / Device Role / Timing Role: Industrial-grade (–40°C to +85°C) parallel flash with SSR-based OTP for secure bootloader signing keys. Use Value: Factory-locked SSR0 prevents unauthorized modification of cryptographic root-of-trust elements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GT12DHV023 | Same die, 64-ball LAA BGA (13 mm × 11 mm) package - larger footprint, higher thermal mass | Preferred for high-reliability industrial designs requiring extended thermal cycling margin | Select when board layout allows larger BGA and thermal dissipation is prioritized over space-constrained routing |
| S29GL01GT11DHN023 | Identical package but rated for –40°C to +85°C industrial grade only - no AEC-Q100 qualification | Suitable for cost-sensitive non-automotive embedded systems without extended temperature needs | Choose for non-automotive applications where Grade 2 thermal performance is unnecessary and BOM cost reduction is critical |
Compared with S29GL01GT12DHV023 and S29GL01GT11DHN023, the S29GL01GT12DHN023 uniquely balances compact 9 mm × 9 mm LAE BGA packaging with AEC-Q100 Grade 2 qualification-enabling automotive integration without sacrificing PCB area or thermal derating headroom.
Availability
S29GL01GT12DHN023 is available at Aetrix Electronics and suitable for automotive engine control units, industrial programmable logic controllers, and medical imaging system boot ROMs requiring stable component supply across multi-year production cycles.
Supply support for S29GL01GT12DHN023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and non-volatile memory solutions for industrial and safety-critical applications.
The GL-T family targets high-reliability embedded systems needing XIP-capable parallel NOR flash with integrated ECC, sector protection, and AEC-Q100 qualification-designed specifically for automotive and industrial firmware storage.
FAQ
What is the purpose of the SSR (One-Time Programmable) array in S29GL01GT12DHN023?
The 2048-byte SSR array provides four lockable regions (SSR0–SSR3) for storing immutable security-critical data. SSR0 is factory-locked and holds boot ROM signature keys; SSR3 supports password-based read protection for calibration parameters. This structure enforces hardware-rooted trust without requiring external secure elements.
Does S29GL01GT12DHN023 require an external VPP voltage for programming?
No. The device uses single-supply operation: VCC (2.7 V to 3.6 V) powers both core logic and programming/erase functions. There is no VPP pin or external high-voltage requirement-simplifying power design and eliminating charge pump complexity in host systems.
How does the Versatile I/O (VIO) feature benefit system integration?
VIO accepts 1.65 V to VCC, allowing direct interface with 1.8 V or 3.3 V host processors without level-shifting circuitry. This reduces BOM count, PCB area, and signal integrity risk-particularly valuable in space-constrained automotive modules and industrial edge controllers.
Can S29GL01GT12DHN023 be used in synchronous interface modes?
No. It is strictly asynchronous: all timing is governed by CE#, OE#, and WE# control signals with no clock input. The device does not support QSPI, DDR, or other synchronous protocols-its architecture is optimized for legacy parallel bus microcontrollers and FPGA-based boot interfaces.
S29GL01GT12DHN023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 120 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL01GT12DHN023 FAQ
1.How can I place an order for S29GL01GT12DHN023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GT12DHN023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GT12DHN023 reliable?
The price and inventory of S29GL01GT12DHN023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GT12DHN023 is usually 5 days.
3.What payment methods are accepted for S29GL01GT12DHN023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GT12DHN023 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GT12DHN023?
S29GL01GT12DHN023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GT12DHN023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GT12DHN023?
For technical support, including S29GL01GT12DHN023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GT12DHN023 requirements.
6.How does Aetrix verify that S29GL01GT12DHN023 is sourced from the original manufacturer or authorized distributors?
All S29GL01GT12DHN023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GT12DHN023 meets industry standards.
7.What is the process for return or replacement of S29GL01GT12DHN023?
All S29GL01GT12DHN023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GT12DHN023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GT12DHN023 part is unused and in its original packaging.
Return procedure for S29GL01GT12DHN023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL01GT12DHN023 Tags
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