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Infineon Technologies S29GL01GT12DHVV20
- Part No.:
- S29GL01GT12DHVV20
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL01GT12DHVV20.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:306
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Product details
Overview
S29GL01GT12DHVV20 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, internal hardware ECC for single-bit correction, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C). It is used in boot code storage for network routers requiring fast XIP execution and reliable firmware retention.
For engineers reviewing the S29GL01GT12DHVV20 datasheet, S29GL01GT12DHVV20 pinout, S29GL01GT12DHVV20 application, or S29GL01GT12DHVV20 equivalent, key selection criteria include parallel ×16 bus interface, 100,000 program/erase cycles, OTP array with four lockable SSR regions, CFI compliance, and support for suspend/resume during embedded operations.
Technical Context
This device implements an asynchronous parallel interface with byte/word boundary addressing and supports both 8-bit and 16-bit data bus configurations. Its embedded algorithm controller (EAC) manages program, erase, and status monitoring without external intervention, while the versatile I/O feature allows VIO from 1.65 V to VCC for mixed-voltage system interfacing.
The flash architecture includes dedicated address space overlays for Device ID/CFI, Status Register, Data Polling, SSR (OTP), and ECC status. Sector protection uses volatile and non-volatile methods per 128-KB sector, and hardware reset ensures deterministic power-on behavior aligned with JEDEC JESD22-A102 standards.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 1 Gb (128 MB) - sufficient for full boot image + firmware + configuration tables in edge gateway applications |
| Interface type | Parallel ×16 asynchronous - enables direct CPU memory-mapped access without translation logic |
| Random access time | 100 ns at –40°C to +85°C - meets real-time boot latency requirements for industrial PLCs |
| Write buffer size | 512 bytes - reduces effective programming time by up to 4× vs. single-word writes |
| ECC capability | Internal hardware single-bit error correction - eliminates need for external ECC logic in safety-critical systems |
| Endurance | 100,000 program/erase cycles - supports field firmware updates over 10+ years of operation |
| Data retention | 20 years at +85°C - ensures long-term reliability in unattended infrastructure equipment |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-141AC footprint with gull-wing leads.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address inputs | 22-bit address bus supporting full 128 MB linear addressing with byte/word alignment |
| DQ0–DQ15 | Data I/O (×16) | Bidirectional 16-bit data path; operates in 8-bit mode when DQ15 is not used as byte enable |
| CE# | Chip enable | Active-low chip select enabling memory-mapped access; tCE = 100 ns max at industrial temp |
| OE# | Output enable | Controls data bus output timing; tOE = 25 ns max for synchronous read handshaking |
| WE# | Write enable | Initiates write/program cycles; latches address and data on falling edge |
| RY/BY# | Ready/Busy indicator | Open-drain active-low signal indicating ongoing embedded operation completion status |
| RESET# | Hardware reset | Asynchronous reset that forces device into known state; meets JEDEC JESD22-A102 cold-start timing |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O voltage range | VIO supports 1.65 V to VCC - enables direct interfacing with 1.8 V, 2.5 V, or 3.3 V host processors without level shifters |
| Uniform 128-KB sectors | 1024 independent sectors - allows granular firmware partitioning (e.g., bootloader, OS, app, config) |
| Separate 2048-byte OTP array | Four lockable SSR regions (SSR0–SSR3), with SSR0 factory-locked and SSR3 password-protected - secures cryptographic keys and calibration data |
| Common Flash Interface (CFI) | Standardized parameter table accessible via read commands - enables automatic driver detection and configuration in Linux MTD subsystems |
| Suspend/Resume capability | Interrupts erase or program operations to service high-priority reads - maintains system responsiveness during background updates |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot loader, real-time OS kernel, and motion control firmware in programmable logic controllers deployed in factory automation. IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable instruction fetch with ≤100 ns latency to meet deterministic scan cycle deadlines. Use Value: 20-year data retention and 100,000-cycle endurance ensure firmware integrity across 15+ years of unattended operation without refresh. | Use Scenario: Holding certified boot code and sensor fusion firmware in automotive camera ECU modules compliant with AEC-Q100 Grade 2 (–40°C to +105°C). IC Role / Device Role / Timing Role: Safety-critical boot memory with hardware ECC and OTP-secured calibration data for ISO 26262 ASIL-B systems. Use Value: Internal ECC eliminates soft-error-induced boot failures; SSR3 password protection prevents unauthorized firmware modification. |
| Telecom Edge Router Boot Image | Medical Imaging System Configuration |
Use Scenario: Hosting primary and fallback boot images, FPGA configuration bitstreams, and packet processing microcode in carrier-grade edge routers. IC Role / Device Role / Timing Role: Dual-image parallel flash enabling atomic firmware updates with zero-downtime failover via sector-level erase granularity. Use Value: 512-byte write buffer accelerates field upgrades; CFI compatibility simplifies integration with U-Boot and OpenWrt toolchains. | Use Scenario: Storing DICOM conformance profiles, display calibration LUTs, and regulatory certification metadata in FDA-cleared MRI console systems. IC Role / Device Role / Timing Role: Secure, tamper-resistant configuration store with factory-locked SSR0 and password-protected SSR3 for audit-trail integrity. Use Value: OTP lockability satisfies IEC 62304 software lifecycle requirements; 128-KB sector erase enables safe profile versioning without full reflash. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GT12FHIV20 | Same die, 64-ball LAE BGA (9 mm × 9 mm) package - no TSOP footprint compatibility | Targeted at space-constrained designs where PCB area is prioritized over manual assembly or socketing | Select when board layout requires BGA miniaturization and reflow-only assembly is acceptable |
| MX29GL128FTEI-90G | 128-MB (1 Gb) Macronix part with 90 ns random access, no built-in ECC, CFI-compliant but lacks SSR OTP array | Lower-cost alternative where external ECC handling and simplified security model are acceptable | Select only if system-level ECC is already implemented and OTP-based key storage is not required |
Compared with S29GL01GT12FHIV20, this TSOP variant offers easier prototyping and repairability; versus MX29GL128FTEI-90G, it delivers integrated ECC and hardware-secured OTP-critical for safety- and security-sensitive deployments.
Availability
S29GL01GT12DHVV20 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, telecom edge router boot image hosting, and automotive ADAS boot memory requiring stable component supply across extended product lifecycles.
Supply support for S29GL01GT12DHVV20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global R&D centers and ISO/TS 16949-certified wafer fabs.
The GL-T family targets high-reliability embedded systems needing fast XIP performance and robust firmware storage, combining MIRRORBIT™ density advantages with industrial and automotive qualification rigor.
FAQ
What is the maximum operating temperature range for S29GL01GT12DHVV20?
This part is rated for the industrial temperature range of –40°C to +85°C, as confirmed in the Infineon datasheet revision *M. It does not support the +105°C or +125°C grades - those require different suffixes (e.g., 'I' for Industrial Plus or 'E' for Extended). The thermal specifications, including standby current (100 μA) and AC timing, are validated only within this range.
Does S29GL01GT12DHVV20 support both ×8 and ×16 data bus modes?
Yes, it supports configurable ×8/×16 operation via hardware pin strapping and command set. In ×16 mode, DQ0–DQ15 carry full word data; in ×8 mode, DQ0–DQ7 are used with DQ15 acting as BYTE# control. Address lines remain identical in both modes, and all timing parameters (tACC, tPACC) apply to both configurations as specified in Table 2 of the datasheet.
How is the 2048-byte OTP array structured and secured?
The OTP array contains four 512-byte lockable regions (SSR0–SSR3). SSR0 is permanently locked at factory; SSR1 and SSR2 are user-lockable via command sequence; SSR3 supports password-based read protection requiring a 16-byte key. Once locked, regions cannot be unlocked - ensuring irreversible protection of calibration data, keys, or certificates per IEC 62443-3-3 Annex F guidance.
Can S29GL01GT12DHVV20 be used in systems requiring AEC-Q100 qualification?
No - this specific part number (S29GL01GT12DHVV20) carries the 'V' suffix denoting industrial grade, not automotive. AEC-Q100 qualified variants exist (e.g., S29GL01GT12DHIV20 for Grade 3 or S29GL01GT12DHIW20 for Grade 2), which undergo additional stress testing and have automotive-specific lot traceability and PPAP documentation. Using this part in automotive applications violates qualification requirements.
S29GL01GT12DHVV20 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 120 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL01GT12DHVV20 FAQ
1.How can I place an order for S29GL01GT12DHVV20 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GT12DHVV20 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GT12DHVV20 reliable?
The price and inventory of S29GL01GT12DHVV20 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GT12DHVV20 is usually 5 days.
3.What payment methods are accepted for S29GL01GT12DHVV20?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GT12DHVV20 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GT12DHVV20?
S29GL01GT12DHVV20 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GT12DHVV20 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GT12DHVV20?
For technical support, including S29GL01GT12DHVV20 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GT12DHVV20 requirements.
6.How does Aetrix verify that S29GL01GT12DHVV20 is sourced from the original manufacturer or authorized distributors?
All S29GL01GT12DHVV20 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GT12DHVV20 meets industry standards.
7.What is the process for return or replacement of S29GL01GT12DHVV20?
All S29GL01GT12DHVV20 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GT12DHVV20, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GT12DHVV20 part is unused and in its original packaging.
Return procedure for S29GL01GT12DHVV20:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL01GT12DHVV20 Tags
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M24C02-WMN6TP
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