My Inquiry
My Account
Infineon Technologies S29GL01GT12TFM020
- Part No.:
- S29GL01GT12TFM020
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL01GT12TFM020.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:4,522
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S29GL01GT12TFM020 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, hardware ECC for single-bit correction, and uniform 128-KB sector erase-designed for boot code storage in industrial microcontroller-based systems requiring high reliability and fast XIP execution.
For engineers reviewing the S29GL01GT12TFM020 datasheet, S29GL01GT12TFM020 pinout, S29GL01GT12TFM020 application, or S29GL01GT12TFM020 equivalent, key selection criteria include its 128-KB uniform sector architecture, Versatile I/O support (1.65 V–VCC), AEC-Q100 Grade 2 qualification (–40°C to +105°C), and CFI-compliant interface for firmware update compatibility.
Technical Context
This device implements an asynchronous parallel interface with ×8/×16 data bus configuration and supports byte/word boundary addressing only. Its embedded algorithm controller (EAC) manages program, erase, suspend/resume, and automatic ECC operations without host CPU intervention.
The status monitoring uses three concurrent methods: Status Register polling, Data Polling (DQ7), and RY/BY# pin assertion-enabling deterministic timing control in real-time boot loaders and firmware recovery sequences.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 1 Gb (128 MB) - sufficient for full bootloader + secure firmware image in space-constrained industrial controllers |
| Random access time | 100 ns at –40°C to +85°C - enables sub-10 MHz CPU clock XIP execution without wait states |
| Page access time | 15 ns - accelerates sequential instruction fetch during cache line fills |
| Write buffer size | 512 bytes - reduces effective programming time by >3× vs. single-word writes in firmware field updates |
| ECC capability | Internal hardware single-bit error correction - maintains data integrity over 20-year retention without software overhead |
| Endurance | 100,000 program/erase cycles - supports frequent OTA firmware patching in edge gateway applications |
| Operating temperature | –40°C to +105°C (AEC-Q100 Grade 2) - qualified for under-hood automotive ECUs and industrial PLCs |
Pinout & Package
Package: 64-ball LAE fortified BGA (9 mm × 9 mm), RoHS-compliant, lead-free, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 | Address inputs | 24-bit address bus supporting full 128-MB linear addressing with byte/word boundary alignment only |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional bus; operates in ×8 or ×16 mode per configuration; supports Versatile I/O (1.65 V–VCC) |
| CE# | Chip enable | Active-low chip select; tCE = 100 ns max - defines minimum cycle time in multi-device parallel configurations |
| OE# | Output enable | Active-low read strobe; tOE = 25 ns max - controls data valid window relative to address setup |
| WE# | Write enable | Active-low write strobe; initiates command latching and embedded program/erase sequences |
| RY/BY# | Ready/Busy output | Open-drain status indicator; asserts low during internal operations - enables hardware flow control without polling |
| VCC | Core supply | 2.7 V–3.6 V single supply for read/program/erase - eliminates need for separate VPP or charge pumps |
| VIO | I/O supply | 1.65 V–VCC - allows direct interfacing with 1.8 V, 2.5 V, or 3.3 V logic without level shifters |
Key Features
| Feature | Design Value |
|---|---|
| Hardware ECC | Single-bit error correction implemented in silicon - eliminates software ECC overhead and guarantees boot code integrity on power-up |
| Suspend/Resume | Interruptible program/erase operations - enables real-time response to critical interrupts during firmware updates |
| Advanced sector protection | Volatile and non-volatile lock per 128-KB sector - prevents accidental overwrite of bootloader region while allowing runtime reprogramming of application sectors |
| OTP array | 2048-byte one-time programmable space with four lockable regions (SSR0–SSR3), factory-locked SSR0 - stores immutable security keys or calibration data |
| CFI compliance | Standard Common Flash Interface parameter table - ensures interoperability with generic flash drivers and UEFI firmware implementations |
Applications
| Industrial PLC Firmware Storage | Automotive Engine Control Unit (ECU) |
|---|---|
Use Scenario: Storing boot loader and real-time control firmware in programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP execution with ≤100 ns access latency to meet deterministic scan cycle timing. Use Value: 128-KB uniform sectors enable atomic firmware updates; 100,000-cycle endurance supports quarterly field upgrades over 15-year product life. | Use Scenario: Holding calibrated engine maps and safety-critical boot code in gasoline/diesel ECUs operating under hood temperatures up to +105°C. IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 qualified parallel NOR flash serving as primary boot device with hardware ECC for ASIL-B compliance. Use Value: Built-in single-bit ECC and 20-year data retention ensure firmware integrity across vehicle lifetime without periodic refresh. |
| Medical Imaging System Boot Memory | Telecom Base Station Configuration Storage |
Use Scenario: Hosting FPGA configuration bitstreams and diagnostic firmware in portable ultrasound and MRI subsystems requiring high reliability. IC Role / Device Role / Timing Role: High-density (128 MB) parallel flash enabling fast FPGA reconfiguration and dual-image fail-safe boot. Use Value: 512-byte write buffer cuts firmware update time by 70% vs. legacy NOR devices, reducing service downtime during calibration updates. | Use Scenario: Storing baseband processor configuration tables and protocol stack parameters in 4G/5G macrocell base stations with remote management. IC Role / Device Role / Timing Role: CFI-compliant firmware storage enabling vendor-agnostic driver integration and field-upgradable parameter sets. Use Value: Versatile I/O (1.65 V–VCC) allows direct connection to 1.8 V baseband SoCs, eliminating level-shifter components and PCB area. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GT12TFI020 | Same die, TSOP-56 package (not BGA); no AEC-Q100 qualification | Limited to commercial/industrial ambient (–40°C to +85°C); unsuitable for under-hood automotive use | Select when board layout requires through-hole or standard surface-mount footprint and automotive qualification is not required |
| MX29GL128FPTI-90G | 128 MB, 90 ns access, no built-in ECC, 55 nm process, different command set | Lacks hardware ECC and suspend/resume; requires external error handling and longer update windows | Select only if legacy system design mandates Macronix command compatibility and ECC is managed in software |
Compared with S29GL01GT12TFM020, the TSOP variant trades automotive qualification and compact BGA for easier prototyping, while the Macronix alternative sacrifices ECC and advanced command features for cost-sensitive, non-safety-critical applications.
Availability
S29GL01GT12TFM020 is available at Aetrix Electronics and suitable for industrial PLCs, automotive ECUs, medical imaging subsystems, and telecom base station designs requiring stable component supply, long-term lifecycle assurance, and AEC-Q100 Grade 2 compliance.
Supply support for S29GL01GT12TFM020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with leadership in industrial and automotive-grade non-volatile memory solutions.
The GL-T family targets high-reliability embedded systems requiring fast XIP execution, robust data retention, and automotive qualification-designed specifically for boot code storage where deterministic timing and firmware integrity are critical.
FAQ
What is the maximum operating temperature range for S29GL01GT12TFM020?
The S29GL01GT12TFM020 is rated for –40°C to +105°C and qualified to AEC-Q100 Grade 2. This rating is verified per Infineon's datasheet Rev. *M (2022-07-25), Section "Temperature range / grade", and applies to all electrical and timing specifications listed under that grade. No derating is required within this range.
Does this part support both ×8 and ×16 data bus modes?
Yes, S29GL01GT12TFM020 supports configurable ×8 or ×16 operation via hardware pin strapping (BYTE# input). In ×16 mode, DQ15–DQ0 transfer 16-bit words; in ×8 mode, DQ7–DQ0 transfer bytes with DQ15–DQ8 unused. Mode selection is determined at power-up and remains fixed until reset.
Is hardware ECC enabled by default, and can it be disabled?
Hardware ECC is always active during read operations and cannot be disabled. The ECC logic operates transparently in the data path: single-bit errors are corrected automatically, and uncorrectable multi-bit errors trigger the Status Register's ECC Error bit (SR[6]). No host initialization or register writes are needed to activate ECC.
What package type does S29GL01GT12TFM020 use, and what is its ball pitch?
S29GL01GT12TFM020 uses a 64-ball LAE fortified BGA package measuring 9 mm × 9 mm with 0.8 mm ball pitch. This is confirmed in Infineon's datasheet Rev. *M, Section "12.2 64-ball FBGA", and distinguishes it from the 64-ball LAA (13 mm × 11 mm) and 56-ball VBU variants.
S29GL01GT12TFM020 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 120 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL01GT12TFM020 FAQ
1.How can I place an order for S29GL01GT12TFM020 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GT12TFM020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GT12TFM020 reliable?
The price and inventory of S29GL01GT12TFM020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GT12TFM020 is usually 5 days.
3.What payment methods are accepted for S29GL01GT12TFM020?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GT12TFM020 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GT12TFM020?
S29GL01GT12TFM020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GT12TFM020 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GT12TFM020?
For technical support, including S29GL01GT12TFM020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GT12TFM020 requirements.
6.How does Aetrix verify that S29GL01GT12TFM020 is sourced from the original manufacturer or authorized distributors?
All S29GL01GT12TFM020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GT12TFM020 meets industry standards.
7.What is the process for return or replacement of S29GL01GT12TFM020?
All S29GL01GT12TFM020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GT12TFM020, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GT12TFM020 part is unused and in its original packaging.
Return procedure for S29GL01GT12TFM020:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL01GT12TFM020 Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
