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Infineon Technologies S29GL01GT12TFM023
- Part No.:
- S29GL01GT12TFM023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL01GT12TFM023.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:2,218
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Product details
Overview
S29GL01GT12TFM023 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory with MIRRORBIT™ technology, designed for embedded code storage and execution-in-place (XIP) applications. It operates from a single 2.7–3.6 V supply, delivers 100 ns random access time and 15 ns page access time, and integrates hardware ECC for single-bit error correction. Used in industrial control firmware storage where deterministic boot latency and long-term data retention are critical.
For engineers reviewing the S29GL01GT12TFM023 datasheet, S29GL01GT12TFM023 pinout, S29GL01GT12TFM023 application, or S29GL01GT12TFM023 equivalent, key selection criteria include verified 128-KB uniform sector erase granularity, OTP array configuration with factory-locked SSR0, and compatibility with legacy parallel bus microcontrollers requiring CFI-compliant command sets.
Technical Context
This device implements an asynchronous parallel interface with ×8/×16 configurable data bus and supports byte/word boundary addressing only. Its embedded algorithm controller (EAC) manages all program/erase operations-including 512-byte buffer programming and suspend/resume-without host CPU intervention.
The internal hardware ECC engine corrects single-bit errors on-the-fly during read operations and reports uncorrectable multi-bit errors via status register flags. Sector protection uses both volatile (lock bits) and non-volatile (ASP) methods, with four 2048-byte OTP regions-SSR0 factory-locked, SSR3 password-protected.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 1 Gb (128 MB) organized as 16,777,216 × 8 or 8,388,608 × 16 |
| Read access time (tACC) | 100 ns at –40°C to +85°C; determines minimum instruction fetch interval in XIP mode |
| Page access time (tPACC) | 15 ns; enables burst reads of up to 32 bytes with minimal latency overhead |
| Programming buffer size | 512 bytes; allows single-command write of full page, reducing host software overhead |
| ECC capability | Single-bit error correction per 512-byte sector; eliminates need for external error-handling logic |
| Sector size | Uniform 128 KB sectors; simplifies firmware partitioning and field update management |
| Data retention | 20 years at +85°C; validated for industrial lifecycle requirements without refresh |
| Endurance | 100,000 program/erase cycles per sector; supports frequent firmware updates in edge devices |
Pinout & Package
Package: 64-ball LAE fortified BGA (9 mm × 9 mm), RoHS-compliant, lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A22 | Address inputs | 23-bit address bus supporting full 128-MB linear space; A0 selects byte/word mode when x16 configured |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional bus; operates in ×8 or ×16 mode per configuration pins (BYTE#) |
| CE#, OE#, WE# | Chip Enable, Output Enable, Write Enable | Standard asynchronous control signals; CE# active-low enables device; OE#/WE# control read/write direction and timing |
| RY/BY# | Ready/Busy output | Open-drain status indicator; low during embedded operations (program/erase); used for polling instead of status register reads |
| VCC, VIO | Core and I/O supplies | Separate 2.7–3.6 V VCC and 1.65–VCC VIO allow interfacing with mixed-voltage SoCs |
| RESET# | Hardware reset input | Asynchronous active-low signal that aborts ongoing operations and returns device to read mode |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O voltage range | VIO supports 1.65 V to VCC, enabling direct connection to 1.8 V, 2.5 V, or 3.3 V controllers without level shifters |
| 512-byte programming buffer | Reduces effective programming time by >60% vs. single-word writes; critical for fast firmware patching |
| Hardware ECC engine | Corrects single-bit errors transparently during read; eliminates software ECC overhead and latency penalty |
| Four OTP lockable regions | SSR0–SSR3 provide secure storage for keys, calibration data, or bootloader code; SSR0 permanently locked at factory |
| CFI parameter table | Enables automatic detection and configuration by BIOS/bootloader; eliminates hard-coded timing assumptions |
Applications
| Industrial PLC Firmware Storage | Automotive Instrument Cluster Boot Memory |
|---|---|
Use Scenario: Storing real-time control firmware in programmable logic controllers operating continuously at 85°C ambient. IC Role / Device Role / Timing Role: Non-volatile XIP code storage with deterministic 100 ns read access to support hard real-time task scheduling. Use Value: 20-year data retention ensures firmware integrity over full product lifecycle without recalibration or refresh. | Use Scenario: Holding boot code and GUI assets in automotive digital instrument clusters qualified to AEC-Q100 Grade 2 (–40°C to +105°C). IC Role / Device Role / Timing Role: Primary boot memory mapped directly into MCU address space; leverages CFI for auto-negotiated timing setup. Use Value: Hardware ECC prevents silent corruption of safety-critical boot images under EMI-rich vehicle environments. |
| Medical Imaging System Configuration | Telecom Baseband Processor Code Storage |
Use Scenario: Retaining calibration tables and device-specific configuration parameters in portable ultrasound units. IC Role / Device Role / Timing Role: Secure OTP region (SSR3) stores encrypted calibration coefficients; password protection prevents unauthorized modification. Use Value: Factory-locked SSR0 isolates bootloader from field updates, ensuring chain-of-trust integrity. | Use Scenario: Hosting baseband firmware in 5G small-cell radios requiring rapid field upgrades via JTAG or PCIe interfaces. IC Role / Device Role / Timing Role: High-speed 512-byte buffer programming enables sub-second firmware patches during maintenance windows. Use Value: Uniform 128-KB sector erase allows atomic firmware version swaps without partial-write corruption risk. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GT12TFI020 | Same die, 56-pin TSOP package; no BGA mechanical footprint compatibility | Limited to PCBs with TSOP land pattern; lacks LAE BGA thermal performance for high-power density layouts | Select for cost-sensitive, low-density board designs with existing TSOP routing |
| MX29GL128FPTI-90G | 128 MB density, 90 ns tACC, no integrated ECC, no OTP array | Requires external error handling and separate secure storage for keys/calibration | Choose only if legacy system lacks ECC-aware firmware and has no security requirements |
Compared with S29GL01GT12TFM023, the TSOP variant trades BGA thermal/mechanical advantages for lower assembly cost, while the Macronix part omits ECC and OTP-increasing firmware validation burden and eliminating hardware-enforced security partitions.
Availability
S29GL01GT12TFM023 is available at Aetrix Electronics and suitable for industrial control systems, automotive instrument clusters, and medical imaging equipment requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for S29GL01GT12TFM023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing infrastructure.
The GL-T family targets high-reliability embedded systems needing deterministic XIP performance, long data retention, and hardware-assisted security-designed specifically for industrial, automotive, and medical applications demanding AEC-Q100 or extended temperature compliance.
FAQ
What is the purpose of the SSR0–SSR3 OTP regions?
SSR0–SSR3 are four independent 2048-byte one-time-programmable arrays. SSR0 is permanently locked at factory and typically holds immutable bootloader code. SSR3 supports password-based read protection for sensitive calibration or cryptographic keys. Each region can be individually locked after programming to prevent overwrite or unauthorized access.
Does S29GL01GT12TFM023 support both ×8 and ×16 data bus modes?
Yes, it supports configurable ×8 or ×16 operation via the BYTE# pin. When BYTE# is low, the device operates in ×16 mode using DQ0–DQ15; when high, it operates in ×8 mode using DQ0–DQ7 only. Address lines remain identical in both modes, with A0 selecting byte alignment in ×16 mode.
How does the hardware ECC function during normal read operations?
The ECC engine automatically checks each 512-byte sector during every read access. If a single-bit error is detected, it is corrected in real time before data is presented on DQ pins. Uncorrectable multi-bit errors set the ECC error flag in the status register and assert RY/BY# low, allowing host firmware to initiate recovery procedures.
Can S29GL01GT12TFM023 be used in automotive applications requiring AEC-Q100 qualification?
Yes-this specific part number (S29GL01GT12TFM023) is rated for Industrial Plus (–40°C to +105°C) and is AEC-Q100 Grade 2 qualified. It meets automotive reliability requirements including HTOL, ESD, and temperature cycling tests, making it suitable for instrument clusters, ADAS domain controllers, and body electronics modules.
S29GL01GT12TFM023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 120 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL01GT12TFM023 FAQ
1.How can I place an order for S29GL01GT12TFM023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GT12TFM023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GT12TFM023 reliable?
The price and inventory of S29GL01GT12TFM023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GT12TFM023 is usually 5 days.
3.What payment methods are accepted for S29GL01GT12TFM023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GT12TFM023 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GT12TFM023?
S29GL01GT12TFM023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GT12TFM023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GT12TFM023?
For technical support, including S29GL01GT12TFM023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GT12TFM023 requirements.
6.How does Aetrix verify that S29GL01GT12TFM023 is sourced from the original manufacturer or authorized distributors?
All S29GL01GT12TFM023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GT12TFM023 meets industry standards.
7.What is the process for return or replacement of S29GL01GT12TFM023?
All S29GL01GT12TFM023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GT12TFM023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GT12TFM023 part is unused and in its original packaging.
Return procedure for S29GL01GT12TFM023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL01GT12TFM023 Tags
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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology
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AT21CS01-STUM10-T
Microchip Technology
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AT24C02C-SSHM-T
Microchip Technology
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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics
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AT24CS02-SSHM-T
Microchip Technology
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93LC46BT-I/OT
Microchip Technology
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AT24C04C-SSHM-T
Microchip Technology
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24LC01BT-I/SN
Microchip Technology
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24AA02UIDT-I/OT
Microchip Technology
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AT24C08C-STUM-T
Microchip Technology
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